G01L19/0061

Pressure-sensitive chip, pressure sensor, and pressure monitoring system

A pressure-sensitive chip, a pressure sensor, and a pressure monitoring system. In an embodiment, a pressure-sensitive chip and a signal processing module are packaged to form a pressure sensor. The pressure sensor and a display instrument are connected to form a pressure monitoring system. A pressure-sensitive chip is a ceramic body made of eight green ceramic sheets by stacking and sintering, and includes two capacitors. In another embodiment, a pressure signal of a measurement area is obtained by a method including the following steps: sensing a pressure in a measurement area by the pressure-sensitive chip; generating a capacitance signal by the pressure-sensitive chip; converting the capacitance signal to a voltage signal by the signal processing module; and converting the voltage signal into the pressure signal by the display instrument.

SENSOR PACKAGES AND METHODS FOR PRODUCING SENSOR PACKAGES
20210300749 · 2021-09-30 ·

A sensor package comprises a MEMS sensor chip, a cover arranged over a first main surface of the MEMS sensor chip, said cover being fabricated from a mold compound, and an electrical through contact extending through the cover and to electrically couple the sensor package to a circuit board arranged over the cover.

Device for measuring and system for measuring a pressure comprising a pressure sensor

The invention relates to a pressure measurement device (1) comprising: a pressure sensor (3) for securing to an element having a pressure that is to be measured; and a stationary portion (5) facing a path of the sensor so as to be in resonant high frequency AC electrical relationship with the sensor in order to power the sensor and in order to receive measurements acquired by the sensor. The invention also relates to a measurement system including such a measurement device.

HIGH RANGE DIFFERENTIAL PRESSURE SENSOR

A process pressure transmitter includes transmitter electronics disposed within a housing. The transmitter electronics includes a communications circuit coupled to a processing system and an analog to digital converter disposed within the housing. The analog to digital converter electrically is coupled to the transmitter electronics. A pressure sensor comprises a cell body defining an interior cavity. A deflectable diaphragm comprising a second material is coupled to the cell body and separates the interior cavity into a first cavity and a second cavity. The deflectable diaphragm includes a groove region located around a periphery of the deflectable diaphragm. The first and second cavities each contain a dielectric fill-fluid, each of the fill fluids adapted to receive a pressure and exert a corresponding force on the diaphragm, and the diaphragm is deflectable in response to differences in the pressures received by the fill-fluids in the first and second cavities. A first electrode is capacitively coupled to the diaphragm to form a first variable capacitor and a first lead wire electrically connects to the first electrode. A second electrode is capacitively coupled to the diaphragm to form a second capacitor and a second lead wire is electrically coupled to the second electrode. The first and second lead wires are electrically coupled to the analog to digital converter.

SYSTEM AND METHOD FOR DETECTING LEAKS IN A SEALED COOLANT SYSTEM
20210270690 · 2021-09-02 ·

A sealed cooling system includes a coolant tank having a liquid space configured to hold liquid coolant, and a gas space configured to hold gas. A temperature sensor detects the temperature of the liquid coolant. A pressure sensor detects the pressure in the coolant tank. A processor compares the pressure in the coolant tank to predicted pressure in the coolant tank as a function of liquid coolant temperature. The processor determines and outputs a signal indicative of a leak in the sealed cooling system if the pressure in the coolant tank deviates from the predicted pressure in the coolant tank according to predetermined criteria.

PRESSURE SENSOR

A sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1), with a lower surface (24a) of a first retaining member (24-2) serving as a joint surface, in such a manner as to allow an enclosing chamber (23) (including a pressure receiving chamber (23-1) and a pressure guiding passage (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) to communicate with a pressure guiding hole (24-2b) in the first retaining member (24-2). In this state, a narrow tube (31) made of stainless steel is passed through the pressure guiding passage (23-2) in the base body (21-1) and inserted and secured in the pressure guiding hole (24-2b) in the first retaining member (24-2). This reduces the pressure receiving area of a pressure guiding passage that guides a pressure (P1) of a measured fluid to a first surface (24-1a) of a sensor diaphragm (24-1), suppresses force applied in the direction of separating the joint between the sensor chip (24) and the base body (21-1), and makes it possible to use a soft adhesive.

SENSOR APPARATUS HAVING A CRIMPED HOUSING AND A METHOD OF ASSEMBLING THE SAME
20210148778 · 2021-05-20 ·

A sensor apparatus having a crimped housing and a method of assembling a sensor apparatus having a crimped housing are disclosed. The sensor apparatus comprises a sensor port, a tubular thin-walled housing coupled to the sensor port and comprising a crimping portion, a base portion, and a step feature that is formed in the housing, the step feature partitioning the crimping portion from the base portion, sensor components disposed within the interior of the base portion of the housing, and an electrical connector coupled the housing and comprising leads electrically coupled to the sensor components and a connector flange, wherein a rim of the crimping portion of the housing is crimped onto the connector flange such that the electrical connector is retained in the housing. Dimples, created by protrusions on the crimp dye, on both housing rim and connector flange assure the housing rim hold the connector in rotation direction

METHOD FOR DETECTION OF FLUID FLOW
20210101165 · 2021-04-08 ·

A spray gun system includes a spray gun, a pressure sensor, and a controller. The spray gun is configured to distribute a mixture of air and fluid onto a working surface. The pressure sensor is fluidly connected to the spray gun and is configured to measure fluid pressure within the spray gun system. The controller is electrically connected to the pressure sensor and is configured to calculate pressure error based on the measured pressure and a pressure set-point. The controller is further configured to increment a counter if the pressure error exceeds an error threshold, perform a flow control to adjust the pressure set-point to achieve a target flow rate in response to determining that the increment counter exceeds a count threshold, and perform a pressure control loop to adjust the fluid pressure within the spray gun system to achieve the pressure set-point.

Fluid pressure sensor
10969288 · 2021-04-06 · ·

A sensor includes a port body which defines an axial passage for receiving fluid. An electrical connector extends through an opening in the port body near a crimp portion opposite the axial passage and forms an upper seal with the port body. Within the interior of the port body, a support ring and base cover form a cavity which retains a sensing element. The sensing element is exposed to the fluid within the axial passage and determines the pressure. An annular seal is retained by the base cover. The crimp portion of the port body is crimped to provide an upper seal and apply a force on the components within the interior, pinching the annular seal between the sensing element and the base of the port body to create a lower seal.

Sensor and supercapacitor based on graphene polypyrrole 3D porous structure, and integrated device including the same

Disclosed is a sensor based on a graphene polypyrrole 3-dimensional (3D) porous structure, the sensor comprising: the graphene polypyrrole 3D porous structure, wherein the graphene polypyrrole 3D porous structure is prepared by growing graphene on a nickel 3D porous structure, growing polypyrrole on a graphene-grown nickel 3D porous structure, and then coating polydimethylsiloxane (PDMS) on a graphene polypyrrole grown structure; and electrodes respectively disposed on top and bottom faces of the graphene polypyrrole 3D porous structure.