A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

In some embodiments, a sensor is provided. The sensor includes a microelectromechanical systems (MEMS) substrate disposed over an integrated chip (IC), where the IC defines a lower portion of a first cavity and a lower portion of a second cavity, and where the first cavity has a first operating pressure different than an operating pressure of the second cavity. A cap substrate is disposed over the MEMS substrate, where a first pair of sidewalls of the cap substrate partially define an upper portion of the first cavity, and a second pair of sidewalls of the cap substrate partially define an upper portion of the second cavity. A sensor area comprising a movable portion of the MEMS substrate and a dummy area comprising a fixed portion of the MEMS substrate are both disposed in the first cavity. A pressure enhancement structure is disposed in the dummy area.

A pressure sensor includes a housing with an opening, a pressure sensitive body inside the housing, a waterproof gel to seal the pressure sensitive body inside the housing, and cover portions on a surface of the gel. The cover portions are non-adhesive and do not couple to each other.

A pressure sensor includes a housing with an opening, a pressure sensitive body inside the housing, a waterproof gel to seal the pressure sensitive body inside the housing, and cover portions on a surface of the gel. The cover portions are non-adhesive and do not couple to each other.

In an embodiment, a pressure sensor system includes a pressure sensor element with a flexible plate, wherein the pressure sensor element is a piezoresistive sensor element and a support element on which the pressure sensor element is arranged, wherein a flow channel configured to supply a medium to the flexible plate runs in the support element, wherein the flow channel has at least one sub-section, a longitudinal direction of which running perpendicularly below the flexible plate, and wherein a channel cross section of the at least one sub-section of the flow channel is at no point within the sub-section of the flow channel smaller than an area of the flexible plate.

In an embodiment, a pressure sensor system includes a pressure sensor element with a flexible plate, wherein the pressure sensor element is a piezoresistive sensor element and a support element on which the pressure sensor element is arranged, wherein a flow channel configured to supply a medium to the flexible plate runs in the support element, wherein the flow channel has at least one sub-section, a longitudinal direction of which running perpendicularly below the flexible plate, and wherein a channel cross section of the at least one sub-section of the flow channel is at no point within the sub-section of the flow channel smaller than an area of the flexible plate.

A relative-pressure sensor determines the pressure of a medium in relation to an atmospheric pressure. The sensor includes a housing having a measuring element located in the housing, wherein the pressure to be measured acts upon an outer surface of the measuring element. The surface is in contact with the medium. The sensor also includes a reference-pressure supply, which supplies an inner surface of the measuring element with atmospheric pressure in the form of ambient air, and an evaluation unit, which determines the pressure of the medium from a variable determined using the measuring element. A drying chamber takes-up atmospheric humidity from the ambient air that is supplied via the reference-pressure supply. The drying chamber has a drying module comprising a container and a humidity-adsorbing material that is completely surrounded by the container.

The invention relates to pressure sensors having a membrane having sensor chips having measuring bridges having sensor elements, wherein the membrane is fastened in a housing, with a carrier or as part of a housing, to which membrane a working medium can be applied. The pressure sensors are characterised in particular in that the mechanical stresses resulting from a fastening and/or an installation of the pressure sensors do not influence the measurement result and/or the measurement signal. To this end, at least two sensor chips, which are spaced apart from one another and are offset at an angle to one another, are located at least on a side of the membrane that bends on application of pressure. The measuring bridges are designed and/or connected to a controller in such a manner that at least one force resulting from the fastening of the membrane and thus acting on the membrane is or will be compensated.

The invention relates to pressure sensors having a membrane having sensor chips having measuring bridges having sensor elements, wherein the membrane is fastened in a housing, with a carrier or as part of a housing, to which membrane a working medium can be applied. The pressure sensors are characterised in particular in that the mechanical stresses resulting from a fastening and/or an installation of the pressure sensors do not influence the measurement result and/or the measurement signal. To this end, at least two sensor chips, which are spaced apart from one another and are offset at an angle to one another, are located at least on a side of the membrane that bends on application of pressure. The measuring bridges are designed and/or connected to a controller in such a manner that at least one force resulting from the fastening of the membrane and thus acting on the membrane is or will be compensated.

A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.