A specimen heating apparatus includes a heater unit configured to heat a test specimen held in a material testing machine, a heater holding unit configured to hold the heater unit in a set position relative to the test specimen for heating, a specimen temperature measurement unit attached to the heater unit and configured to measure temperature of the test specimen when the heater unit is in the set position, a temperature controller configured to control heating of the heater unit in response to a temperature measured by the specimen temperature measurement unit, and a thermal insulation unit configured to cover the heater unit, wherein the heater holding unit holds the heater unit in such a way that the heater unit is allowed to be brought to and removed from the set position while the test specimen is being held in the material testing machine.

A mechanism for thermal testing is described. The system includes a heating element, a thermal sensor and a processor. The processor is configured to control the heating element to output an amount of the energy per unit time; receive temperature readings using the thermal sensor; and determine a thermal property associated with a thermal mass based at least in part the amount of the energy output and the received temperature readings.

Methods and apparatus are disclosed to determine material parameters of a turbine rotor. An example apparatus includes a rotor geometry determiner to determine a geometry of the rotor, a node radius calculator to calculate radial node locations of radial nodes including a first radial node, a thermocouple interface to record first temperature values over an interval, a first thermal stress calculator to calculate first thermal stress values at one or more of the radial nodes over the interval, a node temperature calculator to calculate second temperature values at respective internal nodes of the first radial node, a reference value lookup to lookup first material parameter information, a second thermal stress calculator to determine second thermal stress values, a thermal stress comparator to calculate a difference between the thermal stress values, and, in response to the difference not satisfying a threshold, a material parameter adjuster to determine material parameters.

A measurement assembly having a body, a vacuum chamber located on the body and in which the measurement process is carried out is disclosed. A first sample and a second sample that are placed in the vacuum chamber contact each other and between which a heat transfer occurs; a piston that provides the first sample and the second sample to continuously contact each other; a cooler located below the first sample and the second sample; and a heater located above the first sample and the second sample is also disclosed.

A mechanism for thermal testing is described. A test vehicle includes a heating element, a thermal sensor and a processor. The processor is configured to control the heating element to output an amount of the energy per unit time. Temperature readings are received using the thermal sensor. A thermal property associated with a thermal mass is determined based at least in part the amount of the energy output and the received temperature readings.

A method for determining fluid parameters, such as a heat capacity c.sub.Pρ, a calorific value Hp, a methane number MN, and/or a Wobbe index WI, of an unknown fluid (g). An unknown flow (55) of the fluid (g) is set in a sensor device (10), the sensor device (10) comprising a thermal flow sensor (1) and a pressure sensor device (15) for measuring at least one temperature value T.sub.1, T.sub.2, a further parameter, and differential pressure value Δρ over a flow restrictor (14). Using these measurement parameters T.sub.1, T.sub.2, Δρ and calibration data, the calorific value Hp, and/or the Wobbe index WI, or parameters indicative thereof, of an unknown fluid (g) are calculated. The invention also relates to such a sensor device (10) and to a computer program product for carrying out such a method.

Transient techniques for electrothermal characterization of small (e.g., micro-scale or nano-scale) samples are described. These techniques overcome some of the limitations existing in conventional approaches. These transient techniques involve causing a temperature variation inside a sample, and determining a transient signal response (e.g., a voltage rise or drop) arising in the sample as a result of the temperature variation. In some embodiments, the temperature variation may be caused by allowing amplitude modulated electric current (e.g., stepped current or periodic stepped current) to flow through the sample. Alternatively, or additionally, the temperature variation may be caused by controlling a laser source to irradiate the sample. Thermal characteristics of the sample (e.g., thermal diffusivity, thermal conductivity, specific heat) can be determined based on the transient response. These transient techniques can be executed by a computer system in an automatic fashion, e.g., without having to rely on a user to manually pre-process the measurement data.

The invention relates to a device and a method for simultaneously determining temperature-dependent thermal conductivity, thermal diffusivity and specific heat capacity and comprises a heat source for locally heating a solid body to be examined, a both locally and chronologically high-resolution line and/or surface detector for non-contact temperature measurement along the sample, and a cooling Circuit having a cooling liquid flowing around the lower sample edge, the temperature increase and flow rate of which cooling liquid are measured continuously. The thermal diffusivity is determined by means of the described method from the transient thermal States of the sample, which are adjusted in a controlled manner, during heating and cooling. The thermal conductivity is determined from the steady state with a constant heating output. The specific heat capacity of the sample material is calculated according to the temperature from the data sets relating to the thermal diffusivity and thermal conductivity, which data sets are determined directly and over a large temperature range. Because of the enormous savings in time as compared with the prior art, a large number of different solid bodies can be comprehensively characterized thermally for the first time by means of the invention.

A specimen heating apparatus includes a heater unit configured to heat a test specimen held in a material testing machine, a heater holding unit configured to hold the heater unit in a set position relative to the test specimen for heating, a specimen temperature measurement unit attached to the heater unit and configured to measure temperature of the test specimen when the heater unit is in the set position, a temperature controller configured to control heating of the heater unit in response to a temperature measured by the specimen temperature measurement unit, and a thermal insulation unit configured to cover the heater unit, wherein the heater holding unit holds the heater unit in such a way that the heater unit is allowed to be brought to and removed from the set position while the test specimen is being held in the material testing machine.

The invention discloses a apparatus and a method for rapid measurement of heat capacity of a thin film material. Specifically, the apparatus comprises a control device, a clock synchronizer, a flat peak laser device, a rapid thermometer and a heat capacity output device; the control device and the clock synchronizer are signally connected, and the clock synchronizer is signally connected to the flat peak laser device and the rapid thermometer; In the working state, the control device sends a start signal to the clock synchronizer, and the flat peak laser device and the fast thermometer coordinately cooperate; the flat peak laser device irradiates a laser with a spatially flat peak to the surface of the sample; At the same time, the rapid thermometer captures the surface temperature of the sample at a certain point in time during the heating process of the sample, and inputs the measured data into the heat capacity output device to obtain the desired heat capacity parameter. The device of the invention has simple structure, high efficiency and accuracy, and can provide reliable parameter data for the current thermal property setting of various ultra-thin semiconductor films.