A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.

Provided is a flow analysis method capable of predicting a flow state of a composite resin material by taking into account a change in filler dispersion degree of the composite resin material. In a flow analysis method for a composite resin material having a filler and a resin, in a certain process of identifying a region in which the composite resin material flows and analyzing a flow, an exothermic reaction speed of the composite resin material in the region is computed using a filler dispersion degree Vwf in the composite resin material, a temperature and the filler dispersion degree Vwf of the composite resin material in the region is computed using the computed exothermic reaction speed, and an exothermic reaction speed in a process subsequent to a process to is computed using the computed filler dispersion degree Vwf.

Provided is a method of evaluating cleanliness of a member having a silicon carbide surface, the method including bringing the silicon carbide surface into contact with a mixed acid of hydrofluoric acid, hydrochloric acid and nitric acid; concentrating the mixed acid brought into contact with the silicon carbide surface by heating; subjecting a sample solution obtained by diluting a concentrated liquid obtained by the concentration to quantitative analysis of metal components by Inductively Coupled Plasma-Mass Spectrometry; and evaluating cleanliness of the member having a silicon carbide surface on the basis of a quantitative result of metal components obtained by the quantitative analysis.

A wafer surface defect inspection method and a wafer surface defect inspection apparatus are provided. The method includes the following steps. Scanning information of a wafer is received, and the scanning information includes multiple scanning parameters. At least one reference point of the scanning information is determined, and path information is generated according to the at least one reference point and a reference value. Multiple first scanning parameters corresponding to the path information in the scanning parameters are obtained according to the path information to generate a curve chart. According to the curve chart, it is determined whether the wafer has a defect, and a defect type of the defect is determined.

Electrons excited by irradiation of a visible light to a sample is at an energy level lower than a vacuum level, thus photoelectrons are not emitted from the sample and energy of excited electrons cannot be measured. The visible light is irradiated to the sample through a mesh electrode. A surface film for reducing the vacuum level is formed on a surface of the sample. With the surface film being formed, photoelectrons are obtained by the visible light, and these photoelectrons are accelerated by the mesh electrode toward a photoelectron spectrometer. Ultraviolet light may be irradiated to the sample and metal having same potential therewith. In this case, the mesh electrode is set at a retracted position to prohibit interaction of the mesh electrode and the ultraviolet light. A difference between the valence band and the Fermi level of the sample can be measured.

Production of perforated two-dimensional materials with holes of a desired size range, a narrow size distribution, and a high and uniform density remains a challenge, at least partially, due to physical and chemical inconsistencies from sheet-to-sheet of the two-dimensional material and surface contamination. This disclosure describes methods for monitoring and adjusting perforation or healing conditions in real-time to address inter- and intra-sheet variability. In situ or substantially simultaneous feedback on defect production or healing may be provided either locally or globally on a graphene or other two-dimensional sheet. The feedback data can be used to adjust perforation or healing parameters, such as the total dose or efficacy of the perforating radiation, to achieve the desired defect state.

A detector measures turn-off voltage change with respect to change in time between a collector and emitter of a transistor and peak voltage of the transistor at the collector. An electronic data processor determines intermediate parameters of turn-off current, the turn-on current and on-state voltage drop based on the turn-off voltage change and the peak voltage. The data processor determines the power or energy loss for one switching cycle of the transistor based on the turn-off current, the turn-on current and on-state voltage drop between the collector and emitter of the transistor. The data processor estimates an associated average die temperature for the transistor over the switching cycle.

A photoinduced carrier lifetime measurement device includes light sources that respectively apply light that differs in wavelength and generates photoinduced carriers to a semiconductor substrate, a microwave generation section that generates microwaves that are applied to the semiconductor substrate, a detection section that detects the intensity of the microwaves that have passed through the semiconductor substrate, and a calculation section that calculates the effective carrier lifetime corresponding to the wavelength of each light based on the intensity of the microwaves detected when applying each light, and calculates the bulk carrier lifetime and a surface recombination velocity of the semiconductor substrate based on the effective carrier lifetime calculated corresponding to the wavelength of each light.

Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

A system and method for improving production yield of an article with cloud based processing by storing process information in cloud; transferring functional results to cloud, with functional results having identifying information of articles that have failed a functional test and identifying information of articles that have passed functional test; generating a probable cause list from process information in cloud, wherein probable cause list is a shortlisted version of said process information in said cloud; and generating a root cause list from probable cause list in cloud, wherein root cause list comprises process information responsible for failure in failed articles, whereby root causes of failures are analytically determined with processing power, memory, and storage that are scalable, reliable, and upgradable on demand.