The present disclosure provides a wafer inspection technology that involves less degradation of the image quality even when an object to be observed has a variation in height due to warpage, etc. of a wafer. This wafer inspection apparatus obtains an image with less degradation by: adjusting the focal point of an observation optical system to a height measured by a height sensor for measuring wafer surface heights; and further, correcting a switching signal for a CCD line sensor on the basis of stage position data and optical magnification data corresponding to the height so as to make a correction corresponding to the wafer surface height.

A charged particle beam device according to the present invention changes a signal amount of emitted charged particles by irradiating the sample with light due to irradiation under a plurality of light irradiation conditions, and determines at least any one of a material of the sample or a shape of the sample according to the changed signal amount.

An arrayed X-ray source and an X-ray imaging apparatus are described. An example X-ray source includes a housing and X-ray generators located in the housing. The X-ray generators are arranged in an array. The X-ray generators are provided separately from each other and configured to emit X-rays independently of each other.

The present disclosure is related to a Schottky thermal field (TFE) source for emitting an electron beam. Electron optics can adjust a shape of the electron beam before the electron beam impacts a scintillator screen. Thereafter, the scintillator screen generates an emission image in the form of light. An emission image can be adjusted and captured by a camera sensor in a camera at a desired magnification to create a final image of the Schottky TFE source's tip. The final image can be displayed and analyzed to for defects.

A method and a system for providing calibration for a photon counting detector forward model for material decomposition. The flux independent weighted bin response function is estimated using the expectation maximization method, and then used to estimate the pileup correction terms at each tube voltage setting for each detector pixel.

An X-ray analyzer comprises at least one detector configured to detect a secondary X-ray from a test object irradiated by an X-ray source, and provide a corresponding energy signal; a temperature sensor configured to sense a temperature related to the detector; and a signal processor configured to process the energy signal and provide a temperature compensated output for an X-ray event.

A device keeps an electrochemical cell under current and at operating temperature during an X-ray beam diffraction analysis of a first electrode, the cell comprising a solid electrolyte interposed between the electrodes. The device comprises: first and second interconnectors having contact faces contacting the electrodes, which allow a gas flow and exchange between the interconnectors and the electrodes. The contact face of the first interconnector allows an X-ray beam to pass to the first electrode. A thermal and atmospheric containment chamber has an inner cavity housing a stack formed from the cell between the interconnectors and a cover closing the cavity, provided with a window allowing X-rays to pass through, the first interconnector being intended to be arranged facing the cover. The contact face of each interconnector is a slotted element; slotted portions of the slotted element are uniformly arranged and form 30% to 80% of the element's surface area.

This specification describes an X-ray scanning system that adaptively generates a scatter signal, in the course of a single scan, based on the detected brightness areas of a scanned object. An X-ray source is configured to emit an X-ray beam towards an area over a target object. At least one detector detects radiation scattered from the target object and generates a corresponding scatter radiation signal. The scatter radiation signal is characterized, at least in part, by one or more brightness levels corresponding to one or more scanned areas of the target object. A feedback controller receives the scatter radiation signal from the detector, generates a signal that is a function of the one or more brightness levels and that is based on the received scatter radiation signal, and transmits the signal to the X-ray source. In response, the X-ray source is configured to receive the signal and adjust the X-ray beam intensity based on the signal.

A non-destructive inspection system 1 includes a neutron radiation source 3 capable of emitting neutrons N, and a neutron detector 14 capable of detecting neutrons Nb produced via an inspection object 6a among neutrons N emitted from the neutron radiation source 3. The neutron radiation source 3 includes a linear accelerator 11 capable of emitting charged particles P accelerated; a first magnet section 12 including magnets 12a and 12b facing each other, the magnets 12a and 12b being capable of deflecting the charged particles P in a direction substantially perpendicular to a direction of emission of the charged particles P from the linear accelerator 11; and a target section 13 capable of producing neutrons N by being irradiated with the charged particles P that have passed through the first magnet section 12.

An inspection apparatus for inspecting an inspection target object, includes an X-ray generation tube having a target including an X-ray generation portion that generates X-rays by irradiation with an electron beam, and configured to emit X-rays to the inspection target object, and a plurality of X-ray detectors, wherein each of the plurality of X-ray detectors detects X-rays emitted from a foreign substance existing on an inspection target surface of the inspection target object irradiated with the X-rays from the X-ray generation portion and totally reflected by the inspection target surface.