A sensor unit includes a substrate, an inertial sensor module mounted at the substrate, a container including a storage space for storing the substrate and the inertial sensor module, and a coupling member that couples the container and the substrate in a state in which the substrate and the container are in non-contact with each other. The coupling member has elasticity, and an elastic modulus of the coupling member is smaller than an elastic modulus of the container.

There is provided a resonant sensor comprising: a substrate; a proof mass suspended from the substrate to allow for relative movement between the proof mass and the substrate along at least one sensitive axis; at least one resonant element coupled to the proof mass; an electrode assembly adjacent to the at least one resonant element; drive and sense circuitry connected to the electrode assembly configured to drive the electrode assembly to cause the at least one resonant element to resonate, wherein a measure of acceleration of the proof mass can be determined from changes in the resonant behavior of the at least one resonant element; at least one substrate electrode on the substrate, adjacent to the proof mass; and electric circuitry connected to the substrate electrode configured to apply a voltage to the substrate electrode providing an electrostatic force on the proof mass. The substrate electrode may be used to provide a number of different functions.

A sensor package comprising: a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit; a support structure; one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure; wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; and one or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s). The springs decouple mechanical stresses between the sensor unit and the external package wall(s) so as to reduce the long term drift of scale factor and bias.

An optical-fiber-acceleration-sensor probe is provided, which includes a probe shell having a threaded hole at a bottom thereof and an optical-fiber entry and exit hole on a side thereof; a double-end stud in the probe shell, an end of the double-end stud being connected to the threaded hole; a high damping elastomer sleeved on the double-end stud; a mass block sleeved on the double-end stud and located on the high damping elastomer; an optical fiber interferometer located in the mass block and including a sensing arm and a reference arm, where the sensing arm is wound around the high damping elastomer, and the reference arm is wound around the mass block; high damping vibration absorbers on the mass block; and a nut located at another end of the double-end stud, and on the high damping vibration absorbers, where a washer is between the nut and the high damping vibration absorbers.

An optical-fiber-acceleration-sensor probe is provided, which includes a probe shell having a threaded hole at a bottom thereof and an optical-fiber entry and exit hole on a side thereof; a double-end stud in the probe shell, an end of the double-end stud being connected to the threaded hole; a high damping elastomer sleeved on the double-end stud; a mass block sleeved on the double-end stud and located on the high damping elastomer; an optical fiber interferometer located in the mass block and including a sensing arm and a reference arm, where the sensing arm is wound around the high damping elastomer, and the reference arm is wound around the mass block; high damping vibration absorbers on the mass block; and a nut located at another end of the double-end stud, and on the high damping vibration absorbers, where a washer is between the nut and the high damping vibration absorbers.

Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

The present invention relates to capacitive micromechanical accelerometers, and in particular to acceleration sensors with movable rotors which may rotate out of a substrate plane when the accelerometer undergoes movement with an acceleration component perpendicular to the substrate plane. The capacitive micromechanical accelerometer includes additional damping springs to reduce unwanted movement of the rotor in the substrate plane, thereby reducing the parasitic capacitance that results from motion of the rotor in the substrate plane. The damping springs are vertically recessed with respect to other components of the accelerometer in order to minimise the effect of the damping springs on movement of the rotor out of the substrate plane.

A sensor package comprising: a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit; a support structure; one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure; wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; and one or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s). The springs decouple mechanical stresses between the sensor unit and the external package wall(s) so as to reduce the long term drift of scale factor and bias.

The present invention relates to capacitive micromechanical accelerometers, and in particular to acceleration sensors with movable rotors which may rotate out of a substrate plane when the accelerometer undergoes movement with an acceleration component perpendicular to the substrate plane. The capacitive micromechanical accelerometer includes additional damping springs to reduce unwanted movement of the rotor in the substrate plane, thereby reducing the parasitic capacitance that results from motion of the rotor in the substrate plane. The damping springs are vertically recessed with respect to other components of the accelerometer in order to minimise the effect of the damping springs on movement of the rotor out of the substrate plane.

An unmanned aircraft includes a circuit board with an inertia sensor, a vibration damper configured to attenuate vibration of the inertia sensor, a weight block configured to provide support for positioning the circuit board, and a housing assembly configured to form an inner chamber to accommodate the circuit board and the weight block. The vibration damper includes a first vibration-attenuation cushion and a second vibration-attenuation cushion bonded respectively to a first side and a second side of the circuit board. The weight block is disposed between the first vibration-attenuation cushion and the circuit board.