Patent classifications
G01P1/003
Microelectronic structure with viscous damping controlled by controlling a thermo-piezoresistive effect
Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element (24) by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.
INERTIAL MEASUREMENT UNIT
An inertial measurement unit includes: a sensor unit including an inertial sensor, a case accommodating the inertial sensor, and a first fixing part having the case fixed thereto; an elastic member having a first elastic member mainly damping a vibration at a predetermined frequency in a first direction and a second elastic member mainly damping a vibration at a predetermined frequency in a second direction that is different from the first direction; a second fixing part where the sensor unit and the elastic member are arranged; and a fixing member fixing the sensor unit and the elastic member to the second fixing part.
Inertia measurement module for unmanned aircraft
An unmanned aircraft includes a circuit board with an inertia sensor, and a weight block configured to have a flat surface and a recess formed on the flat surface, and a housing assembly configured to form an inner chamber to accommodate the circuit board and the weight block. The circuit board is embedded in the recess by fixedly bonding to the flat surface through adhesion.
Inertial Measurement Unit
An inertial measurement unit includes: a sensor unit having an inertial sensor; and a first holding unit holding the sensor unit. The first holding unit includes: a first substrate; a second substrate; a plurality of spacers coupling the sensor unit and the first substrate; a first elastic member and a second elastic member provided on both sides of the first substrate via opening parts; a first fixing member penetrating, pressing and fixing the first substrate and the first elastic member to the second substrate; and a second fixing member penetrating, pressing and fixing the first substrate and the second elastic member to the second substrate.
System and method for providing a simple and reliable inertia measurement unit (IMU)
An inertia measure unit (IMU) includes a main circuit board, and first and second weight blocks. A first surface of the first weight block contacts the main circuit board. The first weight block includes a recess formed on a second surface thereof opposite to the first surface, and an opening formed on a side surface thereof. The second weight block is coupled to the first weight block on the second surface to cover the recess. The first and second weight blocks jointly form an inner chamber in communication with the opening. The IMU further includes a circuit board disposed in the inner chamber, and a signal line coupled to an edge of the circuit board and extending out of the opening. The signal line bends over an outer surface of the first weight block or the second weight block to connect to the main circuit board.
Structure-borne noise decoupling on sensors working with transmitter fields
A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.
VIBRATION DAMPING IN MEMS ACCELERATION SENSORS
A capacitive microelectromechanical acceleration sensor where one or more rotor measurement plates and one or more stator measurement plates are configured so that the movement of a proof mass in the direction of a sense axis can be measured in a capacitive measurement conducted between them. One or more first rotor damping plates and one or more first stator damping plates form a first set of parallel plates which are orthogonal to a first damping axis, and the first damping axis is substantially orthogonal to the sense axis.
Strut for a multi-story building
A strut may be interposed between a first floor plate and a second floor plate of a multi-story building, wherein the first floor plate is disposed overtop of the second floor plate. The strut includes a first post section and a second post section. The first post section includes a first portion that is coaxial with, annular to and slidably disposed within a second portion of the second post section. A damping actuator is interposed between the first post section and the second post section, and is arranged to dynamically control a position of the first post section in relation to the second post section. The strut also includes an accelerometer. A controller is in communication with the accelerometer and the damping actuator, and controls the damping actuator to control the position of the first post section in relation to the second post section.
Inertial sensor with integrated damping structures
An inertial sensor includes a movable mass spaced apart from a surface of the substrate. The movable mass is adapted for motion about a rotational axis positioned between first and second ends of the movable mass in response to a first force imposed upon the movable mass in a first direction that is perpendicular to the surface of the substrate. The inertial sensor further includes a damping system configured to limit motion of the movable mass in a second direction perpendicular to the first direction. The damping system includes a first damping structure coupled to the movable mass, a second damping structure adjacent to the first damping structure, the first and second damping structures being spaced apart from the surface of the substrate, and a spring structure interconnected between the movable mass and the second damping structure.
SENSOR UNIT, ELECTRONIC APPARATUS, AND MOVING OBJECT
A sensor unit includes a substrate, an inertial sensor module mounted at the substrate, a container including a storage space for storing the substrate and the inertial sensor module, and a coupling member that couples the container and the substrate in a state in which the substrate and the container are in non-contact with each other. The coupling member has elasticity, and an elastic modulus of the coupling member is smaller than an elastic modulus of the container.