Patent classifications
G01Q60/24
MASK CHARACTERIZATION METHODS AND APPARATUSES
A mask characterization method comprises measuring an interference signal of a reflection or transmission mask for use in lithography; and determining a quality metric for the reflection or transmission mask based on the interference signal. A mask characterization apparatus comprises a light source arranged to illuminate a reflective or transmissive mask with light whereby mask-reflected or mask-transmitted light is generated; an optical grating arranged to convert the mask-reflected or mask-transmitted light into an interference pattern; and an optical detector array arranged to generate an interference signal by measuring the interference pattern.
MASK CHARACTERIZATION METHODS AND APPARATUSES
A mask characterization method comprises measuring an interference signal of a reflection or transmission mask for use in lithography; and determining a quality metric for the reflection or transmission mask based on the interference signal. A mask characterization apparatus comprises a light source arranged to illuminate a reflective or transmissive mask with light whereby mask-reflected or mask-transmitted light is generated; an optical grating arranged to convert the mask-reflected or mask-transmitted light into an interference pattern; and an optical detector array arranged to generate an interference signal by measuring the interference pattern.
System for simultaneously and microscopically measuring vapor cell coating film energy transfer and relaxation characteristics at nanometer scales
A system for simultaneously and microscopically measuring vapor cell coating film energy transfer and relaxation characteristics at nanometer scales includes a space relaxation characteristic detection unit which includes a laser, an optical isolator, a spatial light filter, a reflector, a Glan-Taylor polarizer, a first quarter-wave plate, a spatial light modulator, a focusing lens, a second quarter-wave plate, a polarizing film, a PD detection unit, an I/V amplification unit, a data acquisition unit, a spectroscope and an optical chopper, an atomic force microscope detection unit for energy transfer micro-areas, a shielding cylinder, a coated alkali metal atomic vapor cell, a data processing unit and a magnetic field controlled coil. The energy transfer micro-area detection unit includes coated samples, a probe, an oscillator, a laser, a four-quadrant photoelectric detection unit, a band-pass filter unit, an automatic gain controller, an adder, a piezoelectric scanning cylinder, a sample table and a PI controller.
System for simultaneously and microscopically measuring vapor cell coating film energy transfer and relaxation characteristics at nanometer scales
A system for simultaneously and microscopically measuring vapor cell coating film energy transfer and relaxation characteristics at nanometer scales includes a space relaxation characteristic detection unit which includes a laser, an optical isolator, a spatial light filter, a reflector, a Glan-Taylor polarizer, a first quarter-wave plate, a spatial light modulator, a focusing lens, a second quarter-wave plate, a polarizing film, a PD detection unit, an I/V amplification unit, a data acquisition unit, a spectroscope and an optical chopper, an atomic force microscope detection unit for energy transfer micro-areas, a shielding cylinder, a coated alkali metal atomic vapor cell, a data processing unit and a magnetic field controlled coil. The energy transfer micro-area detection unit includes coated samples, a probe, an oscillator, a laser, a four-quadrant photoelectric detection unit, a band-pass filter unit, an automatic gain controller, an adder, a piezoelectric scanning cylinder, a sample table and a PI controller.
Initiating and monitoring the evolution of single electrons within atom-defined structures
A method for the patterning and control of single electrons on a surface is provided that includes implementing scanning tunneling microscopy hydrogen lithography with a scanning probe microscope to form charge structures with one or more confined charges; performing a series of field-free atomic force microscopy measurements on the charge structures with different tip heights, where interaction between the tip and the confined charge are elucidated; and adjusting tip heights to controllably position charges within the structures to write a given charge state. The present disclose also provides a Gibb's distribution machine formed with the method for the patterning and control of single electrons on a surface. A multi bit true random number generator and neural network learning hardware formed with the above described method are also provided.
Initiating and monitoring the evolution of single electrons within atom-defined structures
A method for the patterning and control of single electrons on a surface is provided that includes implementing scanning tunneling microscopy hydrogen lithography with a scanning probe microscope to form charge structures with one or more confined charges; performing a series of field-free atomic force microscopy measurements on the charge structures with different tip heights, where interaction between the tip and the confined charge are elucidated; and adjusting tip heights to controllably position charges within the structures to write a given charge state. The present disclose also provides a Gibb's distribution machine formed with the method for the patterning and control of single electrons on a surface. A multi bit true random number generator and neural network learning hardware formed with the above described method are also provided.
Three-dimensional surface metrology of wafers
A computer-based method for three-dimensional surface metrology of samples based on scanning electron microscopy and atomic force microscopy. The method includes: (i) using a scanning electron microscope (SEM) to obtain SEM data of a set of sites on a surface of a sample; (ii) using an atomic force microscope (AFM) to measure vertical parameters of sites in a calibration subset of the set; (iii) calibrating an algorithm, configured to estimate a vertical parameter of a site when SEM data of the site are fed as inputs, by determining free parameters of the algorithm, such that residuals between the algorithm-estimated vertical parameters and the AFM-measured vertical parameters are about minimized; and (iv) using the calibrated algorithm to estimate vertical parameters of the sites in the complement to the calibration subset.
Three-dimensional surface metrology of wafers
A computer-based method for three-dimensional surface metrology of samples based on scanning electron microscopy and atomic force microscopy. The method includes: (i) using a scanning electron microscope (SEM) to obtain SEM data of a set of sites on a surface of a sample; (ii) using an atomic force microscope (AFM) to measure vertical parameters of sites in a calibration subset of the set; (iii) calibrating an algorithm, configured to estimate a vertical parameter of a site when SEM data of the site are fed as inputs, by determining free parameters of the algorithm, such that residuals between the algorithm-estimated vertical parameters and the AFM-measured vertical parameters are about minimized; and (iv) using the calibrated algorithm to estimate vertical parameters of the sites in the complement to the calibration subset.
TRUNCATED NONLINEAR INTERFEROMETER-BASED SENSOR SYSTEM
A truncated non-linear interferometer-based sensor system includes an input port that receives an optical beam and a non-linear amplifier that amplifies the optical beam with a pump beam and renders a probe beam and a conjugate beam. The system’s local oscillators have a relationship with the respective beams. The system includes a sensor that transduces an input with the probe beam and the conjugate beam or their respective local oscillators. It includes one or more phase-sensitive detectors that detect a phase modulation between the respective local oscillators and the probe beam and the conjugate beam. Output from the phase-sensitive-detectors is based on the detected phase modulation. The phase-sensor-detectors include measurement circuitry that measure the phase signals. The measurement is the sum or difference of the phase signals in which the measured combination exhibit a quantum noise reduction in an intensity difference or a phase sum or an amplitude difference quadrature.
TRUNCATED NONLINEAR INTERFEROMETER-BASED SENSOR SYSTEM
A truncated non-linear interferometer-based sensor system includes an input port that receives an optical beam and a non-linear amplifier that amplifies the optical beam with a pump beam and renders a probe beam and a conjugate beam. The system’s local oscillators have a relationship with the respective beams. The system includes a sensor that transduces an input with the probe beam and the conjugate beam or their respective local oscillators. It includes one or more phase-sensitive detectors that detect a phase modulation between the respective local oscillators and the probe beam and the conjugate beam. Output from the phase-sensitive-detectors is based on the detected phase modulation. The phase-sensor-detectors include measurement circuitry that measure the phase signals. The measurement is the sum or difference of the phase signals in which the measured combination exhibit a quantum noise reduction in an intensity difference or a phase sum or an amplitude difference quadrature.