Patent classifications
G01Q60/24
METHOD AND DEVICE FOR MEASURING DIMENSION OF SEMICONDUCTOR STRUCTURE
A method and device for measuring dimension of a semiconductor structure are provided. A probe of an Atomic Force Microscope (AFM) is controlled at first to move a first distance from a preset reference position to a top surface of a semiconductor structure to be measured in a direction perpendicular to the top surface of the semiconductor structure to be measured, then the probe is controlled to scan the surface of the semiconductor structure to be measured while keeping the first distance in a direction parallel to the top surface of the semiconductor structure to be measured, amplitudes of the probe at respective scanning points on the surface of the semiconductor structure to be measured are detected, and a Critical Dimension (CD) of the semiconductor structure to be measured is determined according to the amplitudes of the probe at respective scanning points on the surface of the semiconductor structure.
METHOD AND DEVICE FOR MEASURING DIMENSION OF SEMICONDUCTOR STRUCTURE
A method and device for measuring dimension of a semiconductor structure are provided. A probe of an Atomic Force Microscope (AFM) is controlled at first to move a first distance from a preset reference position to a top surface of a semiconductor structure to be measured in a direction perpendicular to the top surface of the semiconductor structure to be measured, then the probe is controlled to scan the surface of the semiconductor structure to be measured while keeping the first distance in a direction parallel to the top surface of the semiconductor structure to be measured, amplitudes of the probe at respective scanning points on the surface of the semiconductor structure to be measured are detected, and a Critical Dimension (CD) of the semiconductor structure to be measured is determined according to the amplitudes of the probe at respective scanning points on the surface of the semiconductor structure.
Novel Methods
This invention is directed to methods of detecting biofilm treated in situ with an active ingredient, and subsequently imaging or detecting types or varieties of biofilm and/or architectural changes in biofilm when treated with certain actives. Additionally, the invention contemplates screening assays to discover further candidate compounds that can affect biofilm growth and formation, as it relates to the maintenance of oral health and prevention of oral diseases.
Novel Methods
This invention is directed to methods of detecting biofilm treated in situ with an active ingredient, and subsequently imaging or detecting types or varieties of biofilm and/or architectural changes in biofilm when treated with certain actives. Additionally, the invention contemplates screening assays to discover further candidate compounds that can affect biofilm growth and formation, as it relates to the maintenance of oral health and prevention of oral diseases.
THROUGH-FOCUS IMAGE-BASED METROLOGY DEVICE, OPERATION METHOD THEREOF, AND COMPUTING DEVICE FOR EXECUTING THE OPERATION
Provided is a through-focus image-based metrology device including an optical device, and a computing device configured to acquire at least one through-focus image of a target from the optical device, generate an intensity profile based on the acquired at least one through-focus image, and perform metrology on the target based on the generated intensity profile, wherein the optical device includes a stage on which the target is disposed, the stage being configured to move by one step in at least one direction based on control of the computing device, and to acquire the at least one through-focus image, an image sensor disposed on the stage, an objective lens disposed between the image sensor and the stage, the objective lens being configured to transmit reflected light from the target, and a light source configured to emit illumination light to the target through the objective lens.
THROUGH-FOCUS IMAGE-BASED METROLOGY DEVICE, OPERATION METHOD THEREOF, AND COMPUTING DEVICE FOR EXECUTING THE OPERATION
Provided is a through-focus image-based metrology device including an optical device, and a computing device configured to acquire at least one through-focus image of a target from the optical device, generate an intensity profile based on the acquired at least one through-focus image, and perform metrology on the target based on the generated intensity profile, wherein the optical device includes a stage on which the target is disposed, the stage being configured to move by one step in at least one direction based on control of the computing device, and to acquire the at least one through-focus image, an image sensor disposed on the stage, an objective lens disposed between the image sensor and the stage, the objective lens being configured to transmit reflected light from the target, and a light source configured to emit illumination light to the target through the objective lens.
WAFER-SCALE PROGRAMMABLE FILMS FOR SEMICONDUCTOR PLANARIZATION AND FOR IMPRINT LITHOGRAPHY
A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.
WAFER-SCALE PROGRAMMABLE FILMS FOR SEMICONDUCTOR PLANARIZATION AND FOR IMPRINT LITHOGRAPHY
A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.
FREQUENCY TRACKING FOR SUBSURFACE ATOMIC FORCE MICROSCOPY
A method and system for performing subsurface atomic force microscopy measurements, the system comprising: a signal source for generating an drive signal; a transducer configured to receive the drive signal for converting the drive signal into vibrational waves and coupling said vibrational waves into a stack comprising a sample for interaction with subsurface features within said sample; cantilever tip for contacting the sample for measuring surface displacement resulting from the vibrational waves to determine subsurface features; wherein the system includes a measurement device for measuring a measurement signal returning from the transducer during and/or in between the subsurface atomic force microscopy measurements.
FREQUENCY TRACKING FOR SUBSURFACE ATOMIC FORCE MICROSCOPY
A method and system for performing subsurface atomic force microscopy measurements, the system comprising: a signal source for generating an drive signal; a transducer configured to receive the drive signal for converting the drive signal into vibrational waves and coupling said vibrational waves into a stack comprising a sample for interaction with subsurface features within said sample; cantilever tip for contacting the sample for measuring surface displacement resulting from the vibrational waves to determine subsurface features; wherein the system includes a measurement device for measuring a measurement signal returning from the transducer during and/or in between the subsurface atomic force microscopy measurements.