G01Q60/24

SURFACE ANALYSIS METHOD, SURFACE ANALYSIS SYSTEM, AND SURFACE ANALYSIS PROGRAM
20230273237 · 2023-08-31 ·

A surface analysis method according to an embodiment includes: acquiring a force curve corresponding to measurement of a sample surface by a scanning probe microscope; calculating a physical quantity of an organic material forming the sample surface based on the force curve, for each of an observation point group; and outputting analysis data indicating the physical quantity of each of the observation point group. The acquiring the force curve includes acquiring the force curve at each of a plurality of observation points on a Y-column extending along a X-direction (a direction along which the probe reciprocates with respect to a stage). The calculating the physical quantity includes: generating a force curve matrix indicating the force curve at each of the plurality of observation points; and calculating the physical quantity at each of the plurality of observation points using the force curve matrix.

Scanning probe microscopy system for and method of mapping nanostructures on the surface of a sample

The present document relates to a scanning probe microscopy system and method for mapping nanostructures on the surface of a sample. The system comprises a sample support structure, a scan head including a probe comprising a cantilever and a probe tip, and an actuator for scanning the probe tip relative to the sample surface. The system also includes an optical source, and a sensor unit for obtaining a sensor signal indicative of a position of the probe tip. The sensor unit includes a partially reflecting element for reflecting a reference fraction and for transmitting a sensing fraction of the optical signal. It further includes directional optics for directing the sensing fraction as an optical beam towards the probe tip, and for receiving a reflected fraction thereof to provide a sensed signal. Moreover the sensor includes an interferometer for providing one or more output signals, and signal conveyance optics for conveying the sensed signal and the reference signal to the interferometer. The directional optics is configured for directing the sensing fraction such that at least a part of the sensing fraction is reflected by the probe tip such as to form the reflected fraction.

Scanning probe microscopy system for and method of mapping nanostructures on the surface of a sample

The present document relates to a scanning probe microscopy system and method for mapping nanostructures on the surface of a sample. The system comprises a sample support structure, a scan head including a probe comprising a cantilever and a probe tip, and an actuator for scanning the probe tip relative to the sample surface. The system also includes an optical source, and a sensor unit for obtaining a sensor signal indicative of a position of the probe tip. The sensor unit includes a partially reflecting element for reflecting a reference fraction and for transmitting a sensing fraction of the optical signal. It further includes directional optics for directing the sensing fraction as an optical beam towards the probe tip, and for receiving a reflected fraction thereof to provide a sensed signal. Moreover the sensor includes an interferometer for providing one or more output signals, and signal conveyance optics for conveying the sensed signal and the reference signal to the interferometer. The directional optics is configured for directing the sensing fraction such that at least a part of the sensing fraction is reflected by the probe tip such as to form the reflected fraction.

Pan-sharpening for microscopy

Techniques for generating full-spatial resolution, full spectral resolution image(s) from a 3D spectral-data cube for any spectral value within a given spectral range are provided without requiring the acquisition of all full-spatial resolution, full spectral resolution data by an instrument. The 3D spectral-data cube is generated from a limited number of full-spatial resolution, sparse spectral resolution data and a sparse-spatial resolution, full-spectral resolution data of the same area of the sample. The use of the 3D spectral-data cube reduces the data acquisition time.

Pan-sharpening for microscopy

Techniques for generating full-spatial resolution, full spectral resolution image(s) from a 3D spectral-data cube for any spectral value within a given spectral range are provided without requiring the acquisition of all full-spatial resolution, full spectral resolution data by an instrument. The 3D spectral-data cube is generated from a limited number of full-spatial resolution, sparse spectral resolution data and a sparse-spatial resolution, full-spectral resolution data of the same area of the sample. The use of the 3D spectral-data cube reduces the data acquisition time.

Method for identifying the extent of aging in an asphalt

Disclosed are asphalt and asphalt binders and methods for making such compositions with sterols. The sterols improve various rheological properties. Also disclosed are methods of determining the changes or improvements of various rheoloical properties.

Wafer-scale programmable films for semiconductor planarization and for imprint lithography

A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.

Wafer-scale programmable films for semiconductor planarization and for imprint lithography

A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.

Thin film metrology

A method of evaluating a thickness of a film on a substrate includes detecting atomic force responses of the film to exposure of electromagnetic radiation in the infrared portion of the electromagnetic spectrum. The use of atomic force microscopy to evaluate thicknesses of thin films avoids underlayer noise commonly encountered when optical metrology techniques are utilized to evaluate film thicknesses. Such underlayer noise adversely impacts the accuracy of the thickness evaluation.

Thin film metrology

A method of evaluating a thickness of a film on a substrate includes detecting atomic force responses of the film to exposure of electromagnetic radiation in the infrared portion of the electromagnetic spectrum. The use of atomic force microscopy to evaluate thicknesses of thin films avoids underlayer noise commonly encountered when optical metrology techniques are utilized to evaluate film thicknesses. Such underlayer noise adversely impacts the accuracy of the thickness evaluation.