An electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. The lift pin moves to first and second positions. The control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.

A static electricity distribution measuring apparatus (1) according to the present disclosure measures the static electricity distribution on a measurement surface of a measurement target (200), and is provided with: an array antenna (2) that receives electric fields generated from each of a plurality of areas (211) on the measurement surface through vibration; a vibrator (3) that vibrates the measurement target (200) or the array antenna (2); a measurer (4) that measures at least one from among intensity, frequency and phase of the electric fields in each of the plurality of areas (211) received by the array antenna (2); a calculator (5) that calculates an amount of static electricity for each of the plurality of areas (211) based on measurement results by the measurer (4); and a drawer (6) that draws the static electricity distribution on the measurement surface based on the amount of static electricity in each of the plurality of areas (211). The array antenna (2) has a plurality of antenna elements (21) respectively corresponding to the plurality of areas (211).

An apparatus, system, and method for managing an electrostatic charge of a workpiece are disclosed. The method comprises coupling an electrostatic voltmeter to a conductor, coupling a charge-adjustment system to the conductor, and coupling the conductor to the workpiece. A level of charge in the workpiece is adjusted, via the conductor, with the charge-adjustment circuit and a voltage of the workpiece is monitored, via the conductor, with the electrostatic voltmeter. A controller may be used to adjust the charge on the workpiece based upon the monitored voltage.

An apparatus, system, and method for managing an electrostatic charge of a workpiece are disclosed. The method comprises coupling an electrostatic voltmeter to a conductor, coupling a charge-adjustment system to the conductor, and coupling the conductor to the workpiece. A level of charge in the workpiece is adjusted, via the conductor, with the charge-adjustment circuit and a voltage of the workpiece is monitored, via the conductor, with the electrostatic voltmeter. A controller may be used to adjust the charge on the workpiece based upon the monitored voltage.

A method of monitoring static charge is provided. The method includes the operations as follows. A metallic plate is connected to a conductive tape wrapped around an outer surface of a non-conductive tube. A plurality of static charges are detected from the metallic plate by an electrostatic field meter, wherein the conductive tape and the metallic plate are entirely disposed within a metallic box. A flow rate of a fluid flowing through the non-conductive tube is adjusted according to the plurality of static charges detected by the electrostatic field meter.

A method of monitoring static charge is provided. The method includes the operations as follows. A metallic plate is connected to a conductive tape wrapped around an outer surface of a non-conductive tube. A plurality of static charges are detected from the metallic plate by an electrostatic field meter, wherein the conductive tape and the metallic plate are entirely disposed within a metallic box. A flow rate of a fluid flowing through the non-conductive tube is adjusted according to the plurality of static charges detected by the electrostatic field meter.

A method for monitoring polarization quality of a piezoelectric film is described. In this method, a detection step is performed on a piezoelectric film by using a detection device with a non-contact method during a polarization process of the piezoelectric film, to obtain a static electricity information or a transmittance information. A determination step is performed by using the static electricity information or the transmittance information to determine a polarization degree of the piezoelectric film.

A method for monitoring polarization quality of a piezoelectric film is described. In this method, a detection step is performed on a piezoelectric film by using a detection device with a non-contact method during a polarization process of the piezoelectric film, to obtain a static electricity information or a transmittance information. A determination step is performed by using the static electricity information or the transmittance information to determine a polarization degree of the piezoelectric film.

An electrical field mapping system with an improved measurement and recording method which enables students to produce an electric field map of equipotential lines and electric field vectors. Measurements of an electric potential point and an electric field vector may be made by a three-probe sensor with pointer and displayed on voltmeters. An angular scale below the pointer may assist to measure the direction of the electric field. An X-Y transfer mechanism transfers the location of the three-probe sensor, from the space around electrodes, to a marker at a corresponding location in the recording area. Recordings of the field data are made by markers with different impressions and may include an electric field vector, equipotential line segment, and electric potential point.

A method and apparatus for generating high-order harmonics in a solid-state medium comprising integrated semiconductor devices and electronics. The high-order harmonics interact with and are modified by the internal electric field associated with the operation of the integrated semiconductor devices and electronics. Measurement of the high-order harmonics after modification by the internal electric fields amounts to high resolution (temporal and spatial) dynamic imaging of the internal electric fields associated with the integrated semiconductor devices and electronics.