Patent classifications
G01R31/003
High-pressure burn-in test apparatus
A high-pressure burn-in test apparatus comprises a burn-in furnace including a high-pressure burn-in furnace cavity equipped with a driving motor, at least one intake manifold, at least one extension manifold equipped with a nozzle, a communicating tube connected to the intake manifold, and a fan. A processing chamber having a test board is formed inside the high-pressure burn-in furnace cavity. The periphery of at least one of the intake manifold is connected to the at least one extension manifold. At least one component to be tested is placed on the test board. High-pressure gas is ejected through the nozzle to disturb the gas around the component to be tested. The fan is installed in the processing chamber. The driving motor drives the fan to rotate, so that the gas in the processing chamber generates convection, to improve the uniformity of gas temperature distribution.
TEMPERATURE TEST APPARATUS AND TEMPERATURE TEST METHOD
The temperature test apparatus includes an OTA chamber 50 as an anechoic box, a heat insulating housing that is accommodated in the OTA chamber, a temperature control device that controls a temperature in the heat insulating housing, a ventilation block 210 that is made of metal and provided to block an opening 502 formed in the OTA chamber, and in which a plurality of through-holes 214 are formed, a first cover 220 that is provided on an outer side of the OTA chamber to cover the ventilation block, and form a first space 225 with the ventilation block, and is joined to a pipe for air from the temperature control device, and a second cover 250 that is provided on an inner side of the OTA chamber to cover the ventilation block, and form a second space 255 communicating with the heat insulating housing, together with the ventilation block.
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS TESTER
A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop air path is defined by the frame and a heater and cooler are located in the closed loop air path to cool or heat the cartridge with air. Individual cartridges can be inserted or be removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.
SUBSTRATE TESTING APPARATUS
A substrate testing apparatus configured to perform a hot electron analysis (HEA) test for analyzing a stand-by failure in a substrate includes a heating chuck having a first surface configured to support the substrate and a second surface opposite to the first surface. The heating chuck is configured to heat the substrate and has an aperture passing through the first surface and the second surface. A substrate moving device moves the substrate on the heating chuck in a lateral direction. A camera is under the heating chuck and photographs the substrate, which is exposed by the heating chuck aperture.
Dustproof test device and dustproof test method
A dustproof test device includes a test box and a dust supply apparatus, where the test box includes a sample cabin, where the dust supply apparatus is connected to the test box through a dust tube, and where the dust supply apparatus is configured to transport dust into the sample cabin under the action of compressed air.
ARRANGEMENT FOR TESTING ELECTRIC CAR COMPONENTS
This document describes an arrangement for testing electric car components. The arrangement comprises a transportable container (100) housing at least a test chamber (102) for testing the electric car components; a climate control system (110) for controlling climate conditions in the test chamber of the container; and means for testing the electric car components in the test chamber of the container.
Allocation of test resources to perform a test of memory components
A request to perform a test with one or more memory components can be received. Available test resources of a test platform that is associated with memory components can be determined. The desired characteristics of the one or more memory components that are specified by the test can be determined. One or more of the available test resources of the test platform to the test can be assigned based on characteristics of respective memory components associated with the one or more of the available test resources and the desired characteristics of the one or more memory components of the test. Furthermore, the test can be performed with the assigned one or more of the available test resources of the test platform.
TEMPERATURE TEST APPARATUS AND TEMPERATURE TEST METHOD
The temperature test apparatus includes a test antenna for measuring transmission and reception characteristics of a DUT, an anechoic box formed by a metal housing having an internal space, a heat insulating housing, a temperature control device that controls the temperature of a spatial region, and a measurement device that measures the transmission and reception characteristics of the DUT. The temperature control device and the heat insulating housing are connected to each other by a pipe 31 through which a gas for controlling the temperature of the spatial region passes and that goes through the metal housing. A portion 31A of the pipe from the metal housing to a predetermined position of the internal space is made of metal. A metal net portion 33 that blocks a pipeline 31Ae of a portion of the pipe 31 is provided.
FAULT CIRCUIT INDICATOR APPARATUS, SYSTEM, AND METHOD
A fault circuit indicator (FCI) detection system for electrical equipment disposed in an enclosure or vault having an above-ground vent pipe exhaust outlet comprises one or more sensors disposed in the enclosure or vault to sense a condition of at least one unit of the electrical equipment. A sensored analytics unit (SAU) is coupled to the sensors to receive sensor data and analyze the sensor data, the SAU generating a corresponding analyzed data signal that provides information related to a condition of the at least one unit of electrical equipment. A transceiver is disposed inside at least a portion of the vent pipe to receive the analyzed data signal, wherein the transceiver is configured to communicate the analyzed data signal. A visual indicator is disposed on or within the vent pipe comprising one or more visual indicators, such as LEDs, driven by a driving circuit board to provide a visual signal corresponding to the condition of the at least one unit of electrical equipment.
Electronics equipment testing apparatus and method utilizing unintended RF emission features
A hand-held apparatus for analysis, testing, inspecting and/or screening a fully integrated and assembled electrically powered assets and devices for measurement of degree of device aging, degradation, condition, and/or Remaining Useful Life (RUL). The device includes an on-board antenna positioned at a distance from the electrically powered device under test and a signal receiver or sensor for examining a signal from the electrically powered device, but especially applied to electronic devices. The receiver or sensor collects unintended and/or intended RF energy components emitted by the electrically powered device and performs the above analysis in a response to the acquired signal input while the electrically powered device is active or powered.