A semiconductor integrated circuit device includes a control unit configured to control a switching element or an output transistor of a power supply device, a monitor terminal for monitoring an output voltage of the power supply device, a test unit configured to output a test signal to the monitor terminal before activation of the power supply device, and a determination unit configured to determine whether or not the monitor terminal is open, on the basis of a voltage of the monitor terminal when the test unit outputs the test signal to the monitor terminal.

A substrate support includes a supporting unit and a light irradiation mechanism. The supporting unit includes a plate member on which an inspection target is placed and a transparent member. The light irradiation mechanism is configured to irradiate light to increase a temperature of the inspection target. Each of the plate member and the transparent member is made of a low thermal expansion material having a linear expansion coefficient of 1.0×10.sup.−6/K or less.

A method for determining an emission coefficient of a device under test (DUT) using a test circuit comprises coupling a parameter measurement circuit associated with the test circuit to an input pin associated with the DUT, wherein the input pin is coupled to a diode element within the DUT and performing voltage and current measurements associated with the input pin using the parameter measurement circuit. In some embodiments, the method further comprises determining a plurality of contact resistance values respectively based on the voltage and current measurements and an emission coefficient estimate using a contact resistance estimation circuit; and determining an emission coefficient associated with the DUT based on the determined plurality of contact resistance values using an emission coefficient determination circuit.

A test circuit includes an oscillator configured to generate an oscillation signal, a device-under-test (DUT) configured to output an AC signal based on the oscillation signal, a first detection circuit configured to generate a first DC voltage having a first value based on the oscillation signal, and a second detection circuit configured to generate a second DC voltage having a second value based on the AC signal.

A system is provided that includes a memory configured to store test patterns. A first lockstep core and a second lockstep core are configured to receive the same set of test patterns. First scan outputs are generated from the first lockstep core, and second scan outputs are generated from the second lockstep core during a reset of the first lockstep core and the second lockstep core. A comparator can be coupled to the first lockstep core and the second lockstep core and is configured to compare the first scan outputs to the second scan outputs. The first and second lockstep cores can be initialized to a similar state if the first and second scan outputs are the same. The first and second lockstep cores can comprise non-resettable flip flops.

A system includes a signal generator, configured to pass a generated signal, which has two different generated frequencies, through a circuit including an intrabody electrode. The system further includes a processor, configured to identify, while the generated signal is passed through the circuit, a derived frequency, which is derived from the generated frequencies, on the circuit, and to generate, in response to identifying the derived frequency, an output indicating a flaw in the electrode. Other embodiments are also described.

A detection device for detecting a line quality of an electric circuit includes two electrical connection members inserted into a socket and connected to two power lines, a load resistor, a switching member, a displaying module, and a control module. An end of the load resistor is connected to one of the electrical connection members, and another end thereof is connected to a first end of the switching member. A second end of the switching member is connected to the other electrical connection member. The control module controls the switching member to cut off when in a detection mode, and detects a peak voltage in a voltage waveform and records as a maximum open-circuit voltage, and controls the switching member to conduct and detects the peak voltage of the voltage waveform and records as a load voltage and calculates a load current. A line resistance value is calculated based on the maximum open-circuit voltage, the load voltage, and the load current. A message is correspondingly displayed via the displaying module.

A gettering property evaluation apparatus includes a gettering determination unit and a chuck table. The gettering determination unit has a laser beam applying unit for applying a laser beam to a wafer, and a transmission-reception unit for applying a microwave to the wafer and receiving the microwave reflected by the wafer. The gettering determination unit determines whether or not a gettering layer including a grinding strain generated by grinding the wafer has a gettering property. The chuck table holds the wafer on a holding surface. The chuck table has a conductive nonmetallic porous member constituting the holding surface and having a property of reflecting or absorbing the microwave, and a base member provided with a negative pressure transmission passage for transmitting a negative pressure to the nonmetallic porous member.

The present disclosure provides for an electronic sensor for detecting a root of a plant in soil, the electronic sensor that includes a first conductor plate configured to be disposed in soil, a switch, a power supply, and a signal extractor. The switch is electrically coupled to the first conductor plate and is configured to switch between a first mode and a second mode. The power supply is electrically coupled to the switch and is configured to provide an electrical charge to the first conductor plate in the first mode of the switch. The signal extractor is electrically coupled to the switch and is configured to extract a signal response at the first conductor plate in the second mode of the switch. The present disclosure further provides a second conductor plate configured to be disposed in soil adjacent to and substantially parallel to the first conductor plate. The second conductor plate is electrically coupled to ground.

A measurement system for performing measurements. The measurement system includes a positioning system for positioning at least one device to be positioned. The positioning system includes at least two rotational positioner modules configured to perform a rotational movement, thereby rotating the device to be positioned, as well as at least one linear positioner module configured to perform a linear movement, thereby translationally moving the device to be positioned. The linear positioner module includes a mounting interface for the device to be positioned. The rotational positioner modules and the linear positioner module together are configured to move the device to be positioned from a starting point of the movement. The rotational positioner modules are configured to set the starting point. The linear positioner module is configured to move the mounting interface relative to the starting point.