A metrology system and metrology methods are disclosed. The metrology system includes an illumination sub-system, a collection sub-system, a detector, and a controller. The controller is configured to receive an image of an overlay target on a sample, determine an apparent overlay between two working zones along a measurement direction based on the image, and calculate an overlay between the two sample layers by dividing the apparent overlay by a Moiré gain to compensate for Moiré interference.

An electronic device includes a light modulation module. The light modulation module includes multiple first signal lines and multiple second signal lines. The first signal lines extend along a first direction. The second signal lines extend along a second direction. The second direction is different from the first direction. The first signal lines and the second signal lines are curves. Each of the first signal lines and each of the second signal lines respectively include multiple first patterns, and each of the first patterns has an inflection point.

Disclosed are an optical anti-counterfeiting element and an anti-counterfeiting product. The optical anti-counterfeiting element includes a substrate; and a sampling layer formed on a first surface of the substrate, wherein the sampling layer is a sampling unit array composed of sampling units distributed according to a preset graphic-text information, the sampling unit array is aligned, in a preset manner, with a light-emitting pixel array positioned on a second surface side of the substrate and composed of light-emitting pixels, and the sampling unit array is configured for sampling the light-emitting pixel array, so as to show the preset graphic-text information of a single color or comprehensive colors of a plurality of colors among colors of the light-emitting pixels, wherein the light-emitting pixels of the single color or the comprehensive colors of the plurality of colors show a moire magnification effect.

A system for providing an object distance of a device under test (DUT), the system including a first lens, a second lens, an optical pinhole disposed between the first lens and the second lens, a detector and a pair of gratings disposed between the second lens and the detector, the detector configured for receiving a Moiré pattern formed as a result of light from the DUT being disposed through the first lens, the optical pinhole, the second lens and the pair of gratings, wherein the object distance is determined based on the Moiré pattern and one or more properties of the pair of gratings.

A system for providing an object distance of a device under test (DUT), the system including a first lens, a second lens, an optical pinhole disposed between the first lens and the second lens, a detector and a pair of gratings disposed between the second lens and the detector, the detector configured for receiving a Moiré pattern formed as a result of light from the DUT being disposed through the first lens, the optical pinhole, the second lens and the pair of gratings, wherein the object distance is determined based on the Moiré pattern and one or more properties of the pair of gratings.

The technology disclosed relates to structured illumination microscopy (SIM). In particular, the technology disclosed relates to capturing and processing, in real time, numerous image tiles across a large image plane, dividing them into subtiles, efficiently processing the subtiles, and producing enhanced resolution images from the subtiles. The enhanced resolution images can be combined into enhanced images and can be used in subsequent analysis steps.

The technology disclosed relates to structured illumination microscopy (SIM). In particular, the technology disclosed relates to capturing and processing, in real time, numerous image tiles across a large image plane, dividing them into subtiles, efficiently processing the subtiles, and producing enhanced resolution images from the subtiles. The enhanced resolution images can be combined into enhanced images and can be used in subsequent analysis steps.

The technology disclosed relates to structured illumination microscopy (SIM). In particular, the technology disclosed relates to capturing and processing, in real time, numerous image tiles across a large image plane, dividing them into subtiles, efficiently processing the subtiles, and producing enhanced resolution images from the subtiles. The enhanced resolution images can be combined into enhanced images and can be used in subsequent analysis steps.

The technology disclosed relates to structured illumination microscopy (SIM). In particular, the technology disclosed relates to capturing and processing, in real time, numerous image tiles across a large image plane, dividing them into subtiles, efficiently processing the subtiles, and producing enhanced resolution images from the subtiles. The enhanced resolution images can be combined into enhanced images and can be used in subsequent analysis steps.

The technology disclosed present systems and methods to produce an enhanced resolution image from images of a target using structured illumination microscopy (SIM). The method includes transforming at least three images of the target captured by a sensor in a spatial domain into a Fourier domain to produce at least three frequency domain matrices that each include first blocks of complex coefficients and redundant second blocks of complex coefficients that are conjugates to the first blocks. The method includes reducing computing resources required to produce the enhanced resolution image by using first blocks of complex coefficients to produce at least three phase-separated half-matrices in the Fourier domain. The method includes performing one or more intermediate transformation on the phase-separated half-matrices to produce realigned shifted half-matrices. The method includes calculating complex coefficients of second blocks in the Fourier domain to produce full matrices from half-matrices.