The disclosure provides a method for manufacturing a conductive device substrate. First, a carrier substrate is provided and an organic pillar is formed on the carrier substrate. Subsequently, a conductive layer is formed. The conductive layer covers the organic pillar to form a conductive pillar. The conductive pillar has a first surface and a second surface opposite to each other. Next, a substrate material layer is formed to cover the conductive pillar and the carrier substrate, and the substrate material layer includes an organic material. The substrate material layer exposes the first surface of the conductive pillar. Subsequently, a device layer is formed on the substrate material layer to electrically connect to the conductive pillar. In addition, a conductive device substrate and a display panel are also provided.

An electro-optic display may comprise a front electrode having a first opening defined therein, a rear electrode having a second opening defined therein, an electro-optic layer between the front and rear electrodes and a rigid conductive component passing through the first and second openings and electrically contacting the front electrode but not the rear electrode.

An LCoS panel and a method of preparation includes wafer level packaging, manufacturing vias through a silicon substrate in each die area of a wafer substrate, and manufacturing conductive interfaces on a back surface of the wafer substrate. Each conductive interface corresponds to one via and so connected to an active circuit of the die area where the conductive interface is located. Liquid crystal packaging is applied, a seal coated to surround the pixel circuit area of the active circuit on a front surface of the wafer substrate, injecting liquid crystal into a space defined by the seal, the seal coupling glass substrate comprising a transparent conductive layer and the wafer substrate, and then cutting. Wafer level chip scale packaging of the LCoS panels is thus achieved, the cost is reduced, the obtained LCoS panels are small in total area and of greater thinness.

A display panel and a method of manufacturing the same are provided. The display panel includes a flexible substrate, a thin film transistor layer disposed on a side surface of the flexible substrate, and a light emitting structure disposed on the thin film transistor layer and electrically connected to the thin film transistor layer. The thin film transistor layer has at least one metal connection region disposed on a surface of the thin film transistor layer adjacent to the flexible substrate, and a metal trace of the thin film transistor layer is electrically connected to the at least one metal connection region via a through hole. The flexible substrate has at least one opening disposed corresponding to the at least one metal connection region to expose the at least one metal connection region.

An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

Methods of making a top-plane connection in an electro-optic device and devices including such connections. A through hole is created through a rear substrate to provide a connection between a conductor coupled to the rear substrate and a light-transmissive conductive layer coupled to a top transparent substrate. The hole is subsequently filled with a top-plane connection material that provides an electrical connection between the conductor and the light-transmissive conductive layer, but does not provide an electrical connection between a separate rear conductive layer and the light-transmissive conductor.

A light control element includes a first substrate, a first electrode, a first liquid crystal layer, a second electrode, a second substrate, a first internal conductive object, a first intermediate conductive object and a second internal conductive object. A peripheral area of the second substrate has a first through hole. The first internal conductive object is disposed in a first through hole of the second substrate. The first intermediate conductive object is disposed between the peripheral area of the second substrate and the first substrate, and is electrically connected to the first electrode and the first internal conductive object. The peripheral area of the second substrate further has a second through hole. The second internal conductive object is disposed in the second through hole of the second substrate and is electrically connected to the second electrode.

An electro-optic device includes a first electro-optic element and a second electro-optic element in series with the first electro-optic element via a common node conductively connecting the first electro-optic element to the second electro-optic element. A power supply circuitry includes a first node and a second node. The first node connects the power supply circuitry to the first electro-optic element, and the second node connects the power supply circuitry to the second electro-optic element.

1An optical device includes a substrate, a dielectric substance that is laminated on the substrate, an optical waveguide that is surrounded by the dielectric substance, and a heater electrode that is disposed on the optical waveguide and that is surrounded by the dielectric substance. The optical waveguide is a rib type optical waveguide that includes a slab and a rib on the slab, that is located below the heater electrode, and that has a structure in which a width of the slab is less than or equal to 11 times a width of the rib.

The disclosure provides a bonding structure of a lateral side of a display panel, including an array substrate, a color filter, an inner circuit, and a lateral circuit. By defining a through hole in a gate insulating layer, a second metal layer may be directly connected to a first metal layer, thereby reducing layers flaked off from a glass when a lateral side of the glass is edged.