Methods of making a top-plane connection in an electro-optic device and devices including such connections. A through hole is created through a rear substrate to provide a connection between a conductor coupled to the rear substrate and a light-transmissive conductive layer coupled to a top transparent substrate. The hole is subsequently filled with a top-plane connection material that provides an electrical connection between the conductor and the light-transmissive conductive layer, but does not provide an electrical connection between a separate rear conductive layer and the light-transmissive conductor.

Methods of making a top-plane connection in an electro-optic device and devices including such connections. A through hole is created through a rear substrate to provide a connection between a conductor coupled to the rear substrate and a light-transmissive conductive layer coupled to a top transparent substrate. The hole is subsequently filled with a top-plane connection material that provides an electrical connection between the conductor and the light-transmissive conductive layer, but does not provide an electrical connection between a separate rear conductive layer and the light-transmissive conductor.

This application discloses a display panel and a display apparatus. A non-display area in the display panel includes a plurality of fan-out areas, a drive circuit in the display panel includes a plurality of sub-drive circuits, each fan-out area is an area formed by all first metal lines connected with each sub-drive circuit, and the fan-out areas are connected with a display area and the drive circuit; each fan-out area includes a plurality of second metal lines, and each of the second metal lines is located between two adjacent first metal lines; and the surface of each fan-out area is flat.

A light control element includes a first substrate, a first electrode, a first liquid crystal layer, a second electrode, a second substrate, a first internal conductive object, a first intermediate conductive object and a second internal conductive object. A peripheral area of the second substrate has a first through hole. The first internal conductive object is disposed in a first through hole of the second substrate. The first intermediate conductive object is disposed between the peripheral area of the second substrate and the first substrate, and is electrically connected to the first electrode and the first internal conductive object. The peripheral area of the second substrate further has a second through hole. The second internal conductive object is disposed in the second through hole of the second substrate and is electrically connected to the second electrode.

A preparation method of an LCoS panel provides a wafer substrate at a wafer level, the substrate including die areas with active circuits. A seal is formed on the wafer substrate, coupling to a transparent substrate. Vias extend through a thick silicon substrate and there are conductive interfaces on the second surface in each die area, the active circuit being connected to the back side of the wafer substrate by the vias and the conductive interfaces. The wafer substrate and the transparent substrate are cut to obtain LCoS panels. These processes (especially the circuit packaging) are all performed at wafer level, improving production efficiency and reducing production cost. An LCoS panel so prepared is also disclosed.

The disclosure provides a bonding structure of a lateral side of a display panel, including an array substrate, a color filter, an inner circuit, and a lateral circuit. By defining a through hole in a gate insulating layer, a second metal layer may be directly connected to a first metal layer, thereby reducing layers flaked off from a glass when a lateral side of the glass is edged.

A display device includes: a first substrate, including: a gate line having an extension direction; a switch unit electrically connecting to the gate line; a pixel electrode electrically connecting to the switch unit; and a slit in the pixel electrode, wherein a virtual line parallel to the extension direction passes through an end point of the slit which is closest to the gate line, and the pixel electrode is divided into a first portion and a second portion by the virtual line, wherein the first portion is closer to the gate line than the second portion, the first portion and the second portion respectively have a first width and a second width along the extension direction, the first width is a maximum width of the first portion, the second width is a maximum width of the second portion, and the second width is less than the first width.

A display panel and a method of manufacturing the same are provided. The display panel includes a flexible substrate, a thin film transistor layer disposed on a side surface of the flexible substrate, and a light emitting structure disposed on the thin film transistor layer and electrically connected to the thin film transistor layer. The thin film transistor layer has at least one metal connection region disposed on a surface of the thin film transistor layer adjacent to the flexible substrate, and a metal trace of the thin film transistor layer is electrically connected to the at least one metal connection region via a through hole. The flexible substrate has at least one opening disposed corresponding to the at least one metal connection region to expose the at least one metal connection region.

An electronic device may be provided with a display having a thin-film transistor layer. One or more holes in the thin-film transistor layer may be used to form pathways from display circuitry to other circuitry underneath the display. One or more conductive bridges may pass through holes in the thin-film transistor layer and may have one end that couples to the display circuitry and a second end that couples to a printed circuit underneath the display. These conductive bridges may be formed from wire bonding. Wire bond connections may be encapsulated with potting material to improve the reliability of the wire bond and increase the resiliency of the display. Display signal lines may be routed through holes in a thin-film transistor layer to run along a backside of the display thereby reducing the need for space in the border region for display circuitry.

A plurality of LEDs (light sources) 16 that are arranged to form a column, each of which includes a electrode 20 for power supply, a plurality of first wires 21 that are connected to the electrode 20 in the plurality of LEDs 16, and a second wire 22 that is connected with each of the plurality of first wires 21 and is pulled out toward one end side in an array direction of the plurality of LEDs 16 are included.