Bonding structure of lateral side of display panel

Abstract

The disclosure provides a bonding structure of a lateral side of a display panel, including an array substrate, a color filter, an inner circuit, and a lateral circuit. By defining a through hole in a gate insulating layer, a second metal layer may be directly connected to a first metal layer, thereby reducing layers flaked off from a glass when a lateral side of the glass is edged.

Claims

1. A bonding structure of a lateral side of a display panel, comprising: an array substrate and a color filter disposed opposite to the array substrate; an inner circuit disposed on the array substrate; and a lateral circuit perpendicular to the array substrate and connected to the inner circuit; wherein the inner circuit includes a first metal layer and a second metal layer, and the second metal layer is disposed on and directly connected to the first metal layer; wherein the inner circuit further comprises a passivation layer and a gate insulating layer; the gate insulating layer is disposed on the first metal layer and the array substrate, the gate insulating layer comprises a through hole, and the through hole exposes the first metal layer; the second metal layer is connected to the first metal layer by the through hole; and the passivation layer covers the gate insulating layer and the second metal layer; and wherein a width of the through hole is greater than a width of the first metal layer; and the width of the through hole is greater than a width of the second metal layer.

2. The bonding structure of a lateral side of a display panel of claim 1, wherein the second metal layer comprises at least one barrier and a second metal body layer; the second metal body layer is disposed on the first metal layer; and the barrier is disposed in the through hole and is attached to a lateral side of the first metal layer.

3. The bonding structure of a lateral side of a display panel of claim 1, wherein the lateral circuit comprises: a metal-printed layer disposed on a lateral side of the array substrate; a conductive adhesive layer attached to the metal-printed layer; and a chip on film (COF) attached to a side of the conductive adhesive layer away from the metal-printed layer.

4. The bonding structure of a lateral side of a display panel of claim 3, wherein the metal-printed layer is a silver-line-printed circuit.

5. The bonding structure of a lateral side of a display panel of claim 3, wherein the conductive adhesive layer comprises a plurality of conductive particles and a resin adhesive.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

(1) The accompanying figures to be used in the description of embodiments of the present disclosure or prior art will be described in brief to more clearly illustrate the technical solutions of the embodiments or the prior art. The accompanying figures described below are only part of the embodiments of the present disclosure, from which those skilled in the art can derive further figures without making any inventive efforts.

(2) FIG. 1 is a schematic plan diagram showing a circuit under a glass according to a conventional technology.

(3) FIG. 2 is a sectional schematic structural diagram taken along line Y1-Y2 in FIG. 1.

(4) FIG. 3 is a sectional schematic structural diagram taken along line X1-X2 in FIG. 1.

(5) FIG. 4 is a schematic structural diagram showing a bonding structure of a lateral side of a display panel according to the present disclosure.

(6) FIG. 5 is a schematic plan diagram showing an inner circuit according to a first embodiment of the present disclosure.

(7) FIG. 6 is a vertical sectional diagram taken along line Y1-Y2 in FIG. 5 according to the first embodiment of the present disclosure.

(8) FIG. 7 is a horizontal sectional diagram taken along line X1-X2 in FIG. 5 according to the first embodiment of the present disclosure.

(9) FIG. 8 is a vertical sectional diagram showing an inner circuit according to a second embodiment of the present disclosure.

(10) FIG. 9 is a vertical sectional diagram showing an inner circuit according to a third embodiment of the present disclosure.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION

(11) The following description of the various embodiments is provided with reference to the accompanying drawings. It should be understood that terms such as “upper”, “lower”, “front”, “rear”, “left”, “right”, “inside”, “outside”, “lateral”, as well as derivative thereof should be construed to refer to the orientation as then described or as shown in the drawings under discussion. Thus, features limited by “first” and “second” are intended to indicate or imply including one or more than one these features. In the drawings, the identical or similar reference numerals constantly denote the identical or similar elements or elements having the identical or similar functions.

(12) Examples of the described embodiments are given in the accompanying drawings, and the specific embodiments described with reference to the accompanying drawings are all exemplary and are intended to interpret the practical application of the present disclosure, which shall not be construed as causing limitations to the present disclosure. Therefore, those skilled in the art can understand the described embodiments and modifications to the described embodiments.

(13) As shown in FIG. 4, a bonding structure 30 of a lateral side of a display panel provided by the present disclosure includes an array substrate 21, a color filter 22, an inner circuit 100, and a lateral circuit 200.

(14) The array substrate 21 is disposed opposite to the color filter 22. A transparent electrode is disposed on a side of the color filter 22 near the array substrate 21.

(15) The inner circuit 100 of a first embodiment may be referred to FIG. 5 and FIG. 6. The inner circuit 100 is disposed on the array substrate 21 and includes a first metal layer 101, a second metal layer 103, a passivation layer 104, and a gate insulating layer 102. The second metal layer 103 is disposed on the first metal layer 101 and is directly connected to the first metal layer 101.

(16) The first metal layer 101 is disposed on the array substrate 21.

(17) The gate insulating layer 102 is disposed on the array substrate 21 and the first metal layer 101. The gate insulating layer 102 is disposed on the first metal layer 101 and includes a through hole 1021. The through hole 1021 extends through the first metal layer 101 and reaches a surface of the first metal layer 101, and the second metal layer 103 is directly connected to the first metal layer 101 by the through hole 1021.

(18) A width of the through hole 1021 is greater than a width of the first metal layer 101, and the width of the through hole 1021 is greater than a width of the second metal layer 103.

(19) The second metal layer 103 includes at least one barrier 1032 and a second metal body layer 1031, and the at least one barrier 1032 is connected to the second body layer 1031.

(20) The second metal body layer 1031 is disposed on the first metal layer 101, and the barrier 1032 is disposed in the through hole 1021 and is attached to a lateral side of the first metal layer 101.

(21) Therefore, the second metal layer 103 may cover the first metal layer 101 by the second metal body layer 1031 and the barrier 1032, thereby protecting the first metal layer 101 and preventing the first metal layer 101 from being etched when the second metal layer 103 is etched.

(22) The passivation layer 104 is disposed on the gate insulating layer 102 and the second metal layer 103.

(23) The lateral circuit 200 is perpendicular to the array substrate 21 and is connected to the inner circuit 100. The lateral circuit 200 includes a metal-printed layer 201, a conductive adhesive layer 202, and a chip on film (COF) 203.

(24) The metal-printed layer 201 is disposed on a lateral side of the array substrate 21 and is attached to lateral sides of the array substrate 21, the inner circuit 100, and the color filter 22. The metal-printed layer 201 is a silver-line-printed circuit.

(25) The conductive adhesive layer 202 is attached to the metal-printed layer 201 and includes a plurality of conductive particles 2021 and a resin adhesive 2022.

(26) The COF 203 is attached to a side of the conductive adhesive layer 202 away from the metal-printed layer 201. The lateral circuit 200 may transmit integrated circuit signals of the COF 203 to the inner circuit 100 to display images on a panel.

(27) In the present disclosure, the first metal layer 101 is not connected to the second metal layer 103 by the transparent electrode. Instead, the first metal layer 101 and the second metal layer 103 are directly connected to each other. In a process of manufacturing narrow frames, metal balls in a metal-ball adhesive are compressed into the inner circuit 100 and are isolated from the metal layers by the passivation layer 104 so that the metal balls will not be connected to the metal layers. As a result, a short circuit problem is solved.

(28) As shown in FIG. 7, a structure of layers provided by the present disclosure does not include a concave-convex surface, and the first metal layer 101 is connected to the second metal layer 103, thereby reducing layers flaked off from a glass when a lateral surface of the glass is edged.

(29) The present disclosure provides the bonding structure 100 of a lateral side of a display panel. By defining the through hole 1021 in the gate insulating layer 102, the second metal layer 103 and the first metal layer 101 may be directly connected to each other, thereby reducing layers flaked off from the glass when the lateral side of the glass is edged. Furthermore, by adjusting the size of the through hole 1021, the second metal layer 103 may cover the first metal layer 101 so that the first metal layer 101 may be protected when the second metal layer 103 is etched. In addition, the inner circuit 100 is isolated from the transparent electrode of the color filter 22 by the passivation layer 104. Therefore, in a process of manufacturing narrow frames, metal balls in the metal-ball adhesive are compressed into the inner circuit 100 and are isolated from the metal layers by the passivation layer 104 so that the metal balls will not be connected to the metal layers. As a result, a short circuit problem is solved.

(30) As shown in FIG. 8, a second embodiment of the present disclosure further provides a bonding structure 30a of a lateral side of a display panel. Differences between the first embodiment and the second embodiment are: in the second embodiment, a width of a through hole 1021a is greater than a width of a first metal layer 101a, and the width of the through hole 1021a is less than a width of the second metal layer 103a.

(31) A gap 1022a is defined beside a lateral side of the first metal layer 101a away from the through hole 1021a. The second metal layer 103a is disposed on a gate insulating layer 102a and the first metal layer 101a and fills the gap 1022a. The second metal layer 103a includes at least one notch 1033a corresponding to the gap 1022a.

(32) Compared to the first embodiment, in the second embodiment, a contact area between the second metal layer 103a and the gate insulating layer 102a is enlarged so that a contact area between the second metal layer 103a and layers is enlarged as well. Therefore, layers flaked off from a glass may be reduced when a lateral side of the glass is edged.

(33) As shown in FIG. 9, a third embodiment of the present disclosure further provides a bonding structure 30b of a lateral side of a display panel. Differences between the first embodiment and the third embodiment are: in the third embodiment, a width of a through hole 1021b is less than a width of a first metal layer 101b so that a portion of a gate insulating layer 102b is disposed on the first metal layer 101b; the width of the through hole 1021b is less than a width of the second metal layer 103b so that at least one protrusion 1034b of the second metal layer 103b is disposed on the gate insulating layer 102b.

(34) The second metal layer 103b includes at least one protrusion 1034b and a second metal body layer 1031b, and the at least one protrusion 1034b is connected to the second body layer 1031b.

(35) The second metal body layer 1031b is disposed on the first metal layer 101b and is attached to a lateral side of the through hole 1021b. The protrusion 1034b is defined on the gate insulating layer 102b.

(36) The preferred embodiments are not intended to limit the present disclosure, and it is understood that many changes and modifications to the described embodiments can be carried out without departing from the scope and the spirit of the disclosure that is intended to be limited only by the appended claims.