Disclosed are structures as well as methods of manufacture and operation of integrated optoelectronic devices that facilitate directly heating the diode or waveguide structures to regulate a temperature of the device while allowing electrical contacts to be placed close to the device to reduce the electrical resistance. Embodiments include, in particular, heterogeneous electro-absorption modulators that include a compound-semiconductor diode structure placed above a waveguide formed in the device layer of an SOI substrate.

Disclosed are structures as well as methods of manufacture and operation of integrated optoelectronic devices that facilitate directly heating the diode or waveguide structures to regulate a temperature of the device while allowing electrical contacts to be placed close to the device to reduce the electrical resistance. Embodiments include, in particular, heterogeneous electro-absorption modulators that include a compound-semiconductor diode structure placed above a waveguide formed in the device layer of an SOI substrate.

A method for manufacturing a light guide plate (LGP) positioning block thereof includes providing a positioning block body of a LGP positioning block and filling and sealing a liquid in a receiving compartment formed in the interior of the positioning block body. The liquid is expandable with a drop of temperature so as to increase a volume thereof and thus enlarge a size of the positioning block body through elasticity of the positioning block body. In this way, the LGP positioning block is adjustable with the variation of the surrounding temperature so as to achieve effective positioning of the light guide plate and providing high reliability of a liquid crystal display device including the light guide plate.

An electro-absorption modulator (EAM) comprising an integrated high speed electro-optical control loop for very high-speed linearization and temperature compensation for analog optical data center interconnect applications is disclosed. The control loop can function in a stable manner because the electronics and optical components are monolithically integrated on a single substrate in small form factor. Because of the small size enabled by monolithic integration, the temperatures of the optical blocks and electronics blocks are tightly coupled, and the control loop time delays and phase delays are small enough to be stable, even for very high frequency operation. This arrangement enables a low cost, low power analog transmitter implementation for data center optical interconnect applications using advanced modulation schemes, such as PAM-4 and DP-QPSK.

An electro-absorption modulator (EAM) comprising an integrated high speed electro-optical control loop for very high-speed linearization and temperature compensation for analog optical data center interconnect applications is disclosed. The control loop can function in a stable manner because the electronics and optical components are monolithically integrated on a single substrate in small form factor. Because of the small size enabled by monolithic integration, the temperatures of the optical blocks and electronics blocks are tightly coupled, and the control loop time delays and phase delays are small enough to be stable, even for very high frequency operation. This arrangement enables a low cost, low power analog transmitter implementation for data center optical interconnect applications using advanced modulation schemes, such as PAM-4 and DP-QPSK.

A method for manufacturing a light guide plate (LGP) positioning block thereof includes providing a positioning block body of a LGP positioning block and filling and sealing a liquid in a receiving compartment formed in the interior of the positioning block body. The liquid is expandable with a drop of temperature so as to increase a volume thereof and thus enlarge a size of the positioning block body through elasticity of the positioning block body. In this way, the LGP positioning block is adjustable with the variation of the surrounding temperature so as to achieve effective positioning of the light guide plate and providing high reliability of a liquid crystal display device including the light guide plate.

An electro-absorption bias circuit may include a temperature sensor. The electro-absorption bias circuit may include a controller to provide a temperature-dependent control signal based on data received from the temperature sensor. The electro-absorption bias circuit may include a power supply to provide an output voltage based on the temperature-dependent control signal from the controller. The electro-absorption bias circuit may include an electro-absorption driving circuit to output a bias voltage applied to the output voltage provided by the power supply.

A liquid-crystal variable retarder has first and second liquid-crystal cells with respective first and second thicknesses, the second thickness being less than the first thickness. A feedback sensor provides a feedback signal indicative of a retardance of the liquid-crystal variable retarder. A controller is coupled to the feedback sensor and the first and second liquid-crystal cells. The controller is operable to apply a first signal to the first liquid-crystal cell based on a target retardance trajectory and a feedforward control model. The controller applies a second signal to the second liquid-crystal cell based on the feedback signal and the target retardance trajectory.

In a mirror display apparatus, a mirror optical element in which reflectance and transmittance vary in opposite directions to each other by electric driving is disposed on a front surface side of a monitor display device. An operation mode of the mirror display apparatus is switchable between a monitor mode and a mirror mode for use. A temperature sensor is installed to a mirror display apparatus. In the monitor mode, the temperature sensor is used for a temperature control of the monitor display device, or a temperature compensation control related to display quality, or the both. In the mirror mode in which the mirror optical element is in a reflectance-reduced reflection mirror state, the temperature sensor is used for a temperature compensation control of reflectance of the mirror optical element.

An integrated high speed electro-optical control loop for very high-speed linearization and temperature compensation of an electro-absorption modulator (EAM) for analog optical data center interconnect applications is disclosed. The control loop can function in a stable manner because the electronics and optical components are monolithically integrated on a single substrate in small form factor. Because of the small size enabled by monolithic integration, the temperatures of the optical blocks and electronics blocks are tightly coupled, and the control loop time delays and phase delays are small enough to be stable, even for very high frequency operation. This arrangement enables a low cost, low power analog transmitter implementation for data center optical interconnect applications using advanced modulation schemes, such as PAM-4 and DP-QPSK.