The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

The imaging device includes a multiple-property lens that includes a first area having a first property and a second area having a second property different from the first property, an image sensor in which a first light receiving element 25A and a second light receiving element 25B having a different opening size of a light receiving section from the first light receiving element 25A are two-dimensionally arranged, and a crosstalk removal processing unit that removes a crosstalk component from each of a first crosstalk image acquired from the first light receiving element 25A of the image sensor and a second crosstalk image acquired from the second light receiving element to generate a first image and a second image respectively having the first property and the second property of the multiple-property lens.

A module device for a camera system having a housing device, which is provided with an inner opening and configured to allow an adjustment of an installation position of the module device in a motor vehicle; it also includes a sensor holder device which has an upper region and a base region, is coupled to the housing device via at least one support element and configured to accommodate an image sensor; a lens apparatus which is coupled to the sensor holder device in the upper region via at least one connection element and configured to generate an optical image on the image sensor; and a retaining spring device which is coupled to the housing device and the base region of the sensor holder device and is configured to press the image sensor against the sensor holder device.