Module device for a camera system, retaining spring device and corresponding camera system

Abstract

A module device for a camera system having a housing device, which is provided with an inner opening and configured to allow an adjustment of an installation position of the module device in a motor vehicle; it also includes a sensor holder device which has an upper region and a base region, is coupled to the housing device via at least one support element and configured to accommodate an image sensor; a lens apparatus which is coupled to the sensor holder device in the upper region via at least one connection element and configured to generate an optical image on the image sensor; and a retaining spring device which is coupled to the housing device and the base region of the sensor holder device and is configured to press the image sensor against the sensor holder device.

Claims

1. A module device for a camera system, comprising: a housing device having an inner opening to allow an adjustment of an installation position of the module device in a motor vehicle; a sensor holder device, which has an upper region and a base region and is coupled to the housing device via at least one support element and to accommodate an image sensor; a lens apparatus, which is coupled to an interior surface of the sensor holder device in the upper region via at least one portion of the lens apparatus forming a connection element, and is set up to generate an optical image on the image sensor; and a retaining spring device which is coupled to an exterior surface of the base region of the sensor holder device and configured to press the image sensor with a heat-conducting intermediate layer against the base region of the sensor holder device by a spring force and to thereby form a heat-conduction path across the heat-conducting intermediate layer, wherein the retaining spring device consists of at least one of a flat spring, a leaf spring, a form spring, and a bent wire part, wherein the retaining spring device is configured to generate a contact pressure which presses the sensor holder device against the housing device.

2. The module device of claim 1, wherein the retaining spring device includes one of steel, spring steel, stainless steel, non-ferrous metal, a fiber composite material, and a fiber-glass reinforced plastic.

3. The module device of claim 1, wherein a three-point support is between the sensor holder device and the housing device with the aid of three support elements.

4. The module device of claim 1, wherein the image sensor includes light-sensitive electronic components and is developed as a CCD image sensor.

5. The module device of claim 1, wherein the at least one connection element of the sensor holder device provides an accurate opening.

6. The module device of claim 1, wherein the retaining spring device is provided to establish a heat-conducting path from the image sensor to the housing device.

7. The module device of claim 1, wherein the retaining spring device is a cooling element for the heat radiation of the waste heat of the heat-producing image sensor.

8. The module device of claim 1, wherein the contact pressure is configured to be exerted on the at least one support element.

9. The module device of claim 1, wherein the housing device is provided with at least one adjustment device, wherein the at least one adjustment device is configured to accommodate the at least one support element.

10. The module device of claim 9, wherein the contact pressure is exerted on the at least one support element to press the at least one support element against the at least one adjustment device.

11. A camera system for a motor vehicle, comprising a module device for the camera system, including: a housing device having an inner opening to allow an adjustment of an installation position of the module device in the motor vehicle; a sensor holder device, which has an upper region and a base region and is coupled to the housing device via at least one support element and to accommodate an image sensor; a lens apparatus, which is coupled to an interior surface of the sensor holder device in the upper region via at least one portion of the lens apparatus forming a connection element, and is set up to generate an optical image on the image sensor; and a retaining spring device which is coupled to an exterior surface of the base region of the sensor holder device and configured to press the image sensor with the heat-conducting intermediate layer against the base region of the sensor holder device by a spring force and to thereby form a heat-conduction path across the heat-conducting intermediate layer; a camera electronics system for signal conversion, the camera electronics system being integrated on a main board, coupled to the image sensor of the module device to convert signals received from the image sensor into image information; and a camera housing to accommodate the module device and the main board and which includes an adjustment recess, to accommodate the retaining spring device and to fixate the module device within the camera housing, wherein the retaining spring device consists of at least one of a flat spring, a leaf spring, a form spring, and a bent wire part, wherein the retaining spring device is configured to generate a contact pressure which presses the sensor holder device against the housing device.

12. The camera system of claim 11, further comprising: a window mount, which is coupled to the camera housing to connect the camera system to the motor vehicle.

13. The camera system of claim 11, wherein the contact pressure is configured to be exerted on the at least one support element.

14. The camera system of claim 11, wherein the housing device is provided with at least one adjustment device, wherein the at least one adjustment device is configured to accommodate the at least one support element.

15. The camera system of claim 14, wherein the contact pressure is exerted on the at least one support element to press the at least one support element against the at least one adjustment device.

16. A retaining spring device, comprising: a retaining spring arrangement which is coupled to an exterior surface of a base region of a sensor holder device to press an image sensor with a heat-conducting intermediate layer against the base region of the sensor holder device and to thereby form a heat-conduction path across the heat-conducting intermediate layer, wherein an interior surface of the sensor holder device is coupled to a lens apparatus via at least one portion of the lens apparatus forming a connection element, wherein the retaining spring arrangement consists of at least one of a flat spring, a leaf spring, a form spring, and a bent wire part, wherein the retaining spring device is configured to generate a contact pressure which presses the sensor holder device against a housing device.

17. The retaining spring device of claim 16, wherein the contact pressure is configured to be exerted on the at least one support element.

18. The retaining spring device of claim 16, wherein the housing device is provided with at least one adjustment device, wherein the at least one adjustment device is configured to accommodate the at least one support element.

19. The retaining spring device of claim 18, wherein the contact pressure is exerted on the at least one support element to press the at least one support element against the at least one adjustment device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a schematic representation of a module device for a camera system according to one specific embodiment of the present invention.

(2) FIG. 2 shows a schematic representation of a camera system according to another specific embodiment of the present invention.

(3) FIGS. 3a, 3b, and 3c shows three schematic representations of adjustment devices and associated support elements according to three additional specific embodiments of the invention.

(4) FIG. 4 shows a schematic illustration of adjustment devices and an inner opening of a sensor holder device according to a further specific embodiment of the invention.

(5) FIG. 5a shows a schematic representation of a module device for a camera system according to another specific embodiment of the present invention.

(6) FIG. 5b shows a schematic representation of a sensor holder device according to another specific embodiment of the present invention.

(7) FIG. 5c shows a schematic representation of a retaining spring device according to another specific embodiment of the present invention.

(8) FIG. 5d shows a schematic representation of a module device for a camera system according to a further specific embodiment of the present invention.

(9) FIG. 6 shows an exemplary illustration of a camera module according to the related art.

DETAILED DESCRIPTION

(10) Unless stated otherwise, identical or functionally equivalent elements, features and components have been provided with the same reference symbols in the figures of the drawings.

(11) It is furthermore understood that components and elements in the figures are not necessarily depicted true to scale with respect to one another for reasons of clarity and comprehensibility.

(12) FIG. 1 shows a schematic representation of a module device for a camera system according to one specific embodiment of the present invention.

(13) A module device 100 for a camera system includes a housing device 140, a sensor holder device 130, a lens apparatus 120, and a retaining spring device 170.

(14) Housing device 140, for example, has an inner opening 140a and is configured to allow an adjustment of an installation position of module device 100 in a motor vehicle.

(15) Sensor holder device 130, for instance, has an upper region 130a and a base region 130b and is coupled to housing device 140 via at least one support element 131a-131c. In addition, sensor holder device 130 is configured to accommodate an image sensor 150, for instance.

(16) Moreover, housing unit 140 is provided with at least one adjustment device 141a-141c to accommodate the at least one support element 131a-131c.

(17) For example, image sensor 150 is configured as a sensor for recording two-dimensional images by a light-induced electrical signal generation, e.g., as a CCD sensor or as CCD image sensors, or as CMOS sensor having color-sensitive sensors disposed next to or on top of one another. CCD means a charge-coupled device.

(18) Lens apparatus 120, for example, is coupled to sensor holder device 130 in upper region 130a via at least one connection element 132a, 132b, and furthermore set up to generate an optical image on image sensor 150. Lens apparatus 120, for instance, has a multitude of optical lenses 161, 162, 163, 164, 165. Lenses 161, 162, 163, 164, 165 form a lens in the form of an optical lens system having an optical axis OA.

(19) Retaining spring device 170 is coupled to base region 130b of sensor holder device 130, for example, and configured to press image sensor 150 against sensor holder device 130. Retaining spring device 170 may be developed to be pressed against base region 130b of sensor holder device 130.

(20) For example, a heat-conducting intermediate layer 151 is developed between retaining spring device 170 and image sensor 150, which enables heat-conducting contacting of image sensor 150 at low mechanical stressing of the surface of image sensor 150.

(21) Using at least one connection device 145a, 145b, retaining spring device 170 is able to be coupled to base region 130b of sensor holder device 130. Base region 130b may be provided with corresponding notched elements 146a, 146b for this purpose.

(22) The at least one connection device 145a, 145b is developed as a screw connection, for example. In the same way, the at least one connection device 145a, 145b is able to be developed as a rivet or clamping connection or as some other mounting arrangement.

(23) FIG. 2 shows a schematic representation of a camera system according to another specific embodiment of the present invention.

(24) The camera system for a motor vehicle includes a module device 100, a camera electronics system 200, and a camera housing 300.

(25) Module device 100 includes housing device 140, sensor holder device 130, lens apparatus 120, and retaining spring device 170.

(26) Sensor holder device 130 is developed from a thermoplastic material or some other plastic material, for example, which is able to be deformed within a specific temperature range; it is provided with a patterned metallic coating, for instance, via which image sensor 150 is contactable by way of bond wiring.

(27) Camera electronics system 200 is set up for a signal conversion, integrated on a main board 210, coupled to image sensor 150 of module device 100, and configured to convert signals received from image sensor 150 into image information.

(28) Camera housing 300 is developed to accommodate module device 100 and main board 210 and includes a retaining mount for installing the camera system.

(29) Module device 100 is secured in place on the front window of the motor vehicle with the aid of window mount 320, for example. Adjustment pins 320a seated in support seats 300a adjust camera housing 300 in relation to the motor vehicle. Retaining spring device 170 adjusts the module device in relation to camera housing 300.

(30) Housing device 140 of module device 100 may be permanently connected to camera housing 300.

(31) The electrical contacting of image sensor 150 is accomplished by wire bonds with main board 210.

(32) The mechanical coupling of camera housing 300 to window mount 320 may take the form of clips, bonding, clamping or screw connections. A position determination is made via adjustment device 141a-141c in conjunction with support elements 131a-131c, which are developed as 3-point support, for instance.

(33) FIGS. 3a, 3b and 3c show three schematic representations of adjustment devices and associated support elements according to three additional specific embodiments of the present invention.

(34) Adjustment devices 141a-141c, as shown in FIG. 3a, are developed as spherical recesses, for example, and provided to accommodate the at least one conical support element 131a-131c.

(35) Adjustment devices 141a-141c, as shown in FIG. 3b, are developed as recesses in the form of a notch, for example, and provided to accommodate the at least one support element 131a-131c having a spherical surface.

(36) Adjustment device 141a, as shown in FIG. 3c, is developed as a spherical recess, for example, and provided to accommodate the at least one conical support element 131a.

(37) FIG. 3c illustrates the location of sensor holder device 130 where retaining spring 170 exerts a contact pressure F on conical support element 131a of sensor holder device 130 in order to press conical support element 131a against spherical adjustment device 141a.

(38) The use of appropriately developed support elements 131a-131c and associated adjustment devices 141a-141c makes it possible to achieve a self-adjustment of module device 100, especially a self-adjustment of the position of sensor holder device 130 in relation to the position of housing device 140, this being accomplished by a contact pressure F generated by retaining spring device 170.

(39) Because of contact pressure F generated in this manner, it is possible to shift sensor holder device 130 and housing device 140 into the particular position that allows a maximum expansion of retaining spring device 170.

(40) FIG. 4 shows a schematic illustration of adjustment devices 141a-141c and an inner opening 143 of a sensor holder device 130 according to one further specific embodiment of the invention.

(41) In the specific embodiment of sensor holder device 130 shown in FIG. 4, adjustment devices 141a-141c are realized in the form of a V-trough structure. An inner opening 143 of sensor holder device 130 allows the accommodation of lens apparatus 120.

(42) FIG. 5a shows a schematic representation of a module device for a camera system according to another specific embodiment of the present invention.

(43) The module device includes sensor holder device 130, housing device 140, and retaining spring device 170.

(44) Sensor holder device 130, housing device 140 and lens apparatus 120 are furthermore developed as a three-dimensional cast circuit support, a molded interconnect device (MID).

(45) FIG. 5b shows a schematic representation of a sensor holder device according to another specific embodiment of the present invention.

(46) Sensor holder device 130 is developed in one piece, for instance, but it may also consist of multiple pieces.

(47) FIG. 5c shows a schematic representation of a retaining spring device according to another specific embodiment of the present invention.

(48) Retaining spring device 170 is configured as a leaf spring, for example, and formed by a flat metal band that is prestressed in the form of an arch. Retaining spring device 170 could include steel, spring steel, stainless steel, non-ferrous metal, a fiber composite material or a fiber-glass reinforced plastic.

(49) FIG. 5d shows a schematic representation of a module device for a camera system according to a further specific embodiment of the present invention.

(50) Housing device 140 is developed as a three-dimensional cast formed part, for example.

(51) Although the present invention was described above with reference to exemplary embodiments, it is not limited to these, but may be modified in numerous ways.