Image transfer articles including a substrate comprising a top surface and a bottom surface, a melt transfer layer having a top surface and a bottom surface, the bottom surface removably located on the top surface of the substrate, and an image receiving layer having an image receiving surface configured to receive indicia or an image and positionable against a receptor element during a transfer process, wherein the image receiving layer comprises at least one wax coated silica. The image receiving layer may further include at least one binder such as an ethylene acrylic acid binder. The imaging layer may also include wax-based water repellant, and together the wax coated silica and wax-based water repellant may comprise about 30% to about 40% of the image receiving layer on a dry weight basis.

To provide a laminate which enables pattern formation with excellent opening shape even in the case where a chemically amplified negative type resist material is used, and a pattern forming method in which the laminate is used. The laminate includes a chemically amplified negative type resist layer, and a basic resin coat layer thereon that contains 0.001 to 10% by weight of a basic compound having a molecular weight of up to 10,000.

A laminate comprising a thermoplastic film and a positive resist film is provided, the positive resist film comprising (A) a novolak resin-naphthoquinone diazide (NQD) base resin composition, (B) a polyester, and (C) 3-30 wt % of an organic solvent. The resist film may be transferred to a stepped support without forming voids.

A laminate comprising a thermoplastic film and a positive resist film is provided, the positive resist film comprising (A) a novolak resin-naphthoquinone diazide (NQD) base resin composition, (B) a polyester, and (C) 3-30 wt % of an organic solvent. The resist film may be transferred to a stepped support without forming voids.

A laminate comprising a thermoplastic film and a positive resist film is provided, the positive resist film comprising (A) a novolak resin-naphthoquinone diazide (NQD) base resin composition, (B) a polyester, and (C) 3-30 wt % of an organic solvent. The resist film may be transferred to a stepped support without forming voids.