Patent classifications
G03F1/20
MULTI CHARGED PARTICLE BEAM WRITING APPARATUS AND METHOD OF ADJUSTING SAME
In one embodiment, a multi charged particle beam writing apparatus includes an objective lens adjusting focus positions of multiple beams, an astigmatism correction element correcting astigmatism of the multiple beams, an inspection aperture allowing one of the multiple beams to pass therethrough, a deflector deflecting the multiple beams and causing the multiple beams to scan over the inspection aperture, a current detector detecting beam currents of the individual multiple beams after passing through the inspection aperture, a beam image formation unit forming a beam image based on the detected beam currents, a feature amount calculation unit generating a first waveform and a second waveform by adding brightnesses of the beam image in a first direction and in a second direction, and calculating a first and a second feature amounts from the first and the second waveforms, and a parameter calculation unit calculating an exciting parameter that is to be set for the astigmatism correction element based on the first feature amount and the second feature amount.
Photomask
A photomask includes a patterned photomask plate and a supporting member. The patterned photomask plate has a pattern region and a peripheral region surrounding the pattern region. The patterned photomask plate includes a plurality of openings in the pattern region. The supporting member directly abuts the patterned photomask plate and is in a peripheral region of the patterned photomask plate. The supporting member is formed from a different material than the patterned photomask plate.
Photomask
A photomask includes a patterned photomask plate and a supporting member. The patterned photomask plate has a pattern region and a peripheral region surrounding the pattern region. The patterned photomask plate includes a plurality of openings in the pattern region. The supporting member directly abuts the patterned photomask plate and is in a peripheral region of the patterned photomask plate. The supporting member is formed from a different material than the patterned photomask plate.
CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS
A chemically amplified negative resist composition comprising (A) an acid generator in the form of a sulfonium salt having formula (A1) or iodonium salt having formula (A2) and (B) a base polymer containing a polymer comprising repeat units having formula (B1) is provided. The resist composition exhibits a high resolution during pattern formation and forms a pattern with satisfactory LER and fidelity.
Mask blank, phase shift mask and method for manufacturing semiconductor device
According to the present invention, provided is a mask blank (10), in which: a light shielding film (4) has a single layer structure or a laminate structure of a plurality of layers; at least one layer of the light shielding film (4) is formed of a material which contains a transition metal and silicon and is free from nitrogen and oxygen, or a material which contains a transition metal, silicon, and nitrogen and satisfies a condition of the following expression (1); a phase shift film (2) has a surface layer and a layer other than the surface layer; and the layer other than the surface layer is formed of a material which contains a transition metal, silicon, nitrogen, and oxygen, has a content of oxygen of 3 atom % or more, and satisfies a condition of the following expression (A).
C.sub.N≤9.0×10.sup.−6×R.sub.M.sup.4−1.65×10.sup.−4×R.sub.M.sup.3−7.718×10.sup.−2×R.sub.M.sup.2+3.611×R.sub.M−21.084 Expression (1)
0.04×A.sub.S−0.06×A.sub.M>1 Expression (A)
Mask blank, phase shift mask and method for manufacturing semiconductor device
According to the present invention, provided is a mask blank (10), in which: a light shielding film (4) has a single layer structure or a laminate structure of a plurality of layers; at least one layer of the light shielding film (4) is formed of a material which contains a transition metal and silicon and is free from nitrogen and oxygen, or a material which contains a transition metal, silicon, and nitrogen and satisfies a condition of the following expression (1); a phase shift film (2) has a surface layer and a layer other than the surface layer; and the layer other than the surface layer is formed of a material which contains a transition metal, silicon, nitrogen, and oxygen, has a content of oxygen of 3 atom % or more, and satisfies a condition of the following expression (A).
C.sub.N≤9.0×10.sup.−6×R.sub.M.sup.4−1.65×10.sup.−4×R.sub.M.sup.3−7.718×10.sup.−2×R.sub.M.sup.2+3.611×R.sub.M−21.084 Expression (1)
0.04×A.sub.S−0.06×A.sub.M>1 Expression (A)
RETICLE PROCESSING SYSTEM
Provided herein are apparatus, systems and methods for processing reticle blanks. A reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier base assembly supported on the support assembly. The carrier base assembly comprises a wall extending from a top surface of the carrier base and defining a containment region for a reticle.
RETICLE PROCESSING SYSTEM
Provided herein are apparatus, systems and methods for processing reticle blanks. A reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier base assembly supported on the support assembly. The carrier base assembly comprises a wall extending from a top surface of the carrier base and defining a containment region for a reticle.
MASK BLANKS AND METHODS FOR DEPOSITING LAYERS ON MASK BLANK
A reflective mask blank includes a substrate, a reflective multilayer (RML) disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer has length or width dimensions smaller than the capping layer, and part of the capping layer is exposed by the absorber layer. The dimension of the absorber layer and the hard mask layer ranges between 146 cm to 148 cm. The dimensions of the substrate, the RML, and the capping layer range between 150 cm to 152 cm.
Design-rule checking for curvilinear device features
One illustrative system includes a processor and memory storing instructions that, when executed by the processor, cause the system to receive a device layout including a curvilinear feature, define a plurality of vertices for the curvilinear feature, determine a radius of curvature between a selected vertex in the plurality of vertices and a neighboring vertex in the plurality of vertices, and identify a design rule violation for the curvilinear feature responsive to the radius of curvature being less than a predetermined threshold.