A method for in-situ generation of microbubbles is disclosed. The method includes preparing an electrochemical apparatus, where the electrochemical apparatus includes a substrate and an integrated three-electrodes array patterned on the substrate. The integrated three-electrodes array includes a working electrode, a reference electrode, and a counter electrode. The method further includes growing a nano-structured layer on the working electrode of the integrated three-electrodes array, putting the electrochemical apparatus in contact with a medium fluid, electrolyzing the medium fluid by applying an instantaneous electrical potential to the electrochemical apparatus, and generating a plurality of microbubbles around the electrochemical apparatus in contact with the medium fluid responsive to electrolyzing of the medium fluid.

Methods and systems are provided that, in some embodiments, print and process a layer. The layer can be on a wafer or on an application panel. Thereafter, locations of the features that were actually printed and processed are measured. Based upon differences between the measured differences and designed locations for those features at least one distortion model is created. Each distortion model is inverted to create a corresponding correction model. When there are multiple sections, a distortion model and a correction model can be created for each section. Multiple correction models can be combined to create a global correction model.

Embodiments of the invention include methods and structures for controlling developer critical dimension (DCD) variations across a wafer surface. Aspects of the invention include an apparatus having developer tubing and an internal cam. The internal cam is coupled to a fixed axis. A flexible divider is positioned between the developer tubing and the internal cam. The flexible divider is coupled to the internal cam such that rotation of the internal cam about the fixed axis is operable to change an inner diameter of the developer tubing.

Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. A method of processing a substrate is provided. The method includes applying a photoresist layer that includes a photoacid generator to a multi-layer disposed on the substrate. The multi-layer includes an underlayer. Further, the method includes exposing a first portion of the photoresist layer unprotected by a photomask to a radiation light in a lithographic exposure process. A thermal energy is provided to the photoresist layer and the multi-layer in a post-exposure baking process. The multi-layer is disposed beneath the photoresist layer. An electric field or a magnetic field is applied to photoresist layer and the multi-layer while performing the post-exposure baking process. An additive within the underlayer is driven in a vertical direction into the photoresist layer. The additive assist in distribution of a photoacid throughout the photoresist layer during the post-exposure baking process.

A lithographically fabricated electrode comprises a continuous metal film; and a discontinuous metal film. The discontinuous metal film has a first edge proximal to the continuous metal film, and a second edge distal the continuous metal film.

The present invention discloses preparation of a reflective image component and application method thereof. A reflective image component in the present invention consists of a metallic semi-continuous thin film, a porous alumina film and a high reflective metal substrate. The structure is easy in preparation, low in cost, environmental friendly regarding preparing procedures and suitable for large-scale fabrication, which plays a significant role in developing a next generation of image component; the minimum pixel in the image obtained is able to reach nano level, much smaller than the pixel in most of the self-luminous screens at present; the image also provides the ability of reversible color transformations, which can be applied to information encryption and trademark decoration and the like.

Embodiments related to emissive display device structures having an emissive display element and a metamaterial lens having a plurality of nanoparticles over an emissive surface of the emissive display element to control the angular distribution of light emitted from the emissive display element, displays having such controlled emissive display device structures, systems incorporating such controlled emissive display device structures, and methods for fabricating them are discussed.

Improved methods of manufacturing highly sensitive and selective electrochemical biosensors are provided. The method may comprise washing the nanowell array electrodes of the biosensors with ferricyanide, preferably potassium ferricyanide. The method may also comprise washing the electrodes of the biosensors with methylene blue (i.e., methylthioninium chloride), either in addition to the ferricyanide and/or H2SO4 washing steps, or without the ferricyanide and/or H.sub.2SO.sub.4 washing steps.

A super-resolution system for nano-patterning is disclosed, comprising an exposure head that enables a super-resolution patterning exposures. The super-resolution exposures are carried out using electromagnetic radiation and plasmonic structures, and in some embodiments, plasmonic structures having specially designed super-resolution apertures, of which the bow-tie and C-aperture are examples. These apertures create small but bright images in the near-field transmission pattern. A writing head comprising one or more of these apertures is held in close proximity to a medium for patterning. In some embodiments, a data processing system is provided to re-interpret the data to be patterned into a set of modulation signals used to drive the multiple individual channels and multiple exposures, and a detection means is provided to verify the data as written.

An electronic-component manufacturing method is for simultaneously manufacturing a plurality of electronic components each including an element body and a conductor. The electronic-component manufacturing method includes the steps of forming laminates to be the plurality of electronic components on a plurality of regions set apart from each other on a surface of a first substrate, releasing the laminates from the plurality of regions, and performing heat treatment to the laminates. The forming the laminates includes a first step of forming element-body patterns on the plurality of regions and a second step of forming conductor patterns on the plurality of regions. The element-body patterns contain a constituent material of the element bodies and are patterned for the plurality of regions. The conductor patterns contain a constituent material of the conductors and are patterned for the plurality of regions.