A reduction instruction receiver receives a reduction instruction for energy from a server. An energy setter sets, when the reduction instruction receiver receives the reduction instruction, individual target energies for the respective subsystems, the individual target energies each being a target value of a consumption energy for a corresponding subsystem such that (i) a total of individual target energies that are target values of consumption energies for the respective subsystems is smaller than a total target energy that is a target value of a consumption energy of an entirety of the subsystems, and (ii) a higher correlation among consumption energies of the respective subsystems provides an increase in a total margin energy, the total margin energy being a difference between the total target energy and the sum of the individual target energies. The control-instruction transmitter transmits control-instruction information for control of the facility device based on the set individual target energies.

A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system includes a conditioner connected to a semiconductor device manufacturing apparatus, a data collector connected to the conditioner and a processor connected to the data collector. The conditioner is configured to control a temperature and a humidity of an air and deliver the air to the semiconductor device manufacturing apparatus. The data collector is configured to collect data from the conditioner. The processor is configured to receive the data transferred from the data collector.

A method for calculating the humidity level in a cooking apparatus is disclosed. The method includes heating a food load in a cooking cavity of the cooking apparatus and selectively activating a convection fan in the cooking cavity. The method further includes monitoring a humidity signal detected by a humidity sensing apparatus in response to the activation of the convection fan. As a result of the activation of the convection fan, the method may determine an actual humidity level from a plurality of humidity levels based on a change in the humidity signal.

A method for calculating the humidity level in a cooking apparatus is disclosed. The method includes heating a food load in a cooking cavity of the cooking apparatus and selectively activating a convection fan in the cooking cavity. The method further includes monitoring a humidity signal detected by a humidity sensing apparatus in response to the activation of the convection fan. As a result of the activation of the convection fan, the method may determine an actual humidity level from a plurality of humidity levels based on a change in the humidity signal.

The present disclosure discloses an electronic cooling anti-condensation system, and an anti-condensation method for the same. The system comprises a testing chamber, electronic cooling plates, temperature sensors, a temperature and humidity sensor, a cooling plate control unit, and a main controller. The main controller is electrically connected to the temperature sensors, the temperature and humidity sensor, and the cooling plate control unit. The main controller is capable of calculating a dew point value of the air in the testing chamber according to a temperature value and a humidity value of the interior the testing chamber acquired by the temperature and humidity sensor, and if the dew point value of the air is greater than a pre-determined threshold, the main controller controls the cooling plate control unit to reduce the number of operating electronic cooling plates or output powers of the electronic cooling plates, wherein the pre-determined threshold is a temperature T1° C. of the electronic cooing plate or a temperature T1+n° C. of the electronic cooling plate acquired by the temperature sensor, and n≤is less than or equal to 10. The present disclosure achieves real-time control of operation states of the electronic cooling plates, thereby realizing redundant control of the cooling plates, and preventing the cooling plates from causing condensation in the chamber body, so as to achieve continuous operation when a failure occurs.

The present disclosure discloses an electronic cooling anti-condensation system, and an anti-condensation method for the same. The system comprises a testing chamber, electronic cooling plates, temperature sensors, a temperature and humidity sensor, a cooling plate control unit, and a main controller. The main controller is electrically connected to the temperature sensors, the temperature and humidity sensor, and the cooling plate control unit. The main controller is capable of calculating a dew point value of the air in the testing chamber according to a temperature value and a humidity value of the interior the testing chamber acquired by the temperature and humidity sensor, and if the dew point value of the air is greater than a pre-determined threshold, the main controller controls the cooling plate control unit to reduce the number of operating electronic cooling plates or output powers of the electronic cooling plates, wherein the pre-determined threshold is a temperature T1° C. of the electronic cooing plate or a temperature T1+n° C. of the electronic cooling plate acquired by the temperature sensor, and n≤is less than or equal to 10. The present disclosure achieves real-time control of operation states of the electronic cooling plates, thereby realizing redundant control of the cooling plates, and preventing the cooling plates from causing condensation in the chamber body, so as to achieve continuous operation when a failure occurs.

A sweating simulator has a foundation panel (14), a panel (1) and a temperature control panel (2), a fixture for fixing a specimen, a container (7) for holding simulated sweat, a container (15) for collecting the simulated sweat, and a plurality of weighing scales for measuring masses of the simulated sweat supplied, evaporated and dripped from the specimen, respectively. The panel (1) and temperature control panel (2) constitute a simulated sweating plane for simulating wetting properties and temperature of skin. An upper middle position of the temperature control panel (2) has a sweating zone (3), which has a plurality of sweating pores (4). The temperature control panel (2) has a temperature sensor (8) and a heating element to control the temperature of the temperature control panel (2) around 33-35° C. to simulate the temperature of the human skin surface. The sweating rate of the sweating zone (3) is in the range of about 1 to 624 ml/h or about 0.004 to 2.5 L/h-m.sup.2 to simulate various sweating intensities.

A sweating simulator has a foundation panel (14), a panel (1) and a temperature control panel (2), a fixture for fixing a specimen, a container (7) for holding simulated sweat, a container (15) for collecting the simulated sweat, and a plurality of weighing scales for measuring masses of the simulated sweat supplied, evaporated and dripped from the specimen, respectively. The panel (1) and temperature control panel (2) constitute a simulated sweating plane for simulating wetting properties and temperature of skin. An upper middle position of the temperature control panel (2) has a sweating zone (3), which has a plurality of sweating pores (4). The temperature control panel (2) has a temperature sensor (8) and a heating element to control the temperature of the temperature control panel (2) around 33-35° C. to simulate the temperature of the human skin surface. The sweating rate of the sweating zone (3) is in the range of about 1 to 624 ml/h or about 0.004 to 2.5 L/h-m.sup.2 to simulate various sweating intensities.

An arrangement for monitoring an aseptic manufacturing process includes product condition sensors capable of making closely spaced measurements of a product condition such as temperature or humidity. The measurements are made using closely spaced sensors arranged in a linear array on a single probe, which may be used to take measurements at multiple levels within the product. Data from the sensors is transmitted to a data collection point via short range wireless digital communications. The sensors may be used to measure temperature and humidity at a single point. For example, when the sensors are used in pharmaceutical freeze drying, the location of a sublimation front may be calculated for each vial, and the freeze drying process may be controlled using the data.

An arrangement for monitoring an aseptic manufacturing process includes product condition sensors capable of making closely spaced measurements of a product condition such as temperature or humidity. The measurements are made using closely spaced sensors arranged in a linear array on a single probe, which may be used to take measurements at multiple levels within the product. Data from the sensors is transmitted to a data collection point via short range wireless digital communications. The sensors may be used to measure temperature and humidity at a single point. For example, when the sensors are used in pharmaceutical freeze drying, the location of a sublimation front may be calculated for each vial, and the freeze drying process may be controlled using the data.