G06F5/06

ACCELERATION CIRCUITRY FOR POSIT OPERATIONS

Systems, apparatuses, and methods related to acceleration circuitry for posit operations are described. Signaling indicative of performance of an operation to write a first bit string to a first buffer resident on acceleration circuitry and a second bit string resident on the acceleration circuitry can be received at an DMA controller couplable to the acceleration circuitry. The acceleration circuitry can be configured to perform arithmetic operations, logical operations, or both on bit strings formatted in a unum or posit format. Signaling indicative of an arithmetic operation, a logical operation, or both, to be performed using the first and second bit strings can be transmitted to the acceleration circuitry. The arithmetic operation, the logical operation, or both can be performed via the acceleration circuitry and according to the signaling. Signaling indicative of a result of the arithmetic operation, the logical operation, or both can be transmitting to the DMA controller.

Distributed multi-die protocol application interface

Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.

USB connections

A method of configuring a Universal Serial Bus (USB) connection between a first and second devices, the USB connection comprising a plurality of data channels, each having a pair of signal links, each signal link including a port at either end of the connection, and a signal wire formed of one or more physical wires extending between corresponding ports. Each of the signal links are configured with a first direction for transmission of data. The first direction is determined based on an initial required data transmission capacity in each direction between the first and second devices. Thereafter, depending on required capacity in the different directions, a selection is made which of the signal links should change their direction of transmission from the first direction to a second direction and a redirection signal is sent to each of the selected signal links to cause the change in direction of transmission.

SEMICONDUCTOR DEVICE

A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

SEMICONDUCTOR DEVICE

A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Feature map caching method of convolutional neural network and system thereof

A feature map caching method of a convolutional neural network includes a connection analyzing step and a plurality of layer operation steps. The connection analyzing step is for analyzing a network to establish a convolutional neural network connection list. The convolutional neural network connection list includes a plurality of tensors and a plurality of layer operation coefficients. Each of the layer operation coefficients includes a step index, at least one input operand label and an output operand label. The step index as a processing order for the layer operation step. At least one of the layer operation steps is for flushing at least one of the tensors in a cache according to a distance between the at least one of the layer operation steps and a future layer operation step of the layer operation steps. The distance is calculated according to the convolutional neural network connection list.

Feature map caching method of convolutional neural network and system thereof

A feature map caching method of a convolutional neural network includes a connection analyzing step and a plurality of layer operation steps. The connection analyzing step is for analyzing a network to establish a convolutional neural network connection list. The convolutional neural network connection list includes a plurality of tensors and a plurality of layer operation coefficients. Each of the layer operation coefficients includes a step index, at least one input operand label and an output operand label. The step index as a processing order for the layer operation step. At least one of the layer operation steps is for flushing at least one of the tensors in a cache according to a distance between the at least one of the layer operation steps and a future layer operation step of the layer operation steps. The distance is calculated according to the convolutional neural network connection list.

SCREEN RESPONSE VALIDATION OF ROBOT EXECUTION FOR ROBOTIC PROCESS AUTOMATION
20210342216 · 2021-11-04 · ·

Screen response validation of robot execution for robotic process automation (RPA) is disclosed. Whether text, screen changes, images, and/or other expected visual actions occur in an application executing on a computing system that an RPA robot is interacting with may be recognized. Where the robot has been typing may be determined and the physical position on the screen based on the current resolution of where one or more characters, images, windows, etc. appeared may be provided. The physical position of these elements, or the lack thereof, may allow determination of which field(s) the robot is typing in and what the associated application is for the purpose of validation that the application and computing system are responding as intended. When the expected screen changes do not occur, the robot can stop and throw an exception, go back and attempt the intended interaction again, restart the workflow, or take another suitable action.

SCREEN RESPONSE VALIDATION OF ROBOT EXECUTION FOR ROBOTIC PROCESS AUTOMATION
20210342216 · 2021-11-04 · ·

Screen response validation of robot execution for robotic process automation (RPA) is disclosed. Whether text, screen changes, images, and/or other expected visual actions occur in an application executing on a computing system that an RPA robot is interacting with may be recognized. Where the robot has been typing may be determined and the physical position on the screen based on the current resolution of where one or more characters, images, windows, etc. appeared may be provided. The physical position of these elements, or the lack thereof, may allow determination of which field(s) the robot is typing in and what the associated application is for the purpose of validation that the application and computing system are responding as intended. When the expected screen changes do not occur, the robot can stop and throw an exception, go back and attempt the intended interaction again, restart the workflow, or take another suitable action.

MULTICHIP PACKAGE WITH PROTOCOL-CONFIGURABLE DATA PATHS
20230289309 · 2023-09-14 ·

Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1x mode or 2x mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.