Systems and methods for context aware circuit design are described herein. A method includes: identifying at least one cell to be designed into a circuit; identifying at least one context parameter having an impact to layout dependent effect of the circuit; generating, for each cell and for each context parameter, a plurality of abutment environments associated with the cell; estimating, for each cell and each context parameter, a sensitivity of at least one electrical property of the cell to the context parameter by generating a plurality of electrical property values of the cell under the plurality of abutment environments; and determining whether each context parameter is a key context parameter for a static analysis of the circuit, based on the sensitivity of the at least one electrical property of each cell and based on at least one predetermined threshold.

Methods, machine readable media and systems for simulating the leakage of sensitive data in an integrated circuit, such as cryptographic data or keys, are described. In one embodiment, a method can include the following operations: performing a first dynamic voltage drop (DVD) simulation on a plurality of locations, distributed across an integrated circuit (IC), based on a physical model that specifies physical layout of components on the IC, the IC storing sensitive data in locations of the layout; performing an IC level side channel correlation analysis between each of the locations and the sensitive data based on the results of the first DVD simulation; and selecting, based upon the IC level side channel correlation analysis, a subset of the locations for further simulations to simulate leakage of the sensitive data. Other methods, media and systems are disclosed.

Systems and methods for context aware circuit design are described herein. A method includes: identifying at least one cell to be designed into a circuit; identifying at least one context parameter having an impact to layout dependent effect of the circuit; generating, for each cell and for each context parameter, a plurality of abutment environments associated with the cell; estimating, for each cell and each context parameter, a sensitivity of at least one electrical property of the cell to the context parameter by generating a plurality of electrical property values of the cell under the plurality of abutment environments; and determining whether each context parameter is a key context parameter for a static analysis of the circuit, based on the sensitivity of the at least one electrical property of each cell and based on at least one predetermined threshold.

Disclosed is a method implemented with a computer system executing instructions for a semiconductor design simulation. The method includes generating a plurality of floor plans placing a plurality of circuit blocks differently, generating a plurality of power models from the plurality of floor plans, and selecting a layout corresponding to one of the plurality of floor plans by selecting at least one power model satisfying system requirements from among the plurality of power models.

Machine assisted systems and methods for enhancing the resolution of an IC thermal profile from a system analysis are described. These systems and methods can use a neural network based predictor, that has been trained to determine a temperature rise across an entire IC. The training of the predictor can include generating a representation of two or more templates identifying different portions of an integrated circuit (IC), each template associated with location parameters to position the template in the IC; performing thermal simulations for each respective template of the IC, each thermal simulation determining an output based on a power pattern of tiles of the respective template, the output indicating a change in temperature of a center tile of the respective template relative to a base temperature of the integrated circuit; and training a neural network. The trained predictor can be used to determine a temperature rise and then can be appended to a system level thermal profile of the IC to generate a detailed thermal profile of the IC.

The present disclosure provides an electronic device, a method for generating a package drawing, and a computer readable storage medium. The electronic device includes a display device and a processor, the processor is configured to obtain a type of the element and size parameters corresponding to the element input by a user; determine a size and a position of each of pads corresponding to the element according to the type of the element and the size parameters corresponding to the element, and draw the pads; determine coordinates of endpoints of an entity layer corresponding to the element, and draw the entity layer; determine coordinates of endpoints of a height layer corresponding to the element, and draw the height layer; and determine coordinates of endpoints of a screen layer corresponding to the element, and draw the screen layer.

Data is received that characterizes a chip in the package system (CPS) having a plurality of wires and vias. Thereafter, using the received data, a chip power calculation is performed. The chip power calculated is used to generate a thermal-aware power map. Further, package and system level thermal analysis is performed using the power map to generate a tile-based CPS thermal profile. A plurality of chip finite element sub-models are then generated that each correspond to a different tile. A thermal field solution is solved for each sub-model so that, for each wire, wire temperature rises are extracted from the corresponding the chip sub-model analysis and combined with temperature values from the CPS thermal profile. This extracting and combining is then used to generate a back-annotation file covering each metal wire and via in the CPS.

Embodiments disclosed herein describe systems, methods, and products for concurrently placing and optimizing input-output (IO) pins and internal components of an integrated circuit (IC) design. In an illustrative process flow, the computer (executing an illustrative EDA tool) may import the IC design and unplace the IO pins of the imported IC design. The computer may set one or more constraints for the IO pins with more degrees of freedom than the conventional pre-fixed locations. The computer may then concurrently place the IO pins and the internal components such that the IO pins obey the one or more constraints. The computer may iteratively optimize the placement of the IO pins and the internal components while ensuring that the one or more constraints are not violated.

Embodiments of the present invention provide the ability to perform deformation and stress analysis modeling in a virtual fabrication environment. More particularly, embodiments enable the virtual fabrication environment to model deformation and stress analysis directly from a voxel-based model without requiring generation of an interface conforming mesh. Stress fields for semiconductor device structures may be determined at designated points in the process sequence used to fabricate the semiconductor device.

Embodiments of the invention include methods, systems, and computer program products for checking metal coverage in a laminate structure. Aspects of the invention include receiving, by a processor, metal shadowing rules and a semiconductor package design comprising a plurality of laminate layers, a plurality of metal power shapes, and a plurality of signal lines. Each metal power shape is mapped to one or more cells in a two-dimensional array. The processor determines, for each signal line in the semiconductor package design, whether the metal power shapes satisfy the metal shadowing rules. The processor displays a list of signal lines that do not satisfy the metal shadowing rules.