Systems and methods are described to accurately extract device parameters and optimize the design of macroscopic superconducting structures, for example qubits. This method presents the advantage of reusing existing plaquettes to simulate different processor topologies. The physical elements of a qubits are extracted via plurality of plaquettes. Each plaquette contains at least one physical element of the qubit design and has two ports on each side. Each plaquette is concatenated to at least one other plaquette via two ports. The values of inductance (L), capacitance (C) and mutual inductance (M) and quantum critical point of the qubit design can be computed. Changing the physical elements of the qubit design and iterating the method allows to effortlessly refine the qubit design.

A structure is provided that reduces the stress generated in a semiconductor device package during cooling subsequent to solder reflow operations for coupling semiconductor devices to a printed circuit board (PCB). Stress reduction is provided by coupling solder lands to metal-layer structures using traces on the PCB that are oriented approximately perpendicular to lines from an expansion neutral point associated with the package. In many cases, especially where the distribution of solder lands of the semiconductor device package are uniform, the expansion neutral point is in the center of the semiconductor device package. PCB traces having such an orientation experience reduced stress due to thermal-induced expansion and contraction as compared to traces having an orientation along a line to the expansion neutral point.

An evaluation apparatus includes a processor that performs operations including reading a simulation parameter of a topography simulator and first range information or second range information that are associated with each other, the simulation parameter being calculated to cause the topography simulator output topography information of a processed target object that is to be obtained by processing the unprocessed target object under a predetermined processing condition, providing topography information of a new unprocessed target object and the simulation parameter to the topography simulator to cause the topography simulator to predict topography information of a new processed target object that is processed under the predetermined processing condition, and outputting a result of comparing the topography information of the new unprocessed target object with the first range information or a result of comparing the topography information of the new processed target object with the second range information.

Systems and methods are provided for a turnkey modular printed circuit board enclosure that is generated using a template generator. The template generator accepts a user input comprising an enclosure parameter, based on which a manufacturing file may be generated. The manufacturing file may be provided to a fabricator for fabricating the enclosure or the manufacturing file may be modified in a printed circuit board design environment to incorporate a printed circuit board into the enclosure. The printed circuit board may be a separate printed circuit board that is inserted into the enclosure or it may be embedded in a face of the enclosure.

The present invention relates to a single-board processor card configured for use in a 1U CubeSat payload form-factor multi-purpose architecture, including: a field-programmable-gate-array (FPGA) which is reconfigurable in flight; wherein a configuration memory of the FPGA can be scrubbed in flight to correct errors or upsets; and a radiation-hardened monitor (RHM) which provides radiation mitigation and system monitoring of the single-board processor card, and which reconfigures said FPGA during flight, scrubs the configuration memory, and monitors a health of the FPGA. The 1U CubeSat payload form-factor multi-purpose architecture includes a backplane having a plurality of slots, one of the plurality of slots which accommodates the single-board processor card, wherein the backplane routes signals to a plurality of standard-sized processor cards, interchangeably disposed in any of the plurality of slots.

Embodiments include herein are directed towards a method for use in an electronic design environment is provided. Embodiments may include receiving a netlist associated with an electronic design and performing genetic optimization on a portion of the netlist to identify and place one or more capacitors on a printed circuit board to minimize an impedance associated with a power plane. Embodiments may further include displaying, at a graphical user interface, a placement of the one or more capacitors, wherein the placement is based upon, at least in part, the performing.

This application provides a chip apparatus, including a die, a first bond pad, a second bond pad, and a first solder pad. The first bond pad and the second bond pad are disposed on an upper surface of the die. A first power module and a second power module are disposed in the die. The first power module is coupled to the first bond pad. The second power module is coupled to the second bond pad. The first solder pad is separately coupled to an external power supply of the chip apparatus, the first bond pad, and the second bond pad. According to the foregoing technical solution, isolation between different power modules is improved, and noise transmitted on a power supply path can be better filtered out. This improves power supply noise performance of the chip apparatus.

A simulation method and system of verifying an operation of a semiconductor memory device of a memory module at a design level. The simulation method includes setting a configuration and an arrangement of a registered clock driver (RCD) and a configuration and an arrangement of first semiconductor memory devices to fourth semiconductor memory devices, on a printed circuit board (PCB) through a graphic user interface (GUI). When a RCD test execution command is applied through the GUI, executing a test program to apply control signals to control signal terminals of the PCB based on a command truth table, to compare the applied control signals and control signals output through first driver output terminals of the RCD, and to create an RCD test result. When the RCD operates normally, performing a test on the memory module.

An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.

A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.