Methods and systems are provided to generate a base digital file for a garment and a custom digital file for the garment, which may be used in garment production. For example, a system may receive information providing various specifications for manufacturing a garment, generate a base digital file for the garment, receive a request to transform the garment from a first garment size to a second garment size, and then generate a custom digital file for the garment by applying custom user body measurements to the base digital file or by applying a grading scale.

Methods, systems, and apparatus, including medium-encoded computer program products, for designing three dimensional lattice structures include, in one aspect, a method including: obtaining a mechanical problem definition including a 3D model of an object; generating a numerical simulation model for the 3D model of the object using one or more loading cases and one or more isotropic solid materials identified as a baseline material model for a design space; predicting performance of different lattice settings in different orientations in the design space using a lattice structural behavior model in place of the baseline material model in the numerical simulation model; and presenting a set of lattice proposals for the design space based on the predicted performance of the different lattice settings in the different orientations; wherein the lattice structural behavior model has been precomputed for the different lattice settings, which are generable by the 3D modeling program.

A design support system for permitting a design that easily meets desired conditions regarding an entire item group is provided. An automatic estimation system acting as the design support system comprises: an item recognition section that recognizes each of the items included in the item group by individually recognizing elements making up the item; a designated condition recognition section that recognizes a designated condition from the manufacturing conditions; and a recommended-to-be-examined element recognition section that recognizes, with respect to the designated condition recognized, the element corresponding to any of the manufacturing conditions that is recommended to be examined for changes. The recommended-to-be-examined element recognition section displays a model of the item group by highlighting the element for which the manufacturing condition is recommended to be examined for changes.

Standard cell libraries include one or more standard cells and one or more corresponding standard cell variations. The one or more standard cell variations are different from their one or more standard cells in terms of geometric shapes, locations of the geometric shapes, and/or interconnections between the geometric shapes. The exemplary systems and methods described herein selectively choose from among the one or more standard cells and/or the one or more standard cell variations to form an electronic architectural design for an electronic device. In some situations, some of the one or more standard cells are unable to satisfy one or more electronic design constraints imposed by a semiconductor foundry and/or semiconductor technology node when placed onto the electronic device design real estate. In these situations, the one or more standard cell variations corresponding to these standard cells are placed onto the electronic device design real estate.

Methods and apparatus for pattern matching and classification are disclosed. In one example of the disclosed technology, a method of performing pattern matching according to a puzzle-matching the methodology includes analyzing an original source layout pattern and determining a signature for the original source layout pattern. A target layout is scanned to search for one or more portions of the target layout that have a signature that matches or is similar to the signature of the original source pattern. Similar patterns are searched based on a signature comparison of the source pattern and the target layout. In some examples of the disclosed technology, it is possible to match partial context to the original source pattern. In some examples, matches can be made in the target layout for different orientations of layout.

A design unit and a computer-implemented method for calculating a design data set for designing a part-specific gripping tool for gripping parts that have to be transported from or to a processing machine is disclosed. The method includes the steps of providing part parameters for at least one part which is to be gripped with the part-specific gripping tool and executing a design algorithm which designs the part-specific gripping tool from the part parameters provided and thereby outputs a gripping tool data set as a result.

The present invention is directed to systems and methods for automatically generating mechanical part designs and manufacturing specifications/instructions that account for geometric distortions that may occur during manufacturing or post-processing.

A virtual build of an assembly may be performed by operating a virtual build tool inside of an active session of design software that is configured to design an assembly having multiple individual parts; importing characteristics of the assembly from a three-dimensional (3D) model of the assembly that is maintained by the design software; receiving an input of sequence numbers that indicate an assembly order for the individual parts; generating images for the individual parts as they are incrementally added to the assembly based on the sequence numbers; and generating a set of build instructions based on the sequence numbers and the images for the individual parts, where the set of build instructions illustrate how to physically manufacture the assembly.

An integrated circuit includes a first gate electrode structure extending in a first direction. The integrated circuit includes a second gate electrode structure extending in the first direction and separated in a second direction from the first gate electrode structure. The integrated circuit includes a conductive feature. The conductive feature includes a first section electrically connected to the second portion, a second section electrically connected to the second gate structure, and a third section electrically connecting the first section and the second section, wherein the third section extends in a third direction angled with respect to both the first direction and the second direction.

A semiconductor device includes a substrate having a plurality of active patterns. A plurality of gate electrodes intersects the plurality of active patterns. An active contact is electrically connected to the active patterns. A plurality of vias includes a first regular via and a first dummy via. A plurality of interconnection lines is disposed on the vias. The plurality of interconnection lines includes a first interconnection line disposed on both the first regular via and the first dummy via. The first interconnection line is electrically connected to the active contact through the first regular via. Each of the vias includes a via body portion and a via barrier portion covering a bottom surface and sidewalls of the via body portion. Each of the interconnection lines includes an interconnection line body portion and an interconnection line barrier portion covering a bottom surface and sidewalls of the interconnection line body portion.