Patent classifications
G06F2213/0062
Seamlessly Integrated Microcontroller Chip
Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
Inter-Die Interrupt Communication in a Seamlessly Integrated Microcontroller Chip
Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
Seamlessly Integrated Microcontroller Chip
Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
Dynamically Configurable Interconnect in a Seamlessly Integrated Microcontroller Chip
Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
Security Policy Management in a Seamlessly Integrated Microcontroller Chip
Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
PROCEDURES FOR IMPROVING EFFICIENCY OF AN INTERCONNECT FABRIC ON A SYSTEM ON CHIP
Optimizing transaction traffic on a System on a Chip (SoC) by using procedures such as expanding transactions and consolidating responses at nodes of an interconnect fabric for broadcasts, multi-casts, any-casts, source based routing type transactions, intra-streaming two or more transactions over a stream defined by a paired virtual channel-transaction class, trunking physical resources sharing common logical identifier, and using hashing to select among multiple physical resources sharing a common logical identifier.
Procedures for improving efficiency of an interconnect fabric on a system on chip
Optimizing transaction traffic on a System on a Chip (SoC) by using procedures such as expanding transactions and consolidating responses at nodes of an interconnect fabric for broadcasts, multi-casts, any-casts, source based routing type transactions, intra-streaming two or more transactions over a stream defined by a paired virtual channel-transaction class, trunking physical resources sharing common logical identifier, and using hashing to select among multiple physical resources sharing a common logical identifier.
Network interface device that sets an ECN-CE bit in response to detecting congestion at an internal bus interface
A network device includes a Network Interface Device (NID) and multiple servers. Each server is coupled to the NID via a corresponding PCIe bus. The NID has a network port through which it receives packets. The packets are destined for one of the servers. The NID detects a PCIe congestion condition regarding the PCIe bus to the server. Rather than transferring the packet across the bus, the NID buffers the packet and places a pointer to the packet in an overflow queue. If the level of bus congestion is high, the NID sets the packet's ECN-CE bit. When PCIe bus congestion subsides, the packet passes to the server. The server responds by returning an ACK whose ECE bit is set. The originating TCP endpoint in turn reduces the rate at which it sends data to the destination server, thereby reducing congestion at the PCIe bus interface within the network device.
Arbitrating portions of transactions over virtual channels associated with an interconnect
Arbitrating among portions of multiple transactions and transmitting a winning portion over one of a multiplicity of virtual channels associated with an interconnect on a clock cycle-by-clock cycle basis. By repeatedly performing the above each clock cycle, winning portions are interleaved and transmitted over the multiplicity of virtual channels over multiple clock cycles respectively.
Communication between transceiver and microcontroller
A transceiver configured to send and receive data over a data bus is disclosed. The transceiver includes a communication port to connect to the data bus, a bus idle detector configured to detect when the data bus is idle, a TXDC interface configured to selectively receive and send data and an RXDC interface configured to send data. The transceiver also includes a switch controlled by an output of the bus idle detector. The switch is configured to cause the TXDC interface to be used for sending data out when the bus idle detector detects that the data bus is idle.