Patent classifications
G11C5/02
SEMICONDUCTOR MEMORY DEVICES INCLUDING A MEMORY ARRAY AND RELATED METHOD INCORPORATING DIFFERENT BIASING SCHEMES
Memory devices provide a plurality of memory cells, each memory cell including a memory element and a selection device. A plurality of first (e.g., row) address lines can be adjacent (e.g., under) a first side of at least some cells of the plurality. A plurality of second (e.g., column) address lines extend across the plurality of row address lines, each column address line being adjacent (e.g., over) a second, opposing side of at least some of the cells. Control circuitry can be configured to selectively apply a read voltage or a write voltage substantially simultaneously to the address lines. Systems including such memory devices and methods of accessing a plurality of cells at least substantially simultaneously are also provided.
SEMICONDUCTOR MEMORY DEVICES INCLUDING A MEMORY ARRAY AND RELATED METHOD INCORPORATING DIFFERENT BIASING SCHEMES
Memory devices provide a plurality of memory cells, each memory cell including a memory element and a selection device. A plurality of first (e.g., row) address lines can be adjacent (e.g., under) a first side of at least some cells of the plurality. A plurality of second (e.g., column) address lines extend across the plurality of row address lines, each column address line being adjacent (e.g., over) a second, opposing side of at least some of the cells. Control circuitry can be configured to selectively apply a read voltage or a write voltage substantially simultaneously to the address lines. Systems including such memory devices and methods of accessing a plurality of cells at least substantially simultaneously are also provided.
SYSTEM AND METHOD FOR DETERMINING A CAUSE OF NETWORK CONGESTION
A method and apparatus of a device that determines a cause and effect of congestion in this device is described. In an exemplary embodiment, the device measures a queue group occupancy of a queue group for a port in the device, where the queue group stores a plurality of packets to be communicated through that port. In addition, the device determines if the measurement indicates a potential congestion of the queue group, where the congestion prevents a packet from being communicated within a time period. If potential congestion exists on that queue group, the device further gathers information regarding packets to be transmitted through that port. For example, the device can gather statistics packets that are stored in the queue group and/or new enqueue packets.
SYSTEM AND METHOD FOR DETERMINING A CAUSE OF NETWORK CONGESTION
A method and apparatus of a device that determines a cause and effect of congestion in this device is described. In an exemplary embodiment, the device measures a queue group occupancy of a queue group for a port in the device, where the queue group stores a plurality of packets to be communicated through that port. In addition, the device determines if the measurement indicates a potential congestion of the queue group, where the congestion prevents a packet from being communicated within a time period. If potential congestion exists on that queue group, the device further gathers information regarding packets to be transmitted through that port. For example, the device can gather statistics packets that are stored in the queue group and/or new enqueue packets.
Semiconductor memory device
A semiconductor memory device comprises: a plurality of first conductive layers arranged separated from each other in a first direction; a plurality of second conductive layers arranged, electrically insulated from the plurality of first conductive layers, at a different position in a second direction intersecting the first direction with respect to the first conductive layers; a plurality of memory structures; and a source structure. Respective one ends of the plurality of memory structures and one end of the source structure are electrically connected. The respective other ends of the plurality of memory structures are respectively electrically connected to different first wirings of a plurality of first wirings formed in the same layer in the first direction. The other end of the source structure is electrically connected to a second wiring formed in a different layer from the plurality of first wirings in the first direction.
Apparatuses and methods for organizing data in a memory device
Systems, apparatuses, and methods related to organizing data to correspond to a matrix at a memory device are described. Data can be organized by circuitry coupled to an array of memory cells prior to the processing resources executing instructions on the data. The organization of data may thus occur on a memory device, rather than at an external processor. A controller coupled to the array of memory cells may direct the circuitry to organize the data in a matrix configuration to prepare the data for processing by the processing resources. The circuitry may be or include a column decode circuitry that organizes the data based on a command from the host associated with the processing resource. For example, data read in a prefetch operation may be selected to correspond to rows or columns of a matrix configuration.
Apparatuses and methods for organizing data in a memory device
Systems, apparatuses, and methods related to organizing data to correspond to a matrix at a memory device are described. Data can be organized by circuitry coupled to an array of memory cells prior to the processing resources executing instructions on the data. The organization of data may thus occur on a memory device, rather than at an external processor. A controller coupled to the array of memory cells may direct the circuitry to organize the data in a matrix configuration to prepare the data for processing by the processing resources. The circuitry may be or include a column decode circuitry that organizes the data based on a command from the host associated with the processing resource. For example, data read in a prefetch operation may be selected to correspond to rows or columns of a matrix configuration.
Semiconductor memory device with 3D structure
A semiconductor memory device with a three-dimensional (3D) structure may include: a cell region arranged over a substrate, including a cell structure; a peripheral circuit region arranged between the substrate and the cell region; an upper wiring structure arranged over the cell region; main channel films and dummy channel films formed through the cell structure. The dummy channel films are suitable for electrically coupling the upper wiring structure.
Sense amplifier having offset cancellation
A sense amplifier includes a sense amplifying unit, first and second isolation units, and first and second offset cancellation unit. The sense amplifying unit includes a first P-type metal-oxide-semiconductor (PMOS) transistor, a second PMOS transistor, a first N-type metal-oxide-semiconductor (NMOS) transistor, and a second NMOS transistor. In a layout of the sense amplifier, the first and second PMOS transistors are disposed in a central region of the sense amplifier, the first and second NMOS transistors are disposed at opposite sides of the sense amplifier from each other, the first isolation unit and the first offset cancellation unit are disposed between the first PMOS transistor and the first NMOS transistor, and the second isolation unit and the second offset cancellation unit are disposed between the second PMOS transistor and the second NMOS transistor. In other layouts, the locations of the PMOS transistors and NMOS transistors may be reversed.
Sense amplifier having offset cancellation
A sense amplifier includes a sense amplifying unit, first and second isolation units, and first and second offset cancellation unit. The sense amplifying unit includes a first P-type metal-oxide-semiconductor (PMOS) transistor, a second PMOS transistor, a first N-type metal-oxide-semiconductor (NMOS) transistor, and a second NMOS transistor. In a layout of the sense amplifier, the first and second PMOS transistors are disposed in a central region of the sense amplifier, the first and second NMOS transistors are disposed at opposite sides of the sense amplifier from each other, the first isolation unit and the first offset cancellation unit are disposed between the first PMOS transistor and the first NMOS transistor, and the second isolation unit and the second offset cancellation unit are disposed between the second PMOS transistor and the second NMOS transistor. In other layouts, the locations of the PMOS transistors and NMOS transistors may be reversed.