The present disclosure relates to the field of semiconductor circuit design, and in particular to a readout circuit layout structure and a method of reading data. The readout circuit layout structure includes: a first readout circuit structure and a second readout circuit structure having identical structures, wherein the first readout circuit structure and the second readout circuit structure each include: a first isolation module, configured to be turned on according to a first isolation signal, electrically connect a bit line and a first readout bit line, and electrically connect a complementary bit line and a first complementary readout bit line; a second isolation module, configured to be turned on according to a second isolation signal, electrically connect the first readout bit line and a second readout bit line, and electrically connect the first complementary readout bit line and a second complementary readout bit line.

A semiconductor memory device according to an embodiment includes: a stacked body alternately stacking first insulating layers and gate electrode layers in a first direction; first to third semiconductor layers in the stacked body extending in the first direction; first to third charge accumulation layers; and a second insulating layer in the stacked body extending in the first direction, the second insulating layer contacting the first semiconductor layer or the first charge accumulation layer in a plane perpendicular to the first direction. A first distance between two end surfaces of the gate electrode layer monotonically increases in the first direction in a first cross section parallel to the first direction. A second distance between two end surfaces of the gate electrode layer monotonically increases in the first direction, decreases, and then monotonically increases in a second cross section parallel to the first direction different from the first cross section.

A semiconductor memory device according to an embodiment includes: a stacked body alternately stacking first insulating layers and gate electrode layers in a first direction; first to third semiconductor layers in the stacked body extending in the first direction; first to third charge accumulation layers; and a second insulating layer in the stacked body extending in the first direction, the second insulating layer contacting the first semiconductor layer or the first charge accumulation layer in a plane perpendicular to the first direction. A first distance between two end surfaces of the gate electrode layer monotonically increases in the first direction in a first cross section parallel to the first direction. A second distance between two end surfaces of the gate electrode layer monotonically increases in the first direction, decreases, and then monotonically increases in a second cross section parallel to the first direction different from the first cross section.

An electronic device is provided to comprise a semiconductor memory unit that comprises: a substrate including active regions, which are extended in a second direction and disposed from each other in a first direction; a plurality of gates extended in the first direction and across with the active regions; a lower contact disposed in both sides of gates and coupling the active regions in the first direction; an upper contact of the lower contact overlapping with the active region out of the active regions in a side of each gate, and overlapping with the active regions in the other side of each gate; and first and second interconnection lines coupled to the upper contact, extended in the second direction, and being alternately disposed from each other in the first direction, wherein the upper contact of a side of the gates has a zigzag shape in a first oblique direction.

An electronic device is provided to comprise a semiconductor memory unit that comprises: a substrate including active regions, which are extended in a second direction and disposed from each other in a first direction; a plurality of gates extended in the first direction and across with the active regions; a lower contact disposed in both sides of gates and coupling the active regions in the first direction; an upper contact of the lower contact overlapping with the active region out of the active regions in a side of each gate, and overlapping with the active regions in the other side of each gate; and first and second interconnection lines coupled to the upper contact, extended in the second direction, and being alternately disposed from each other in the first direction, wherein the upper contact of a side of the gates has a zigzag shape in a first oblique direction.

Systems, apparatuses, and methods related to organizing data to correspond to a matrix at a memory device are described. Data can be organized by circuitry coupled to an array of memory cells prior to the processing resources executing instructions on the data. The organization of data may thus occur on a memory device, rather than at an external processor. A controller coupled to the array of memory cells may direct the circuitry to organize the data in a matrix configuration to prepare the data for processing by the processing resources. The circuitry may be or include a column decode circuitry that organizes the data based on a command from the host associated with the processing resource. For example, data read in a prefetch operation may be selected to correspond to rows or columns of a matrix configuration.

A memory array comprising a word line and a bit line is disclosed. Each of a plurality of memory cells of the memory array has a first terminal connected to the bit line and a current path between the first terminal and a respective second terminal. A first memory cell of the plurality of memory cells has the second terminal coupled to receive a first supply voltage when selected by the word line. A second memory cell of the plurality of memory cells has the second terminal coupled to receive a voltage different from the first supply voltage when the first memory cell is selected by the word line.

A memory array comprising a word line and a bit line is disclosed. Each of a plurality of memory cells of the memory array has a first terminal connected to the bit line and a current path between the first terminal and a respective second terminal. A first memory cell of the plurality of memory cells has the second terminal coupled to receive a first supply voltage when selected by the word line. A second memory cell of the plurality of memory cells has the second terminal coupled to receive a voltage different from the first supply voltage when the first memory cell is selected by the word line.

A three-dimensional semiconductor memory device including a first peripheral circuit including different decoder circuits, a first memory on the first peripheral circuit, the first memory including a first stack structure having first electrode layers stacked on one another and first inter-electrode dielectric layers therebetween, a first planarized dielectric layer covering an end of the first stack structure, and a through via that penetrates the end of the first stack structure, the through via electrically connected to one of the decoder circuits, and a second memory on the first memory and including a second stack structure having second electrode layers stacked on one another and second inter-electrode dielectric layers therebetween, a second planarized dielectric layer covering an end of the second stack structure, and a cell contact plug electrically connecting one of the second electrode layers to the through via.

A three-dimensional semiconductor memory device including a first peripheral circuit including different decoder circuits, a first memory on the first peripheral circuit, the first memory including a first stack structure having first electrode layers stacked on one another and first inter-electrode dielectric layers therebetween, a first planarized dielectric layer covering an end of the first stack structure, and a through via that penetrates the end of the first stack structure, the through via electrically connected to one of the decoder circuits, and a second memory on the first memory and including a second stack structure having second electrode layers stacked on one another and second inter-electrode dielectric layers therebetween, a second planarized dielectric layer covering an end of the second stack structure, and a cell contact plug electrically connecting one of the second electrode layers to the through via.