A memory device, for executing an anneal computation with first state and a second state. The memory device includes a first memory array, a second memory array, a control circuit, a sensing circuit and a processing circuit. the control circuit selects a first horizontal row of memory units from the first memory array, and selects a second horizontal row of memory units from the second memory array. The sensing circuit computes a local energy value of the first state according to the current generated by the memory units of the first horizontal row, and computes a local energy value of the second state according to the current generated by the memory units of the second horizontal row. The processing circuit updates the first state and/or the second state according to the local energy value of the first state and the local energy value of the second state.

A memory device, for executing an anneal computation with first state and a second state. The memory device includes a first memory array, a second memory array, a control circuit, a sensing circuit and a processing circuit. the control circuit selects a first horizontal row of memory units from the first memory array, and selects a second horizontal row of memory units from the second memory array. The sensing circuit computes a local energy value of the first state according to the current generated by the memory units of the first horizontal row, and computes a local energy value of the second state according to the current generated by the memory units of the second horizontal row. The processing circuit updates the first state and/or the second state according to the local energy value of the first state and the local energy value of the second state.

Memory subword driver circuits with common transistors are disclosed. In some examples, a subword driver block of a memory device includes a plurality of subword drivers each having an output configured to be coupled to a word line coupled to a plurality of memory cells. The outputs of a first subword driver and a second subword driver of the plurality of subword drivers are coupled to a common transistor and a common word driver line, where the first subword driver and the second subword driver are respectively coupled to a first main word line and a second main word line. In such configuration, the first and second subword drivers are coupled in cascade connection so that, responsive to an active first main word line and an inactive common word driver line, a non-active potential is provided to the first subword driver from the second subword driver via the common transistor.

Memory subword driver circuits with common transistors are disclosed. In some examples, a subword driver block of a memory device includes a plurality of subword drivers each having an output configured to be coupled to a word line coupled to a plurality of memory cells. The outputs of a first subword driver and a second subword driver of the plurality of subword drivers are coupled to a common transistor and a common word driver line, where the first subword driver and the second subword driver are respectively coupled to a first main word line and a second main word line. In such configuration, the first and second subword drivers are coupled in cascade connection so that, responsive to an active first main word line and an inactive common word driver line, a non-active potential is provided to the first subword driver from the second subword driver via the common transistor.

Systems and methods of screening memory cells by modulating bitline and/or wordline voltage. In a read operation, the wordline may be overdriven or underdriven as compared to a nominal operating voltage on the wordline. In a write operation, the one or both of the bitline and wordline may be overdriven or underdriven as compared to a nominal operating voltage of each. A built-in self test (BIST) system for screening a memory array has bitline and wordline margin controls to modulate bitline and wordline voltage, respectively, in the memory array.

A semiconductor device includes a memory array arranged in a matrix, a plurality of word lines provided corresponding to memory cell rows, a word driver for driving one of the plurality of word lines, a plurality of row select lines connected to the word driver, and a row decoder for outputting a row select signal to the plurality of row select lines based on input row address information. According to the embodiment, the semiconductor device can detect a failure of the address decoder in a simple method.

A semiconductor device includes a memory array arranged in a matrix, a plurality of word lines provided corresponding to memory cell rows, a word driver for driving one of the plurality of word lines, a plurality of row select lines connected to the word driver, and a row decoder for outputting a row select signal to the plurality of row select lines based on input row address information. According to the embodiment, the semiconductor device can detect a failure of the address decoder in a simple method.

Row and/or column electrode lines for a memory device are staggered such that gaps are formed between terminated lines. Vertical interconnection to central points along adjacent lines that are not terminated are made in the gap, and vertical interconnection through can additionally be made through the gap without contacting the lines of that level.

Row and/or column electrode lines for a memory device are staggered such that gaps are formed between terminated lines. Vertical interconnection to central points along adjacent lines that are not terminated are made in the gap, and vertical interconnection through can additionally be made through the gap without contacting the lines of that level.

A semiconductor memory device includes a memory cell array including a plurality of memory cell rows, a row hammer management circuit and a refresh control circuit. The row hammer management circuit counts the number of times of access associated with each of the plurality of memory cell rows in response to an active command from an external memory controller to store the counted values in each of the plurality of memory cell rows as count data, determines a hammer address associated with at least one of the plurality of memory cell rows, which is intensively accessed more than a predetermined reference number of times, based on the counted values, and performs an internal read-update-write operation. The refresh control circuit receives the hammer address and to perform a hammer refresh operation on victim memory cell rows which are physically adjacent to a memory cell row corresponding to the hammer address.