An apparatus and method for providing efficient floor planning, power, and performance tradeoffs of memory accesses. Adjacent bit cells in a column of an array use a split read port such that the bit cells do not share a read bit line while sharing a write bit line. The adjacent bit cells include asymmetrical read access circuits that convey data stored by latch circuitry of a corresponding bit cell to a corresponding read bit line. The layout of adjacent bit cells provides a number of contacted gate pitches per bit cell that is less than a sum of the maximum number of metal gates in layout of each of the adjacent bit cells divided by the number of adjacent bit cells.

This disclosure describes a memory cell array with enhanced read sensing margin. The memory cell array includes a write port and a read port being connected through first and second data storage lines. The memory cell array further includes multiple word lines and bit lines arranged in rows and columns such that the read port is coupled to a read word line, a read bit line, and a virtual ground. The read port includes a first transistor coupled to at least the read bit line and the virtual ground, a second transistor coupled to at least the first data storage line and the first transistor, a third transistor coupled to at least the second data storage line and the read word line, and a fourth transistor coupled at least the first data storage line and the read word line.

Memory bit cells including write control circuits for coupling control of voltage sources to avoid or reduce write contention. The memory bit cells may be static random-access memory (SRAM) bit cells that include a true storage circuit and a complement storage circuit cross-coupled to generate complementary logical data states. Writing data into a memory bit cell circuit includes pulling up one of the true and complement storage circuits based on a pull-up voltage on a pull-up voltage rail while pulling down the opposite true or complementary output node based on a pull-down voltage on a pull-down voltage rail (i.e., to a logic ‘0’). The write control circuit can be controlled to decouple one of the true or complement storage circuits from a pull-up voltage rail or a pull-down voltage rail in response to a write operation to reduce or avoid a write contention.

A memory device is provided. The memory device includes a bit cell having a first invertor connected between a first node and a second node and a second invertor connected between the first node and the second node. The first invertor and the second invertor are cross coupled at a first data node and a second data node. The memory device further includes a pull down circuit connected to the second node. The pull down circuit is operative to pull down a voltage of the second node below a ground voltage in response to an enable signal.

A SOT-MRAM cell, comprising at least one magnetic tunnel junction (MTJ) comprising a tunnel barrier layer between a pinned ferromagnetic layer and a free ferromagnetic layer; a SOT line, extending substantially parallel to the plane of the layers and contacting a first end of said at least one MTJ; at least a first source line connected to one end of the SOT line; at least a first bit line and a second bit line, wherein the SOT-MRAM cell comprises one MTJ, each bit line being connected to the other end of the MTJ; or wherein the SOT-MRAM cell comprises two MTJs, each MTJ being connected to one of the first bit line and second bit line.

A 3D semiconductor device including: a first level including a plurality of first single-crystal transistors; a plurality of memory control circuits formed from at least a portion of the plurality of first single-crystal transistors; a first metal layer disposed atop the plurality of first single-crystal transistors; a second metal layer disposed atop the first metal layer; a second level disposed atop the second metal layer, the second level including a plurality of second transistors; a third level including a plurality of third transistors, where the third level is disposed above the second level; a third metal layer disposed above the third level; and a fourth metal layer disposed above the third metal layer, where the plurality of second transistors are aligned to the plurality of first single crystal transistors with less than 140 nm alignment error, the second level includes first memory cells, the third level includes second memory cells.

A 3D semiconductor device including: a first level including a plurality of first single-crystal transistors; a plurality of memory control circuits formed from at least a portion of the plurality of first single-crystal transistors; a first metal layer disposed atop the plurality of first single-crystal transistors; a second metal layer disposed atop the first metal layer; a second level disposed atop the second metal layer, the second level including a plurality of second transistors; a third level including a plurality of third transistors, where the third level is disposed above the second level; a third metal layer disposed above the third level; and a fourth metal layer disposed above the third metal layer, where the plurality of second transistors are aligned to the plurality of first single crystal transistors with less than 140 nm alignment error, the second level includes first memory cells, the third level includes second memory cells.

According to one embodiment, an arithmetic device includes an arithmetic circuit. The arithmetic circuit includes a memory part including a plurality of memory regions, and an arithmetic part. One of the memory regions includes a capacitance including a first terminal, and a first electrical circuit electrically connected to the first terminal and configured to output a voltage signal corresponding to a potential of the first terminal.

An example apparatus comprises an array of memory cells coupled to sensing circuitry including a first sense amplifier, a second sense amplifier, and a logical operation component. The sensing circuitry may be controlled to sense, via first sense amplifier, a data value stored in a first memory cell of the array, sense, via a second sense amplifier, a data value stored in a second memory cell of the array, and operate the logical operation component to output a logical operation result based on the data value stored in the first sense amplifier and the data value stored in the second sense amplifier.

Methods, systems, and devices for a differential write operation are described. The operations described herein may be used to alter a portion of a program file from a first state to a second state. For example, a file (e.g., a patch file) that is associated with a signature may be received at a memory device. Based on an authentication process, the file may be used to alter the program file to the second state. In some examples, the program file may be altered to the second state using a buffer of the memory device. A host system may transmit a file that includes the difference between the first state and the second state. A signature may be associated with the file and may be used to authenticate the file.