The present disclosure discloses a memory access interface device. A clock generation circuit generates a reference clock signal. A fake data strobe signal generation circuit receives the reference clock signal and delays a read enable signal from a memory access controller to enable an output of the reference clock signal to generate a fake data strobe signal. A real data strobe signal generation circuit receives a data strobe signal from a memory device and delays the read enable signal to enable an output of the data strobe signal to generate a real data strobe signal. A data reading circuit samples a data signal from the memory device according to a sampling signal to generate a read data signal to the memory access controller. A selection circuit selects the fake and the real data strobe signals as the sampling signal respectively under a single and a double data rate modes.

The present disclosure discloses a memory access interface device. A clock generation circuit generates a reference clock signal. A fake data strobe signal generation circuit receives the reference clock signal and delays a read enable signal from a memory access controller to enable an output of the reference clock signal to generate a fake data strobe signal. A real data strobe signal generation circuit receives a data strobe signal from a memory device and delays the read enable signal to enable an output of the data strobe signal to generate a real data strobe signal. A data reading circuit samples a data signal from the memory device according to a sampling signal to generate a read data signal to the memory access controller. A selection circuit selects the fake and the real data strobe signals as the sampling signal respectively under a single and a double data rate modes.

A semiconductor memory device may include a core circuit including a plurality of memory cell arrays electrically connected between a plurality of row lines and a plurality of column lines, and a column path control circuit configured to generate a preliminary column pulse from a command signal irrelevant to a column address signal, to generate a main column pulse in response to an enable time point of the column address signal and an enable time point of the preliminary column pulse, and to enable an access target column line among the plurality of column lines.

A semiconductor memory device may include a core circuit including a plurality of memory cell arrays electrically connected between a plurality of row lines and a plurality of column lines, and a column path control circuit configured to generate a preliminary column pulse from a command signal irrelevant to a column address signal, to generate a main column pulse in response to an enable time point of the column address signal and an enable time point of the preliminary column pulse, and to enable an access target column line among the plurality of column lines.

Methods and apparatus for Cross DRAM DIMM sub-channel pairing. Memory channels on a memory controller or System on a Chip (SoC) are segmented into two subchannels, each including Command and Address (C/A) signals, DQ (data) lines. Under different solutions the two subchannels may share a command-bus clock or use separate command-bus clocks. Some approaches use subchannels from different memory channels to provide the C/A and DQ lines for two subchannels to a given DIMM. One solution implements an additional command-bus clock on the DIMM connector repurposing existing MCR pins to provide command-bus clock signals to a Registered Clock Driver (RCD) to allow the subchannels to be fully independent. Another solution is the pair every other DRAM controller to the same command-bus clock. Other solutions employ Skip-1, Skip-2, and Skip-3 configurations under which the clocks for the DDR-IO circuitry are not logically co-located with the subchannel IO circuitry.

A memory device and a glitch prevention method thereof are provided. The memory device includes a data strobe signal input circuitry, a transfer signal generating circuitry, a data alignment circuitry, and a blocking circuitry. The data strobe signal input circuitry is configured to input a data strobe signal. The transfer signal generating circuitry is configured to generate a transfer signal with pulses in synchronization with rising edges or falling edges of the data strobe signal in response to a transfer command. The data alignment circuitry is configured to align a data signal to be transferred in response to the generated transfer signal. The blocking circuitry is configured to block an input of the data strobe signal over a postamble timing of the data strobe signal according to a number of bursts counted in each time of data transfer.

A memory device and a glitch prevention method thereof are provided. The memory device includes a data strobe signal input circuitry, a transfer signal generating circuitry, a data alignment circuitry, and a blocking circuitry. The data strobe signal input circuitry is configured to input a data strobe signal. The transfer signal generating circuitry is configured to generate a transfer signal with pulses in synchronization with rising edges or falling edges of the data strobe signal in response to a transfer command. The data alignment circuitry is configured to align a data signal to be transferred in response to the generated transfer signal. The blocking circuitry is configured to block an input of the data strobe signal over a postamble timing of the data strobe signal according to a number of bursts counted in each time of data transfer.

A semiconductor chip capable of improving signal quality includes a host device, a first memory device which is spaced part from the host device and connected to the host device, a repeater module which is connected to the host device and the first memory device, and a second memory device which is spaced apart from the host device and connected to the repeater module. The first memory device receives a data signal from the host device and generates a recovery clock signal, using the data signal. The repeater module receives the recovery clock signal from the first memory device, receives a first input signal from the host device, and samples the first input signal on the basis of the recovery clock signal to generate a sampling signal. The second memory device receives the sampling signal.

A semiconductor chip capable of improving signal quality includes a host device, a first memory device which is spaced part from the host device and connected to the host device, a repeater module which is connected to the host device and the first memory device, and a second memory device which is spaced apart from the host device and connected to the repeater module. The first memory device receives a data signal from the host device and generates a recovery clock signal, using the data signal. The repeater module receives the recovery clock signal from the first memory device, receives a first input signal from the host device, and samples the first input signal on the basis of the recovery clock signal to generate a sampling signal. The second memory device receives the sampling signal.

An address latch, a display device, and an address latching method are disclosed. The address latch includes a write control circuit, a write latch circuit, a latch control circuit, an intermediate latch circuit, and an output latch circuit. The write latch circuit is configured to latch an address data in response to N write control signals generated by the write control circuit, N data bits of the address data are divided into (M−1) data bit groups; the latch control circuit is configured to sequentially generate M latch control signals; the intermediate latch circuit is configured to, in response to first to (M−1)-th latch control signals, latch first to (M−1)-th data bit groups latched by the write latch circuit in a time-division manner; and the output latch circuit is configured to output the address data latched by the intermediate latch circuit in response to an M-th latch control signal.