A memory device includes a plurality of magnetoresistive random-access memory (MRAM) cells including a first one-time programmable (OTP) MRAM cell. A first OTP select transistor is connected to the first OTP MRAM cell. The first OTP select transistor configured to selectively apply a breakdown current to the first OTP MRAM cell to write the first OTP MRAM cell to a breakdown state.

The present disclosure includes apparatuses and methods related to a data buffer in a non-volatile dual in-line memory module (NVDIMM). An example apparatus can include a data buffer couplable to a host, a first memory device (e.g., volatile memory), wherein the first memory device is coupled to the data buffer via a first bus, a second memory device (e.g., non-volatile memory), and a controller, wherein the controller is coupled to the data buffer via a second bus and wherein the controller is configured to cause a data transfer from first memory device to the second memory device via the data buffer and the second bus.

Disclosed is a user system which includes a first device and a second device, which share a shared voltage, and a power management integrated circuit (PMIC) generating the shared voltage. An operation method of the user system includes performing a first operation of the first device, determining whether a second operation of the second device is to be performed while the first device performs the first operation, based on an operation profile, and when it is determined that the second operation of the second device is to be performed while the first device performs the first operation, changing a power mode of the PMIC from a first power mode to a second power mode, before the second device performs the second operation. The PMIC generates the shared voltage based on the first power mode or the second power mode.

Memory controllers, devices, modules, systems and associated methods are disclosed. In one embodiment, a memory module includes a pin interface for coupling to a memory controller via a bus. The module includes at least two non-volatile memory devices, and a buffer disposed between the pin interface and the at least two non-volatile memory devices. The buffer receives non-volatile memory access commands from the memory controller that are interleaved with DRAM memory module access commands.

Embodiments of three-dimensional (3D) memory devices with embedded dynamic random-access memory (DRAM) and methods for forming the 3D memory devices are disclosed. In an example, a method for operating a 3D memory device is disclosed. The 3D memory device includes an input/output circuit, an array of embedded DRAM cells, and an array of 3D NAND memory strings in a same chip. Data is transferred through the input/output circuit to the array of embedded DRAM cells. The data is buffered in the array of embedded DRAM cells. The data is stored in the array of 3D NAND memory strings from the array of embedded DRAM cells.

Three-dimensional (3D) memory devices with 3D phase-change memory (PCM) and methods for forming and operating the 3D memory devices are disclosed. In an example, a 3D memory device includes a first semiconductor structure including an array of NAND memory cells, and a first bonding layer including first bonding contacts. The 3D memory device also further includes a second semiconductor structure including a second bonding layer including second bonding contacts, a semiconductor layer and a peripheral circuit and an array of PCM cells between the second bonding layer and the semiconductor layer. The 3D memory device further includes a bonding interface between the first and second bonding layers. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.

A media management operation is executed to write data from a source block of a cache memory to a set of pages of a destination block of a storage area of a memory sub-system. An entry of a data structure identifying a page count corresponding to the source block of the cache memory is generated. A power loss event associated with the destination block of the storage area is identified. A data recovery operation is executed using the data stored in the source block to complete the write to the destination block. The data is erased from the source block in response to the page count satisfying a condition.

A non-volatile memory structure, and methods of manufacture, which may include a first memory element and a second memory element between a first terminal and a second terminal. The first memory element and the second memory element may be in parallel with each other between the first and second terminal. This may enable the hybrid non-volatile memory structure to store values as a combination of the conductance for each memory element, thereby enabling better tuning of set and reset conductance parameters.

According to one embodiment, a memory device includes a nonvolatile memory, a volatile memory, a controller, and a board. The nonvolatile memory stores data. The volatile memory holds a part of the data stored in the nonvolatile memory. The memory controller controls the volatile memory and the nonvolatile memory. The nonvolatile memory, the volatile memory, and the memory controller are provided on the board. The memory controller transmits an interrupt signal to a request source, when the volatile memory does not have any data corresponding to an address which the request source requests to access.

A memory module includes cache of relatively fast and durable dynamic, random-access memory (DRAM) in service of a larger amount of relatively slow and wear-sensitive nonvolatile memory. Local controller manages communication between the DRAM cache and nonvolatile memory to accommodate disparate access granularities, reduce the requisite number of memory transactions, and minimize the flow of data external to nonvolatile memory components.