G11C11/02

MEMORY CELL LAYOUT FOR LOW CURRENT FIELD-INDUCED MRAM
20220318474 · 2022-10-06 · ·

Provided herein is a cell of a magnetic random access memory (MRAM) circuit. The cell includes a horizontal outer perimeter and an access transistor including a first terminal, a second terminal, and a gate terminal. The cell includes a magnetic tunnel junction (MTJ) structure located in the horizontal outer perimeter and above the bottom electrode. The MTJ structure being centered within the horizontal outer perimeter. The cell includes a bottom electrode located entirely within the horizontal outer perimeter. The bottom electrode comprising a shape enabling the MTJ structure to be centered within the horizontal outer perimeter.

Device for electric field induced local magnetization

In a technique for inducing local electric field controlled magnetization, despite the absence of magnetic components, there is provided a novel heterostructure, a semiconductor device thereof, or an array of semiconductor devices. The heterostructure includes a semiconductor substrate carrying a plurality of layers forming at least one heterojunction and hosting a two-dimensional electron gas layer when one of the layer of the plurality of layers is bounded to an interacting layer being a chiral or a biological macromolecule assembly.

Device for electric field induced local magnetization

In a technique for inducing local electric field controlled magnetization, despite the absence of magnetic components, there is provided a novel heterostructure, a semiconductor device thereof, or an array of semiconductor devices. The heterostructure includes a semiconductor substrate carrying a plurality of layers forming at least one heterojunction and hosting a two-dimensional electron gas layer when one of the layer of the plurality of layers is bounded to an interacting layer being a chiral or a biological macromolecule assembly.

Apparatus and method for endurance of non-volatile memory banks via wear leveling and random swap injection

Endurance mechanisms are introduced for memories such as non-volatile memories for broad usage including caches, last-level cache(s), embedded memory, embedded cache, scratchpads, main memory, and storage devices. Here, non-volatile memories (NVMs) include magnetic random-access memory (MRAM), resistive RAM (ReRAM), ferroelectric RAM (FeRAM), phase-change memory (PCM), etc. In some cases, features of endurance mechanisms (e.g., randomizing mechanisms) are applicable to volatile memories such as static random-access memory (SRAM), and dynamic random-access memory (DRAM). The endurance mechanisms include a wear leveling scheme that uses index rotation, outlier compensation to handle weak bits, and random swap injection to mitigate wear out attacks.

ASYNCHRONOUS READ CIRCUIT USING DELAY SENSING IN MAGNETORESISTIVE RANDOM ACCESS MEMORY (MRAM)
20220068342 · 2022-03-03 ·

Some embodiments of the present disclosure relate to a memory device. The memory device includes an active current path including a data storage element; and a reference current path including a reference resistance element. The reference resistance element has a resistance that differs from a resistance of the data storage element. A delay-sensing element has a first input coupled to the active current path and a second input coupled to the reference current path. The delay-sensing element is configured to sense a timing delay between a first signal on the active current path and a second signal on the reference current path. The delay-sensing element is further configured to determine a data state stored in the data storage element based on the timing delay.

ASYNCHRONOUS READ CIRCUIT USING DELAY SENSING IN MAGNETORESISTIVE RANDOM ACCESS MEMORY (MRAM)
20220068342 · 2022-03-03 ·

Some embodiments of the present disclosure relate to a memory device. The memory device includes an active current path including a data storage element; and a reference current path including a reference resistance element. The reference resistance element has a resistance that differs from a resistance of the data storage element. A delay-sensing element has a first input coupled to the active current path and a second input coupled to the reference current path. The delay-sensing element is configured to sense a timing delay between a first signal on the active current path and a second signal on the reference current path. The delay-sensing element is further configured to determine a data state stored in the data storage element based on the timing delay.

Semiconductor device
11121175 · 2021-09-14 · ·

A semiconductor device including a substrate that has a first region and a second region, a plurality of lower conductive patterns on the substrate, the plurality of lower conductive patterns including a first conductive pattern in the first region of the substrate and a second conductive pattern in the second region of the substrate, a magnetic tunnel junction on the first conductive pattern, a contact between the magnetic tunnel junction and the first conductive pattern, a through electrode on the second conductive pattern, and a plurality of upper conductive patterns on the magnetic tunnel junction and the through electrode. The contact includes a first contact on the lower conductive patterns, a second contact on the first contact, and a first barrier layer that covers a bottom surface and a lateral surface of the second contact.

Semiconductor device
11121175 · 2021-09-14 · ·

A semiconductor device including a substrate that has a first region and a second region, a plurality of lower conductive patterns on the substrate, the plurality of lower conductive patterns including a first conductive pattern in the first region of the substrate and a second conductive pattern in the second region of the substrate, a magnetic tunnel junction on the first conductive pattern, a contact between the magnetic tunnel junction and the first conductive pattern, a through electrode on the second conductive pattern, and a plurality of upper conductive patterns on the magnetic tunnel junction and the through electrode. The contact includes a first contact on the lower conductive patterns, a second contact on the first contact, and a first barrier layer that covers a bottom surface and a lateral surface of the second contact.

DEVICE FOR ELECTRIC FIELD INDUCED LOCAL MAGNETIZATION
20210143268 · 2021-05-13 ·

The invention relates to a technique for inducing local electric field controlled magnetization, despite the absence of magnetic components. There is provided a novel heterostructure (100), a semiconductor device thereof, or an array of semiconductor devices. The heterostructure comprises a semiconductor substrate (102) carrying a plurality of layers forming at least one heterojunction (104) and hosting a two-dimensional electron gas layer (104B) when one of the layer of the plurality of layers is bounded to an interacting layer (106) being a chiral or a biological macromolecule assembly.

DEVICE FOR ELECTRIC FIELD INDUCED LOCAL MAGNETIZATION
20210143268 · 2021-05-13 ·

The invention relates to a technique for inducing local electric field controlled magnetization, despite the absence of magnetic components. There is provided a novel heterostructure (100), a semiconductor device thereof, or an array of semiconductor devices. The heterostructure comprises a semiconductor substrate (102) carrying a plurality of layers forming at least one heterojunction (104) and hosting a two-dimensional electron gas layer (104B) when one of the layer of the plurality of layers is bounded to an interacting layer (106) being a chiral or a biological macromolecule assembly.