According to an embodiment, a semiconductor memory device comprises first wiring lines, second wiring lines, and first variable resistance elements. The first wiring lines are arranged in a first direction and have as their longitudinal direction a second direction intersecting the first direction. The second wiring lines are arranged in the second direction and have the first direction as their longitudinal direction. The first variable resistance elements are respectively provided at intersections of the first wiring lines and the second wiring lines. In addition, this semiconductor memory device comprises a first contact extending in a third direction that intersects the first direction and second direction and having one end thereof connected to the second wiring line. The other end and a surface intersecting the first direction of this first contact are covered by a first conductive layer.

A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the first and second regions and above the top surface; and a nonvolatile memory configured to store data upon transfer from the body region.

There are increasing needs of searching on which data in a storage circuit is most similar to input information from the outside. Expectations for storage circuits having such memory techniques are high, and to enable a computer to handle information from the outside more flexibly is considered an essential technique. To achieve such techniques, a storage circuit needs to have a function of measuring a degree of similarity between stored data and input data. In an approximate-search-circuit, a memory matrix of a conventional storage circuit is caused to function as a data conversion circuit for calculating the inner-product distance between stored data and input data, by inputting the input data to the memory matrix in the form of a time series of pulse-signals, and the location of stored data with the highest inner-product is output from a circuit that calculates the inner-product in real time.

A memory device includes a first chip, a second chip and a processor. The second chip is coupled to the first chip at a first node. The second chip includes a first capacitor and a first variable resistor. The first capacitor is coupled to the first node. The first variable resistor is coupled in series with the first capacitor. The processor is coupled to the first node, and is configured to perform a first read operation to the first chip via the first node. A method for operating a memory device is also disclosed herein.

A hybrid switch and memory cell includes a transistor device that has an atomically-thin semiconductor material channel, source/drain electrodes, and gate dielectric. The cell includes a resistive-random-access-memory having a thin conductive edge and a 2D insulator layer over the thin conductive edge, wherein the 2D insulator layer extends over the semiconductor channel and serves as the gate dielectric in the transistor device.

An integrated circuit includes first and second arrays of resistors, and a plurality of interface circuits. Each resistor in the first array is electrically coupled between a corresponding first input conductive line among a plurality of first or second input conductive lines, and a corresponding first output conductive line among a plurality of first or second output conductive lines. Each resistor in the second array is electrically coupled between a corresponding second input conductive line among a plurality of second input conductive lines, and a corresponding second output conductive line among a plurality of second output conductive lines. Each interface circuit is electrically coupled between a corresponding first output conductive line and a corresponding second input conductive line. Each interface circuit is configured to receive a signal on the corresponding first output conductive line, and apply an analog voltage corresponding to the signal to the corresponding second input conductive line.

An artificial neuron for a neuromorphic chip comprises a synapse with resistive memory representative of a synaptic weight. The artificial neuron comprises a read circuit, an integration circuit and a logic circuit interposed between the read circuit and the integration circuit. The read circuit is configured to impose on the synapse a read voltage independent of the membrane voltage and to provide an analogue value representative of the synaptic weight. The logic circuit is configured to generate from the analogue value a pulse having a duration. The integration circuit comprises an accumulator of synaptic weights at the terminals of which a membrane voltage is established and a comparator configured to emit a postsynaptic pulse if a threshold is exceeded by the membrane voltage. Moreover, it comprises a source of current controlled by the pulse to inject a current into the accumulator of synaptic weights during this duration.

In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes one or more lower interconnects arranged within a dielectric structure over a substrate. A bottom electrode is disposed over one of the one or more lower interconnects. The bottom electrode includes a first material having a first electronegativity. A data storage layer separates the bottom electrode from a top electrode. The bottom electrode is between the data storage layer and the substrate. A reactivity reducing layer includes a second material and has a second electronegativity that is greater than or equal to the first electronegativity. The second material contacts a lower surface of the bottom electrode that faces the substrate.

An apparatus comprising: a memristor; means for wirelessly receiving, from another apparatus, a time-varying signal; means for enabling, responsive to the received time-varying signal, provision of one or more pulses to the memristor to change an electrical characteristic of the memristor; means for wirelessly signalling to the other apparatus when the electrical characteristic of the memristor reaches a threshold value; and means for re-setting the electrical characteristic of the memristor.

A lead-free metallic halide memristor is disclosed. The lead-free metallic halide memristor comprises a first electrode layer, an active layer and a second electrode layer, of which the active layer is made of a metallic halide material. Experimental data have proved that the lead-free metallic halide memristor possesses synaptic plasticity because of showing characteristics of short-term potentiation, short-term depression, long-term potentiation, long-term depression during the experiments. Therefore, the lead-free metallic halide memristor has significant potential for being used as an artificial synaptic element so as to be further applied in the manufacture of a reservoir computing chip. Moreover, experimental data have also proved that the lead-free metallic halide memristor also shows the characteristics of multi-level resistive switching, whereupon the lead-free metallic halide memristor can be further used as analog non-volatile memory so as to be further applied in the manufacture of a neuromorphic computing chip.