A programmable logic device including an asynchronous circuit is provided. The programmable logic device includes a lookup table, a first circuit, and a second circuit. The first circuit receives a first signal and a second signal. The second circuit sends a third signal. The first circuit sends a fourth signal and a fifth signal, when receiving the third signal. The fourth signal has the same logic as the first signal. The fifth signal has the same logic as the second signal. The lookup table sends a sixth signal and a seventh signal, when receiving the fourth signal and the fifth signal. The second circuit sends an eighth signal, when receiving the sixth signal and the seventh signal. The first circuit sends a ninth signal, when receiving the eighth signal. The lookup table includes a memory. The sixth signal and the seventh signal are generated from data stored in the memory.

3D microelectronic device provided with several superimposed layers of components with an upper layer comprising one or several memory cells having a SRAM structure and provided with a rear biasing electrode of which the biasing is modified to switch the cells from a ROM mode operating mode to a SRAM mode operating mode (FIG. 2).

Embodiments include nonvolatile a memory (NVM) device that can be configured for logic switching and/or digital computing. For example, embodiments of the NVM device can be configured as any one or combination of a memory cell, a D flip flop (DFF), a Backup and Restore circuit (B&R circuit), and/or a latch for a DFF. Any of the NVM devices can have a Fe field effect transistors (FeFET) configured to exploit the I.sub.DSV.sub.G hysteresis of the steep switch at low voltage for logic memory synergy. The FeFET-based devices can be configured to include a wide hysteresis, a steep hysteresis edge, and high ratio between the two I.sub.DS states at V.sub.G=0.

A layout pattern of a static random access memory includes a pull-up device, a first pull-down device, a second pull-up device, a second pull-down device, a first pass gate device and a second pass gate device disposed on a substrate. A plurality of fin structures are disposed on the substrate, and the fin structures include at least one first fin structure and at least one second fin structure. A J-shaped gate structure is disposed on the substrate, including a long part, a short part and a bridge part. At least one first extending contact structure crosses over the at least one first fin structure and the at least one second fin structure, wherein the at least one first extending contact structure does not overlap with the bridge part of the J-shaped gate structure.

A fuse latch of a semiconductor device including PMOS transistors and NMOS transistors includes a data transmission circuit configured to transmit data to a first node and a second node in response to a first control signal, a latch circuit configured to latch the data received from the data transmission circuit through the first node and the second node, and a data output circuit configured to output the data latched by the latch circuit in response to a second control signal. NMOS transistors contained in the data transmission circuit, the latch circuit, and the data output circuit may be formed in first, fourth, and fifth active regions, PMOS transistors are formed in second and third active regions, and the first to fifth active regions are sequentially arranged in a first direction.

The disclosed technology relates to a non-volatile (NV) static random-access memory (SRAM) device, and to a method of operating the same. The NV-SRAM device includes a plurality of bit-cells, wherein each bit-cell comprises: an SRAM bit-cell; a first bit-line connected via a first access element to the SRAM bit-cell; a NV bit-cell connected via a switch to the SRAM bit-cell; and a second bit-line connected via a second access element to the NV bit-cell. The NV-SRAM device is configured to independently write data from the first bit-line into the SRAM bit-cell through the first access element, and respectively from the second bit-line into the NV bit-cell through the second access element.

Provided is a static random-access memory (SRAM) device. The SRAM device includes a substrate including a PMOS area, a circuit wiring structure including an insulating layer and a wiring layer alternately stacked on the substrate, wherein the circuit wiring structure includes a first NMOS area and a second NMOS area vertically separated from the PMOS area with the first NMOS area therebetween, a first transistor including a first gate electrode disposed on the PMOS area, source/drain areas formed on the PMOS area on both sides of the first gate electrode, and a first channel connecting the source and drain areas to each other, a second transistor including a second gate electrode disposed in the first NMOS area and a second channel vertically overlapping the second gate electrode, and a third transistor including a third gate electrode disposed in the second NMOS area and a third channel vertically overlapping the third gate electrode, wherein the first channel includes silicon, wherein the second channel and the third channel include an oxide semiconductor.

To reduce the area of a memory cell having a backup function. A storage device includes a cell array, and a row circuit and a column circuit that drive the cell array. The cell array includes a first power supply line, a second power supply line, a word line, a pair of bit lines, a memory cell, and a backup circuit. The cell array is located in a power domain where power gating can be performed. In the power gating sequence of the cell array, data in the memory cell is backed up to the backup circuit. The backup circuit is stacked over a region where the memory cell is formed. A plurality of wiring layers are provided between the backup circuit and the memory cell. The first power supply line, the second power supply line, the word line, and the pair of bit lines are located in different wiring layers.

A circuit comprises an array of programmable memory elements fabricated on a substrate, each memory element having one or more processable regions which, when processed by an external process in which a material is applied to at least partially cover one or more of the regions, are configured to program that memory element to one of multiple states; a first set of control lines connected to the array of memory elements, by which the contents of each individual memory element are capable of being accessed by control signals applied to a respective combination of at least two control lines in the first set of control lines; and an array of second circuit elements, different to the memory elements, each connected to a control line of the first set of control lines and to another control line of a second set of control lines, different to the first set of control lines, so as to provide access to second circuit elements in the array.

A digital logic device is disclosed that includes registers, SRAM, DRAM, and a processor configured to store in the registers an initial portion of a first response data to a command, and store in the SRAM the first response data. The processor is further configured to store in a lookup table the memory location and size of the first response data in the SRAM, store in the DRAM additional response data, and store in the lookup table the memory location and size of the additional response data in the DRAM. The processor is configured to receive the command from a host device, retrieve the first response data from the registers or the SRAM, and send the first response data to the host. If the command includes additional response data, the processor is configured to concurrently retrieve the additional response data from DRAM and send the additional response data to the host.