An electronic circuit includes: a bistable circuit connected between first and second power sources respectively supplied with first and second power-supply voltages and including first and second inverters connected in a loop being inverter circuits switching between first and second modes; a control circuit outputting first and second signals respectively setting the inverter circuits in the first and second modes to the inverter circuits; and a power-supply circuit supplying a first voltage as a power-supply voltage while the inverter circuits are in the first mode, and supplying a second voltage higher than the first voltage as the power-supply voltage while the inverter circuits are in the second mode, wherein the first mode exhibits hysteresis in a transfer characteristic curve and the second mode exhibits no hysteresis in a transfer characteristic curve, and/or the first mode has a steeper transfer characteristic curve than the second mode.

A nonvolatile memory device includes a memory cell array including a plurality of nonvolatile memory cells; a page buffer circuit connected to the memory cell array through a plurality of bit lines; a calculation circuit configured to perform a calculation on information bits and weight bits based on a calculation window having a first size, the information bits and weight bits being included in a user data set, the memory cell array being configured to store the user data set, the calculation circuit being further configured to receive the user data set through the page buffer circuit; and a data input/output (I/O) circuit connected to the calculation circuit, wherein the calculation circuit is further configured to provide an output data set to the data I/O circuit in response to the calculation circuit completing the calculation with respect to all of the information bits and the weight bits, and wherein the output data set corresponds to a result of the completed calculation.

A memory cell is disclosed, comprising a static random-access memory, SRAM, bit cell, a first resistive memory element and a second resistive memory element. The first resistive memory element is connected to a first storage node of the SRAM bit cell and a first intermediate node, and the second resistive memory element connected to a second storage node of the SRAM bit cell and a second intermediate node. Each one of the first intermediate node and the second intermediate node is configured to be supplied with a first supply voltage via a first transistor and a second supply voltage via a second transistor, wherein the first transistor and the second transistor are complementary transistors separately controllable by a first word line and a second word line, respectively. Methods for operating such a memory cell are also disclosed.

An example apparatus according to an embodiment of the disclosure includes first and second voltage terminals, and first, second, and third circuit nodes. A potential of the first circuit node is changed based on an input signal. A flip-flop circuit includes first and second inverters cross-coupled to each other. The first inverter is coupled between the first voltage terminal and the second circuit node. A first transistor is coupled between the second and third circuit nodes, and the first transistor has a control electrode coupled to the first circuit node. A first current control circuit is coupled between the third circuit node and the second voltage terminal, and an amount of current flowing through the first current control circuit being controlled based on a first code signal.

A semiconductor structure includes first and second source/drain region disposed in a semiconductor body and spaced from each other by a channel region. A gate electrode overlies the channel region and a capacitor electrode is disposed between the gate electrode and the channel region. A first gate dielectric is disposed between the gate electrode and the capacitor electrode and a second gate dielectric disposed between the capacitor electrode and the channel region. A first electrically conductive contact region is in electrical contact with the gate electrode and a second electrically conductive contact region in electrical contact with the capacitor electrode. The first and second contact regions are electrically isolated from one another.

A semiconductor circuit includes first (IV1, IV3) and second (IV2, IV4) circuits, first (31) and second (32) transistors, a first storage element (35), and a driver (22, 23, 52, 53). The first (IV1, IV3) and second (IV2, IV4) circuits, respectively, apply inverted voltages of voltages at first (N1) and second (N2) nodes to the second (N2) and first (N1) nodes. The first transistor (31) is turned on to couple the first (N1) and third nodes. The second transistor (32) includes a gate coupled to the first node (N1), a drain and a source. One of the drain and the source is coupled to the third node, and another is supplied with a first control voltage (SCL1). The first storage element (35) includes a first end coupled to the third node and a second end supplied with a second control voltage (SCTRL). The first storage element (35) is able to take a first or second resistance state. The driver (22, 23, 52, 53) controls operation of the first transistor (31) and generates the first (SCL1) and second (SCTRL) control voltages.

A storage device capable of performing power gating is provided. A memory cell of the storage device includes a bistable circuit, a first transistor, a second transistor, and a backup circuit. The first transistor and the second transistor are electrically connected to a first bit line and a second bit line, respectively. A precharge circuit that precharges the first bit line and the second bit line with different voltages is provided. The backup circuit includes a retention node, an input node, an output node, a third transistor, a fourth transistor, and a capacitor. The third transistor controls electrical continuity between the retention node and the input node. A gate of the fourth transistor and a terminal of the capacitor are electrically connected to the retention node. The input node is electrically connected to one of nodes Q and Qb of the bistable circuit, and the output node is electrically connected to the other of the nodes Q and Qb of the bistable circuit.

A memory cell includes a latch, two antifuse elements, and two select transistors. The latch is connected with a first node and a second node, and receives a first power voltage and a second power voltage. The latch is selectively enabled or disabled according to an enable line voltage. The first antifuse element is connected with the first node and an antifuse control line. The second antifuse element is connected with the second node and the antifuse control line. The gate terminal, the first drain/source terminal and the second drain/source terminal of the first select transistor are connected with a word line, the first node and a bit line, respectively. The gate terminal, the first drain/source terminal and the second drain/source terminal of the second select transistor are connected with the word line, the second node and an inverted bit line, respectively.

The present invention provides a semiconductor memory circuit, the semiconductor memory circuit includes a static random access memory (SRAM), having a first storage node and a second storage node, a dynamic oxide semiconductor random access memory (DOSRAM), electrically connected to the SRAM, wherein the DOSRAM includes a first oxide semiconductor field effect transistor (OSFET) and a capacitor, wherein a source of the first OSFET is electrically connected to the first storage node, and a drain of the first OSFET is electrically connected to the capacitor, and a second transistor and a third oxide semiconductor field effect transistor (OSFET), wherein a drain of the second transistor is electrically connected to the second storage node, a source of the third OSFET is electrically connected to the capacitor, and a drain of the third OSFET is electrically connected to a gate of the third transistor.

According to one embodiment, a semiconductor integrated circuit includes a ROM, an SRAM, a memory and a selector. The ROM stores initialization data. At least part of the initialization data is writable to the SRAM. The memory stores information indicating whether data is written to the SRAM. The selector outputs one of data supplied from the SRAM and data supplied from the ROM in accordance with the information stored in the memory.