A normally-off state of an OS transistor is maintained or an on-state current thereof is increased without additionally generating a positive potential or a negative potential. When data is written to a node connecting an OS transistor and a capacitor, a potential supplied to the other side of the capacitor is set to an L level, and when the data is retained, the potential is switched from the L level to an H level. In addition, a power switch for a volatile memory circuit is provided on a low power supply potential side so that the supply of a power supply voltage can be stopped. Accordingly, at the time of data retention, a source and a drain of the OS transistor can be set at a high potential, whereby the normally-off state can be maintained and the on-state current can be increased.

A memory device with reduced power consumption is provided.

The memory device includes a plurality of memory cells, a precharge circuit, a latch circuit, a bit line pair, and a local bit line pair. The precharge circuit has a function of supplying precharge voltage to the local bit line pair. The plurality of memory cells are connected to the local bit line pair. The latch circuit is connected to the local bit line pair. The latch circuit in a standby state is preferably supplied with the precharge voltage and one of low power supply voltage and high power supply voltage.

An example apparatus according to an embodiment of the disclosure includes first and second voltage terminals, and first, second, and third circuit nodes. A potential of the first circuit node is changed based on an input signal. A flip-flop circuit includes first and second inverters cross-coupled to each other. The first inverter is coupled between the first voltage terminal and the second circuit node. A first transistor is coupled between the second and third circuit nodes, and the first transistor has a control electrode coupled to the first circuit node. A first current control circuit is coupled between the third circuit node and the second voltage terminal, and an amount of current flowing through the first current control circuit being controlled based on a first code signal.

A semiconductor integrated circuit according to an embodiment includes: first to third wiring lines; first memory elements disposed in a cross region between the first wiring lines and the second wiring lines; second memory elements disposed in a cross region between the first wiring lines and the third wiring lines; a first write control circuit connected to the first wiring lines: a first circuit connected to one of the second wiring lines and supplying a first potential; a second circuit connected to the other one of the second wiring lines and supplying a second potential lower than the first potential; SRAM cells connected to the third wiring lines; and a selection circuit including input terminals electrically connected to the first wiring lines and an output terminal, the selection circuit connecting one of the input terminals to the output terminal in accordance with an input signal.

The present invention provides a semiconductor memory circuit, the semiconductor memory circuit includes a static random access memory (SRAM), having a first storage node and a second storage node, a dynamic oxide semiconductor random access memory (DOSRAM), electrically connected to the SRAM, wherein the DOSRAM includes a first oxide semiconductor field effect transistor (OSFET) and a capacitor, wherein a source of the first OSFET is electrically connected to the first storage node, and a drain of the first OSFET is electrically connected to the capacitor, and a second transistor and a third oxide semiconductor field effect transistor (OSFET), wherein a drain of the second transistor is electrically connected to the second storage node, a source of the third OSFET is electrically connected to the capacitor, and a drain of the third OSFET is electrically connected to a gate of the third transistor.

A semiconductor device that has a long data retention time during stop of supply of power supply voltage by reducing leakage current due to miniaturization of a semiconductor element. In a structure where charge corresponding to data is held with the use of low off-state current of a transistor containing an oxide semiconductor in its channel formation region, a transistor for reading data and a transistor for storing charge are separately provided, thereby decreasing leakage current flowing through a gate insulating film.

Embodiments include nonvolatile a memory (NVM) device that can be configured for logic switching and/or digital computing. For example, embodiments of the NVM device can be configured as any one or combination of a memory cell, a D flip flop (DFF), a Backup and Restore circuit (B&R circuit), and/or a latch for a DFF. Any of the NVM devices can have a Fe field effect transistors (FeFET) configured to exploit the I.sub.DSV.sub.G hysteresis of the steep switch at low voltage for logic memory synergy. The FeFET-based devices can be configured to include a wide hysteresis, a steep hysteresis edge, and high ratio between the two I.sub.DS states at V.sub.G=0.

A memory cell includes a latch, two antifuse elements, and two select transistors. The latch is connected with a first node and a second node, and receives a first power voltage and a second power voltage. The latch is selectively enabled or disabled according to an enable line voltage. The first antifuse element is connected with the first node and an antifuse control line. The second antifuse element is connected with the second node and the antifuse control line. The gate terminal, the first drain/source terminal and the second drain/source terminal of the first select transistor are connected with a word line, the first node and a bit line, respectively. The gate terminal, the first drain/source terminal and the second drain/source terminal of the second select transistor are connected with the word line, the second node and an inverted bit line, respectively.

According to one embodiment, a semiconductor integrated circuit includes a ROM, an SRAM, a memory and a selector. The ROM stores initialization data. At least part of the initialization data is writable to the SRAM. The memory stores information indicating whether data is written to the SRAM. The selector outputs one of data supplied from the SRAM and data supplied from the ROM in accordance with the information stored in the memory.

A circuit comprises an array of programmable memory elements fabricated on a substrate, each memory element having one or more processable regions which, when processed by an external process in which a material is applied to at least partially cover one or more of the regions, are configured to program that memory element to one of multiple states;a first set of control lines connected to the array of memory elements, by which the contents of each individual memory element are capable of being accessed by control signals applied to a respective combination of at least two control lines in the first set of control lines;and an array of second circuit elements, different to the memory elements, each connected to a control line of the first set of control lines and to another control line of a second set of control lines, different to the first set of control lines, so as to provide access to second circuit elements in the array.