Patent classifications
G11C17/08
Semiconductor device
A semiconductor device has stored therein a plurality of bits of fixed data. The semiconductor device includes a plurality of memory elements that correspond, respectively, to the plurality of bits of the fixed data, and that acquire, store, and output the value of each bit received at an input terminal of each of the memory elements according to a timing signal. An initialization control unit feeds, to the plurality of memory elements, an initialization signal upon receipt of a fixed data setting signal, each of the plurality of memory elements being initialized to a state of storing a corresponding value represented by a bit of the fixed data according to the initialization signal.
Semiconductor device
A semiconductor device has stored therein a plurality of bits of fixed data. The semiconductor device includes a plurality of memory elements that correspond, respectively, to the plurality of bits of the fixed data, and that acquire, store, and output the value of each bit received at an input terminal of each of the memory elements according to a timing signal. An initialization control unit feeds, to the plurality of memory elements, an initialization signal upon receipt of a fixed data setting signal, each of the plurality of memory elements being initialized to a state of storing a corresponding value represented by a bit of the fixed data according to the initialization signal.
3D SRAM/ROM with several superimposed layers and reconfigurable by transistor rear biasing
A 3D microelectronic device is provided with several superimposed layers of components, with an upper layer including one or several memory cells having a SRAM structure and provided with a rear biasing electrode. The biasing of the rear biasing electrode is modified to switch the memory cells from a ROM operating mode to a SRAM operating mode.
3D SRAM/ROM with several superimposed layers and reconfigurable by transistor rear biasing
A 3D microelectronic device is provided with several superimposed layers of components, with an upper layer including one or several memory cells having a SRAM structure and provided with a rear biasing electrode. The biasing of the rear biasing electrode is modified to switch the memory cells from a ROM operating mode to a SRAM operating mode.
MEMORY DEVICE AND A METHOD OF OPERATING THE SAME
A memory device in accordance with a described method of operation includes a read only memory (ROM) address controller and a suspend signal generator. The ROM address controller is configured to sequentially output a plurality of operation ROM addresses at which ROM codes to be executed in response to an operation command are stored, and to suspend output of the plurality of operation ROM addresses in response to a suspend signal. The suspend signal generator is configured to generate the suspend signal that is activated during a preset period depending on whether a suspend ROM address is identical to an operation ROM address, among the plurality of operation ROM addresses, currently being output. The suspend ROM address is an address at which a ROM code, execution of which is to be suspended, among the ROM codes, is stored.
MEMORY DEVICE AND A METHOD OF OPERATING THE SAME
A memory device in accordance with a described method of operation includes a read only memory (ROM) address controller and a suspend signal generator. The ROM address controller is configured to sequentially output a plurality of operation ROM addresses at which ROM codes to be executed in response to an operation command are stored, and to suspend output of the plurality of operation ROM addresses in response to a suspend signal. The suspend signal generator is configured to generate the suspend signal that is activated during a preset period depending on whether a suspend ROM address is identical to an operation ROM address, among the plurality of operation ROM addresses, currently being output. The suspend ROM address is an address at which a ROM code, execution of which is to be suspended, among the ROM codes, is stored.
Non-volatile memory devices and systems with read-only memory features and methods for operating the same
Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as read-only memory by not implementing erase or write commands. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to compare an address of a received command to the one or more addresses, and at least in part based on the comparison, determine not to implement the received command. The circuitry can be further configured to return an error message after determining not to implement the received command.
Non-volatile memory devices and systems with read-only memory features and methods for operating the same
Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as read-only memory by not implementing erase or write commands. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to compare an address of a received command to the one or more addresses, and at least in part based on the comparison, determine not to implement the received command. The circuitry can be further configured to return an error message after determining not to implement the received command.
ROM chip manufacturing structures having shared gate electrodes
An integrated circuit (IC) chip embodiment includes first and second ROM cells arranged in a same row of a ROM array. The first and second ROM cells include first portions of first and second gate structures, respectively. The IC chip further includes a strap cell disposed between the first and second ROM cells. The strap cell includes second portions of the first and second gate structures. The first gate structure is physically separated from the second gate structure.
ROM chip manufacturing structures having shared gate electrodes
An integrated circuit (IC) chip embodiment includes first and second ROM cells arranged in a same row of a ROM array. The first and second ROM cells include first portions of first and second gate structures, respectively. The IC chip further includes a strap cell disposed between the first and second ROM cells. The strap cell includes second portions of the first and second gate structures. The first gate structure is physically separated from the second gate structure.