Embodiments combine error correction code (ECC) and transparent memory built-in self-test (TMBIST) for memory fault detection and correction. An ECC encoder receives input data and provides ECC data for data words stored in memory. Input XOR circuits receive the input data and output XOR'ed data as payload data for the data words. Output XOR circuits receive the payload data and output XOR'ed data. An ECC decoder receives the ECC data and the XOR'ed output data and generates error messages. Either test data from a controller running a TMBIST process or application data from a processor executing an application is selected as the input data. Either test address/control signals from the controller or application address/control signals from the processor are selected for memory access. During active operation of the application, memory access is provided to the processor and the controller, and the memory is tested during the active operation.

A storage apparatus includes an interface and storage circuitry. The interface communicates with a plurality of memory cells, and an individual one of the plurality of memory cells stores data in multiple programming levels. The storage circuitry configured to program data to a first group of multiple memory cells in a number of programming levels larger than two, using a One-Pass Programming (OPP) scheme that results in a first readout reliability level. After programming the data, the storage circuitry is further configured to read the data from the first group, and program the data read from the first group to a second group of the memory cells, in a number of programming levels larger than two, using a Multi-Pass Programming (MPP) scheme that results in a second readout reliability higher than the first reliability level, and reading the data from the second group of the memory cells.

Exemplary methods, apparatuses, and systems include receiving a plurality of read operations. The read operations are divided into a current set of a sequence of read operations and one or more other sets. The size of the current set is a first number of read operations. An aggressor read operation is selected from the current set. A data integrity scan is performed on a victim of the aggressor and a first indicator of data integrity is determined based on the first data integrity scan. A size of a subsequent set of read operations is set to a second number, which less than the first number, based on the indicator of data integrity.

Methods and systems for testing memory systems are disclosed. A refresh rate for a test system including a number of memory devices may be controlled based on estimated power scenario of a memory system design. In response to performance of a number of refresh operations on the memory devices and based on the refresh rate, one or more conditions of the test system may be monitored to generate estimated performance data for the memory system design.

Methods, systems, and devices for techniques for memory error correction are described. A memory system may support a refresh with error correction code (ECC) operation. The refresh with ECC operation may be indicated in a command from a host device to a memory device, or the memory device may support executing the refresh with ECC operation autonomously, for example as part of a self-refresh operation. The refresh with ECC operation may cause the memory system to, as part of a refresh operation for a row of a memory array, perform an error correction operation on at least a portion of the row. The error correction operation may correct bit errors in a set of data before an additional bit of the set of data is corrupted. The address of the portion of the row may be determined using one or more counters associated with an ECC patrol block.

Methods, systems, and devices for techniques for memory error correction are described. A memory system may support a refresh with error correction code (ECC) operation. The refresh with ECC operation may be indicated in a command from a host device to a memory device, or the memory device may support executing the refresh with ECC operation autonomously, for example as part of a self-refresh operation. The refresh with ECC operation may cause the memory system to, as part of a refresh operation for a row of a memory array, perform an error correction operation on at least a portion of the row. The error correction operation may correct bit errors in a set of data before an additional bit of the set of data is corrupted. The address of the portion of the row may be determined using one or more counters associated with an ECC patrol block.

Systems and methods for detecting a row hammer in a memory comprising a plurality of memory cells arranged in a plurality of rows may include: a plurality of detection cells in a subject row of memory cells, the detection cells to be set to respective initial states and configured to transition to a state different from their initial states in response to activations of memory cells in an adjacent row of memory cells; a comparison circuit to compare current states of the detection cells with initial states of the detection cells and to determine whether any of the detection cells have a current state that is different from their corresponding initial states; and a trigger circuit to trigger a refresh of the memory cells in the subject row based on a detection of detection cells in the subject row having current states that are different from their corresponding initial states.

A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.

A semiconductor memory device includes a memory cell array, an error correction circuit, an error log register and a control logic circuit. The memory cell array includes a plurality of memory bank arrays and each of the memory bank arrays includes a plurality of pages. The control logic circuit is configured to control the error correction circuit to perform an ECC decoding sequentially on some of the pages designated at least one access address for detecting at least one bit error, in response to a first command received from a memory controller. The control logic circuit performs an error logging operation to write page error information into the error log register and the page error information includes a number of error occurrence on each of the some pages determined from the detecting.

A method of operating a nonvolatile memory system including a memory device having a plurality of memory blocks includes selecting a source block among the plurality of memory blocks in the nonvolatile memory system, and performing a reclaim operation for the source block based on the number of program and erase cycles which have been performed on the source block.