In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

The present disclosure relates to a memory test system and a memory test method. The memory test system comprises: a plurality of test devices, a host computer, and driving modules. Each of the test devices is provided with a test interface used for connecting a memory to be tested. The host computer is respectively connected to the plurality of test devices and configured to control the test devices to test the memory to be tested. The driving modules are connected to the test devices and configured to output, to the test devices, driving signals used for driving the test devices to perform data interaction with the host computer.

The present disclosure relates to a memory test system and a memory test method. The memory test system comprises: a plurality of test devices, a host computer, and driving modules. Each of the test devices is provided with a test interface used for connecting a memory to be tested. The host computer is respectively connected to the plurality of test devices and configured to control the test devices to test the memory to be tested. The driving modules are connected to the test devices and configured to output, to the test devices, driving signals used for driving the test devices to perform data interaction with the host computer.

The present application provides a parameter setting method and apparatus, a system, and a storage medium. The parameter setting method includes: obtaining first setting values of multiple memory parameters and storage locations of the multiple memory parameters in a non-volatile memory; generating a first parameter setting instruction according to the first setting value and the storage location of each memory parameter; and sending the first parameter setting instruction to a test device, so that the test device sets the memory parameter stored at the storage location in the non-volatile memory as the first setting value.

A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

A test apparatus configured to test a device under test includes a power supply and a power compensation circuit. The power supply is configured to supply electric power to a power supply terminal of the device under test via a first route or a second route that are connected in parallel. The first route includes a first switch element configured to be controlled according to a first control signal. The power compensation circuit is located on the second route, wherein the power compensation circuit includes a second switch element configured to be controlled according to a second control signal, the power compensation circuit is configured to generate a compensation pulse current when the first switch element is turned off and the second switch element is turned on.

A testing device comprises test interface circuitry, probe circuitry, and initiate state machine circuitry. The test interface circuitry is configured to receive NAND signaling when operatively coupled to a M-NAND memory device under test and to operate the M-NAND memory device under test to receive memory access requests and to provide status or data at the same rate it receives memory access requests. The probe circuitry is configured to detect memory operations of the memory device under test. The finite state machine circuitry is operatively coupled to the probe circuitry and is configured to advance through multiple circuit states according to the detected memory operations; and log memory events of the memory device under test according to the circuit states.

Example embodiments provide for a storage device that includes a storage controller including a plurality of analog circuits and at least one nonvolatile memory device including a first region and a second region. The at least one nonvolatile memory device stores user data in the second region and stores trimming control codes in the first region as a compensation data set. The trimming control codes are configured to compensate for offsets of the plurality of analog circuits and are obtained through a wafer-level test on the storage controller. The storage controller, during a power-up sequence, reads the compensation data set from the first region of the at least one nonvolatile memory device, stores the read compensation data set therein, and adjusts the offsets of the plurality of analog circuits based on the stored compensation data set.

Methods and apparatus relating to a resistive network splitter for enhanced probing solutions are described. In one embodiment, an interposer interface is coupled between a first component and a second component to allow a probe to capture one or more waveforms to be exchanged between the first component and the second component. A resistive network splitter couples the interposer interface to the probe and the second component and the resistive network comprises a plurality of resistors. Other embodiments are also claimed and disclosed.

The present application relates to the technical field of integrated circuits, and in particular, to a memory test method and a memory test apparatus. The memory test method includes: providing a to-be-tested memory, where the to-be-tested memory includes a plurality of memory cells; alternately writing a first write value and a second write value into a memory cell of the memory cells at a preset frequency; writing a test write value into the memory cell; judging whether a data read from the memory cell is the test write value, and determining that a capacitance-frequency characteristic of the memory cell is abnormal if the data is not the test write value. According to the present application, the capacitance-frequency characteristic of the to-be-tested memory is accurately tested, to improve the field of memory products.