Methods, systems, and devices for apparatus for differential memory cells are described. An apparatus may include a pair of memory cells comprising a first memory cell and a second memory cell, a word line coupled with the pair of memory cells and a plate line coupled with the pair of memory cells. The apparatus may further include a first digit line coupled with the first memory cell and a sense amplifier and a second digit line coupled with the second memory cell and the sense amplifier. The apparatus may include a select line configured to couple the first digit line and the second digit line with the sense amplifier.

A sense amplifier of a memory device that includes sense amplifier circuits and a reference sharing circuit is introduced. The sense amplifier circuits are configured to sense the plurality of bit lines according to an enable signal. The reference sharing circuit includes first switches and second switches that are coupled to the reference nodes and second reference nodes of the sense amplifier circuits, respectively. The first switches and second switches are controlled according to a control signal to control a first electrical connection among the first reference nodes, and to control a second electrical connection among the second reference nodes. An operation method of the sense amplifier and a memory device including the sense amplifier are also introduced.

The present disclosure includes apparatuses and methods for data replication. An example apparatus includes a plurality of sensing circuitries comprising respective sense amplifiers and compute components and a controller. The controller may be configured to cause replication of a data value stored in a first compute component such that the data value is propagated to a second compute component.

Electrically conductive line side-by-side running distance equalization and related apparatuses and systems. An apparatus includes a first sense amplifier, a second sense amplifier, a first pair of lines, and a second pair of lines. The first sense amplifier includes a first pull-up sense amplifier and a first pull-down sense amplifier. The first pair of lines electrically connects a first pull-up sense amplifier of the first sense amplifier to a first pull-down sense amplifier of the first sense amplifier. The second pair of lines electrically connects the second pull-up sense amplifier to the second pull-down sense amplifier. Parallel running distances between lines of the first pair of lines and the second pair of lines are equalized by a wiring twist of the first pair of lines and three wiring twists of the second pair of lines.

Memory systems with burst mode having logic gates as sense elements and related methods are provided. A memory system comprises a memory array including a first set of memory cells coupled to a first wordline, a second set of memory cells coupled to a second wordline, and a plurality of sense elements, not including any sense amplifiers. The control unit is configured to generate control signals for: in response to a burst mode read request, simultaneously: (1) asserting a first wordline signal on the first wordline coupled to each of a plurality of first set of bitlines, and (2) asserting a second wordline signal on the second wordline coupled to each of a plurality of second set of bitlines, and as part of a burst, outputting data corresponding to a subset of each of the first set of memory cells and the second set of memory cells.

A memory device comprising a plurality of memory cells situated in a first cell field, multiple first bit lines, each respectively connected to multiple memory cells of the first cell field to enable access to the memory cells via the bit line, and multiple sense amplifier pairs which respectively comprise a first and a second sense amplifier. Each first bit line is assigned to a sense amplifier pair, each first bit line being connected to a respective first semiconductor switch element, through which the bit line is electroconductively connectible to and insulatable from the first sense amplifier of the sense amplifier pair, to which the bit line is assigned. Each first bit line is connected to a respective second semiconductor switch element, through which the bit line is electroconductively connectible to and insulatable from the second sense amplifier of the sense amplifier pair, to which the bit line is assigned.

The present disclosure includes apparatuses and methods for bank to bank data transfer. An example apparatus includes a plurality of banks of memory cells, an internal bus configured to transfer data between the plurality of banks and an external bus interface, and a bank-to-bank transfer bus configured to transfer data between the plurality of banks.

A pseudo dual port memory device in which an operating speed is improved and stability is increased is provided. The pseudo dual port memory device may include a memory cell, a pair of bit lines connected to the memory cell, a write driver, a sense amp, and a column multiplexer which is connected to the bit lines, receives a write multiplexer control signal and a read multiplexer control signal, connects the bit lines to the write driver in response to the write multiplexer control signal, and connects the bit lines to the sense amp in response to the read multiplexer control signal. A precharge control signal generation circuit which is connected to the column multiplexer may generate a precharge control signal on the basis of the read and write multiplexer control signals, and a bit line precharge circuit may precharge the bit lines based on the precharge control signal.

In a memory device, pages are arrayed in a column direction, each page constituted by memory cells arrayed in row direction on an insulating substrate. Each memory cell includes a zonal P layer. N.sup.+ layers continuous with a source line and a bit line respectively are on both sides of the P layer. Gate insulating layers surround part of the P layer continuous with the N.sup.+ layer and part of the P layer continuous with the N.sup.+ layer 3b, respectively. One side surface and the other side surface of the gate insulating layer are covered with a gate conductor layer continuous with a first plate line and a gate conductor layer continuous with a second plate line, respectively. A gate conductor layer continuous with a word line surrounds the gate insulating layer.

In a memory device, pages are arrayed in a column direction on a substrate, each page constituted by memory cells arrayed in row direction on a substrate. Each memory cell includes a zonal P layer. N.sup.+ layers continuous with a source line and a bit line respectively are on both sides of the P layer. Gate insulating layers surround part of the P layer continuous with the N.sup.+ layer and part of the P layer continuous with the N.sup.+ layer, respectively. One side surface of the gate insulating layer is covered with a gate conductor layer continuous with a first plate line, and the other side surface is covered with a gate conductor layer continuous with a second plate line. A gate conductor layer continuous with a word line surrounds the gate insulating layer.