Methods and apparatus for a novel memory array are disclosed. In an embodiment, a method is provided for reading a dynamic random-access memory (DRAM) array. The method includes activating the bit line select gates to equalize voltage levels on a plurality of bit lines, deactivating the bit line select gates to maintain the equalized voltage levels on the plurality of bit lines using a bit line capacitance associated with each bit line, and activating a selected word line to access selected memory cells connected to the selected word line. The method also includes activating bit line select gates to pass first data from a first bit line and second data from a second bit line to the sense amplifier. The first data is from a selected memory cell and the second data is reference data. The method also includes determining sensed data from the first and second data.

A semiconductor memory device includes a plurality of data latch circuits that are used for input and output of data between a sense amplifier circuit and an input/output circuit, and a data bus that is connected to the plurality of data latch circuits. Each of the data latch circuits includes an inverter circuit that temporarily stores data input and output between the sense amplifier circuit and the input/output circuit, and at least three MOS transistors between the inverter circuit and the data bus. The at least three MOS transistors may be multiple N-channel type MOS transistors and at least one P-channel type MOS transistor connected in parallel between the inverter circuit and the data bus, or at least one N-channel type MOS transistor and multiple P-channel type MOS transistors connected in parallel between the inverter circuit and the data bus.

A semiconductor device includes a cell circuit including a plurality of memory arrays, and a control circuit configured to control the cell circuit. A memory array of the plurality of memory arrays has a plurality of sub-arrays including a first sub-array and a second sub array, and an array connecting circuit configured to connect bit lines of the first sub-array to respective corresponding bit lines of the second sub-array according to a copy signal. The semiconductor device may further include a partial sum circuit configured to perform charge sharing between a plurality of bit lines of the first sub-array.

An electronic device includes memory banks and repair circuitry configured to remap data from the memory banks to repair memory elements of the memory banks when a failure occurs. The repair circuitry includes a logic gate configured to receive an output from a memory bank of the memory banks, receive a failure signal indicating whether a corresponding memory element has failed, and transmit the output with a value of the output is based at least in part on the failure signal. The repair circuitry also includes error correction circuitry configured to receive the output via the logic gate and a multiplexer configured to receive the output from the memory bank, receive a repair value, and selectively output the output or the repair value from the repair circuitry as an output of the repair circuitry.

Crossbar arrays perform analog vector-matrix multiplication naturally and provide a building block for modern computing systems. Specialized mixed-signal interface circuits are interfaced with the rows and columns of the crossbar arrays. During operation, the mixed-signal interface circuits provide high voltages for write operations and low voltages for read operations. This disclosure presents improved designs for the mixed-signal interface circuits which minimize the number of switches as well as the number level shifters.

Apparatuses, systems, and methods for single-ended sense amplifiers. A memory device may include a number of sense amplifiers used to read the voltage of memory cells along digit lines. Double-ended sense amplifiers are coupled to two digit lines. Single-ended sense amplifiers are coupled to a single digit line. The memory cells of an edge word line of a memory array may alternately be coupled to a single-ended sense amplifier or a double-ended sense amplifier. The use of single-ended sense amplifiers may reduce a footprint for a given number of memory cells in the array.

The present disclosure provides a memory circuit and a memory. The memory circuit at least includes a plurality of memory blocks. Each of the memory blocks includes a first memory sub-block, a second memory sub-block, and a third memory sub-block arranged in sequence; the second memory sub-block includes a first memory unit and a second memory unit; the first memory sub-block and the first memory unit are configured to store high-order bytes; the second memory unit and the third memory sub-block are configured to store low-order bytes; and in an arrangement direction of memory sub-blocks, different memory units that are arranged side by side have different block selection addresses.

A memory device includes a memory array having a plurality of memory cells and a column decoder circuit that is configured to provide at least one column select signal for selecting corresponding bit-lines for memory operations on the plurality of memory cells. The memory device also includes a column select section that is configured to route the at least one column select signal such that non-adjacent bit-lines are exclusively selected during a same column select access memory operation.

Memory devices might include a capacitor, a first capacitance element, a first transistor, and control logic. The first transistor might be connected between the capacitor and the first capacitance element. The control logic might be connected to a control gate of the first transistor. The control logic might be configured to activate the first transistor to precharge the capacitor and the first capacitance element during a read operation of the memory device. The first capacitance element might be a wire capacitance of a first signal line.

A memory device includes first to nth decks respectively coupled to first to nth row lines which are stacked over a substrate in a vertical direction perpendicular to a surface of the substrate, n being a positive integer, a first connection structure extending from the substrate in the vertical direction to be coupled to the first row line, even-numbered connection structures extending from the substrate in the vertical direction and respectively coupled to ends of even-numbered row lines among the second to nth row lines, and odd-numbered connection structures extending from the substrate in the vertical direction and respectively coupled to ends of odd-numbered row lines among the second to nth row lines. The even-numbered connection structures are spaced apart from the odd-numbered connection structures with the first row line and the first connection structure that are interposed between the even-numbered connection structures and the odd-numbered connection structures.