The present disclosure includes apparatuses and methods for data movement. An example apparatus comprises a memory device. The memory device includes an array of memory cells and sensing circuitry coupled to the array via a plurality of sense lines. The sensing circuitry includes a sense amplifier and a compute component coupled to a sense line and configured to implement operations. A controller in the memory device is configured to couple to the array and sensing circuitry. A shared I/O line in the memory device is configured to couple a source location to a destination location.

A power control system, method, and architecture are disclosed for a multi-bank memory which provides independent, concurrent memory access to at least one memory block in each memory bank by using observation circuits to monitor bus masters connected over bus master interface signals to an interconnect for memory access requests to the multi-bank memory and to provide notifications to a power control circuitry that a valid memory access request was issued by a bus master over the bus master interface, where the power control circuitry processes the notifications received from each observation circuit and generates therefrom power control signals that are provided directly to each memory block and to bypass the interconnect, thereby separately controlling a power state for each memory block with power-up control signals that arrive at each memory block at or before a memory access request sent over the interconnect.

A main board and a computer apparatus having the main board are provided. The main board includes a printed circuit board (PCB), a first connector, and a second connector. The PCB is configured for being electrically connected to a processor. The first connector is electrically connected to the PCB in a dual in-line package (DIP) manner, and is configured for a memory to be mounted to the first connector. The second connector is electrically connected to the PCB in a surface mount technology (SMT) manner, and is configured for the memory to be mounted to the second connector. Accordingly, transmission performance of memory signals may be improved.

Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.

A memory system includes memory devices sharing a data bus and a control bus and controlling the memory devices through the control bus, wherein the memory devices have different latencies each other, and a controller transceiving a data with the memory devices through the data bus, wherein the controller may transceive a data with the memory devices during a time corresponding to a data burst length for a moment being the each latencies of the memory devices after transmitting same control signals to the memory devices.

A semiconductor device includes: a memory region selection circuit for generating memory region select signals based on a memory region address signal and a mode identification signal, and activating one or more memory region select signals among memory region select signals during a first mode, or activating two or more memory region select signals among the memory region select signals during a second mode; a column selection circuit for generating column select signals based on a column address signal and the mode identification signal, and changing the column select signals during the first mode, or retaining the column select signals during the second mode; and memory regions of which one or more memory regions are accessed during the first mode or two or more memory regions are accessed during the second mode, based on the memory region select signals and the column select signals.

The disclosed controller includes a DDR architecture that includes a dual-channel interface designed to include DQS IO ports configured to generate a first DQS signal that is a distance of substantially 0.125 times the period of a clock signal (T denoting the 0.125 of the period of the clock signal) ahead of a rising edge of the clock signal and a second DQS signal that is a distance of substantially 0.125 times the period of the clock signal behind the rising edge of a clock signal. If T is more than a tDQSS then T is set to tDQSS, where tDQSS is a maximum allowable time between either DQS signal and the rising edge of the clock signal.

The present disclosure includes apparatuses and methods for data movement. An example apparatus comprises a memory device. The memory device includes an array of memory cells and sensing circuitry coupled to the array via a plurality of sense lines. The sensing circuitry includes a sense amplifier and a compute component coupled to a sense line and configured to implement operations. A controller in the memory device is configured to couple to the array and sensing circuitry. A shared I/O line in the memory device is configured to couple a source location and a destination location.

A memory control circuit unit, a memory storage device and a signal receiving method. In one exemplary embodiment, a memory interface circuit of the memory control circuit unit receives a first signal from a volatile memory and adjusts a voltage value of the first signal to a voltage range in response to an internal impedance of the memory interface circuit, where a central value of the voltage range is not equal to a default voltage value, and the default voltage value is one half a sum of a voltage value of a supply voltage of the memory interface circuit and a voltage value of a reference ground voltage. In addition, the memory interface circuit further generates an input signal according to a voltage correspondence between the first signal and an internal reference voltage.

Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.