G01B5/285

Cylindrical target production method and cylindrical target

To provide a process for producing a cylindrical target which has almost no distortion in the longitudinal direction. The process for producing a cylindrical target according to the present invention comprises the steps of: processing a target material into a cylindrical shape; providing an adapter for attachment to a sputtering apparatus, in the target material processed into the cylindrical shape; and measuring a straightness in a longitudinal direction of an appearance of the target material having the adapter to confirm whether the straightness of the target material having the adapter is within a predetermined range.

Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate

An indium phosphide substrate, a method of inspecting thereof and a method of producing thereof are provided, by which an epitaxial film grown on the substrate is rendered excellently uniform, thereby allowing improvement in PL characteristics and electrical characteristics of an epitaxial wafer formed using this epitaxial film. The indium phosphide substrate has a first main surface and a second main surface, a surface roughness Ra1 at a center position on the first main surface, and surface roughnesses Ra2, Ra3, Ra4, and Ra5 at four positions arranged equidistantly along an outer edge of the first main surface and located at a distance of 5 mm inwardly from the outer edge. An average value m1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.5 nm or less, and a standard deviation 1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.2 nm or less.

MEASUREMENT SYSTEM AND CHECKING METHOD
20240019238 · 2024-01-18 · ·

In a measurement system, a processor sets, on the basis of three-dimensional data, a movement route to be taken by a hand part to cause a contact to follow the surface of an object to be measured in such a manner that a reaction force detected by a force sensor becomes a predetermined value. The processor causes the contact to follow the surface of the object to be measured while adjusting the reaction force to become a predetermined value, and acquires a path taken by the hand part having moved. The processor acquires the roughness of the surface of the object to be measured from the contact during a period in which the contact is caused to follow the surface. The processor measures the dimension of the object to be measured on the basis of the path and at least one of the movement route and the three-dimensional data.

Wheel flange planeness detection device
10571240 · 2020-02-25 · ·

Disclosed is a wheel flange planeness detection device, comprising a frame, a lifting cylinder, a lifting platform, guide posts, a support frame, a servo motor, a bearing seat, a shaft, a bearing, a rotating platform, guide rails, a sliding block, a small chain wheel, a large chain wheel, a clamping cylinder, a chain wheel driving motor, a left sliding plate, rotating shafts, rotating wheels, a visual sensor, clamping guide rails, gear rack structures, a right sliding plate, intelligent dial indicators, a support plate, a linear motor and a motor support. The device may monitor the state of flange planeness in an automatic production line in real time; when the flange planeness is out of tolerance, the device may immediately give an alarm, and the technologist adjusts the machining process in time after receiving the alarm, thereby avoiding a large batch of rejects.

INDIUM PHOSPHIDE SUBSTRATE, METHOD OF INSPECTING INDIUM PHOSPHIDE SUBSTRATE, AND METHOD OF PRODUCING INDIUM PHOSPHIDE SUBSTRATE

An indium phosphide substrate, a method of inspecting thereof and a method of producing thereof are provided, by which an epitaxial film grown on the substrate is rendered excellently uniform, thereby allowing improvement in PL characteristics and electrical characteristics of an epitaxial wafer formed using this epitaxial film. The indium phosphide substrate has a first main surface and a second main surface, a surface roughness Ra1 at a center position on the first main surface, and surface roughnesses Ra2, Ra3, Ra4, and Ra5 at four positions arranged equidistantly along an outer edge of the first main surface and located at a distance of 5 mm inwardly from the outer edge. An average value m1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.5 nm or less, and a standard deviation 1 of the surface roughnesses Ra1, Ra2, Ra3, Ra4, and Ra5 is 0.2 nm or less.

Method and apparatus for verifying perpendicularity of concrete test specimen
10551161 · 2020-02-04 · ·

A perpendicularity verification device is provided for verifying perpendicularity of a concrete test specimen in a testing machine. The device comprises a unitary planar sheet. The sheet has an elongate vertical straight side edge and a horizontal straight bottom edge. The side and bottom edges are perpendicular to one another. A corner notch is provided between the side and bottom edges. In use, the bottom edge rests on a platen of the testing machine so that the notch circumvents a retaining cup of the testing machine and the vertical edge rests against the test specimen.

WALLBOARD SCORE, SNAP AND EDGE APPEARANCE TEST PROCEDURE

A procedure is provided for evaluating the score, snap and edge appearance of wallboard panels, and includes scoring a wallboard panel with a knife at a constant and known force using a benchtop board scoring device; snapping the scored panel in a Universal Board Testing Machine to measure the breaking force, forming a snapped panel edge; measuring a cleanliness of the snapped panel edge by placing a straight edge against the snapped panel edge and measuring gaps between the snapped panel edge and the straight edge in a plurality of locations on a face of the panel, and a plurality of locations on a back of the panel; and averaging all of the measured gaps to create an Index Score.

Continuous high resolution surface profiling apparatus and method
RE049844 · 2024-02-20 · ·

A surface profiler including at least one front support wheel and at least one rear support wheel for travelling along the surface of a profile to be measured, the rotational axes of said wheels being longitudinally spaced, and the wheels contacting the surface being profiled in a collinear manner. A frame carried on the wheels carries at least one inclinometer and at least two vertical distance measuring apparatus such as lasers, and may also carry an optical encoder. The lasers are collinear with each other and with the wheels. Incremental .[.to.]. measurements of inclination angles provided by the inclinometer, together with incremental measurements of distance to the surface being measured provided by the lasers, produce a continuous, high resolution mathematical series of elevations representing the surface profile, including reproduction of surface features that are smaller than the distance between the wheels.

Flatness detector

A flatness detector includes a positioning plate, a positioning assembly arranged on a top surface of the positioning plate, a dial indicator arranged on the positioning assembly, and a sliding block. The positioning assembly includes a first positioning rod and a second positioning rod perpendicularly coupled together and pin-jointed. The dial indicator includes a detecting post maintained as a plumb line by the positioning assembly. The sliding block defines a groove for conforming to the detecting post. A measurement value of the dial indicator is obtained when the groove of the sliding block is conformed to the detecting post.

METHOD FOR ANALYZING SURFACE WAVINESS
20190368863 · 2019-12-05 ·

Method for analyzing surface waviness of tooth flanks of a gearwheel, comprising: measuring two or more teeth of the gearwheel, wherein a deviation of their tooth flank geometry from the setpoint geometry is measured along at least one measuring path on each of the teeth; measuring at least one further tooth, wherein a deviation of its tooth flank geometry from the setpoint geometry is measured along at least one partial measuring path whose length is less than the length of the measuring path; and/or measuring at least one further tooth, wherein a deviation of the tooth flank geometry from the setpoint geometry is measured by touching at least one point on the tooth flank; associating a rotational angle with each measured value and determining a geometrically captured order spectrum by order analysis of the deviations plotted over the rotational angle, wherein one or more compensation and/or interpolation functions are determined.