A system for measuring the topography of a surface including a carriage assembly and a base assembly. The carriage assembly comprising a plurality of displacement-measuring probes coupled to a carriage support structure. The base assembly positioned adjacent to the carriage assembly and comprising at least one reference object with an opening sized to receive a test object. At least one of the carriage assembly or the base assembly is configured to translate with respect to the other in at least two directions to enable at least one of the displacement-measuring probes to measure a displacement to a reference surface of the reference object and at least another one of the displacement-measuring probes to measure a displacement to a target surface of the target object whose topography is measured.

A spectroscopic measuring apparatus and method are provided. The apparatus includes a first light source, object, microlens, and imaging lenses, an optical fiber, a spectrometer and a position controller. The object lens to allows light from the first light source to be incident on a stage configured to support a measurement object. The microlens is disposed between the object lens and the stage. The imaging lens images light reflected from the measurement object. The optical fiber has an input terminal disposed on a first image plane of the imaging lens. The spectrometer is disposed at an output terminal of the optical fiber. The position controller controls positions of the object lens, the microlens, and the optical fiber, and adjusts the position of the object lens so that a focus of the object lens is positioned at a virtual image position of a virtual image generated by the microlens.

Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The plurality of interference signals are transformed by the at least one processor into a plurality of spectrum signals each corresponding to the respective one of the positions on the surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

Disclosed are methods and an assembly for robust one-shot interferometry, in particular for optical coherence tomography according to the spatial domain approach (SD-OCT) and/or according to the light-field approach. In one embodiment, the method and the assembly may be used for measurements on material and living tissue, for distance measurement, for 2D or 3D measurement with a finely structured light source imaged onto the object in a diffraction-limited way, or with spots thereof. The assembly may comprise an interferometer having object and reference arms and a detector for electromagnetic radiation. In other embodiments, during a detection process, a plurality of spatial interferograms may be formed by making an inclined and/or curved reference wavefront interfere with an object wavefront for each measurement point. The resulting spatial interferograms may be detected in a single detector frame and may be further evaluated via a computer program.

A light interference measuring device comprises: a light source 20 that outputs light; a beam splitter 222 that causes the light output from the light source to diverge into a reference optical path and a measurement optical path and that outputs a combined wave in which reflection light that has passed through the reference optical path and reflection light that has passed through a measuring object arranged in the measurement optical path are combined; a reference mirror 231 that is arranged in the reference optical path and that reflects light which is diverged into the reference optical path by the beam splitter 222; a stage 12 that is arranged in the measurement optical path and that has the work W placed thereon; an imaging part 25 that images an image in which the combined wave is formed; a reference mirror adjustment mechanism (234, 238, 239) that adjusts a posture of the reference mirror 231; and a control part that controls the reference mirror adjustment mechanism such that a reflecting surface of the reference mirror 231 corresponds to a measurement surface of the work W, based on an image imaged in a condition where a work W is placed on the stage.

Disclosed are a testing apparatus and a testing method. When the testing apparatus is used to test a sample (11) to be tested, a first detection apparatus (21) and a second detection apparatus (22) can be switched by means of an objective lens switching apparatus (20), so as to acquire height information and structure information of the sample (11) to be tested. In the process, the sample (11) to be tested does not need to be transferred between testing apparatuses, thus, not only is pollution potentially created in the process of transferring the sample (11) to be tested avoided, and the probability of the sample (11) to be tested being polluted in the testing process reduced, but also a region to be tested of the sample (11) to be tested does not need to be determined repeatedly, improving the testing speed for the sample (11) to be tested.

Disclosed are a testing apparatus and a testing method. When the testing apparatus is used to test a sample (11) to be tested, a first detection apparatus (21) and a second detection apparatus (22) can be switched by means of an objective lens switching apparatus (20), so as to acquire height information and structure information of the sample (11) to be tested. In the process, the sample (11) to be tested does not need to be transferred between testing apparatuses, thus, not only is pollution potentially created in the process of transferring the sample (11) to be tested avoided, and the probability of the sample (11) to be tested being polluted in the testing process reduced, but also a region to be tested of the sample (11) to be tested does not need to be determined repeatedly, improving the testing speed for the sample (11) to be tested.

Embodiments of systems for classifying interference signals are disclosed. In an example, a system for classifying interference signals includes an interferometer including a light source and a detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip. A spectrum of the light source is greater than a spectrum of white light. The at least one processor is configured to classify the interference signals into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.

A method for detecting cracks in an aircraft or gas turbine component includes ascertaining geometric data about the component using an optical measurement method, analyzing the geometric data, using an electronic evaluation device, so as to automatically recognize and/or classify at least one of cracks and other damage and storing a position of the at least one of cracks and other damage.