G01B11/303

Methods and systems to measure properties of products on a moving blade in electronic device manufacturing machines

Implementations disclosed describe an optical inspection device comprising a source of light to direct a light beam to a location on a surface of a wafer, the wafer being transported from a processing chamber, wherein the light beam is to generate, a reflected light, an optical sensor to collect a first data representative of a direction of the first reflected light, collect a second data representative of a plurality of values characterizing intensity of the reflected light at a corresponding one of a plurality of wavelengths, and a processing device, in communication with the optical sensor, to determine, using the first data, a position of the surface of the wafer; retrieve calibration data, and determine, using the position of the surface of the wafer, the second data, and the calibration data, a characteristic representative of a quality of the wafer.

OPTICAL INTERFERENCE RANGE SENSOR

A light source projects a light beam. An interferometer includes a splitting unit that splits the light beam. The interferometer generates interference beams with the respective split light beams. Each of the interference beam is generated by interference between a measurement beam radiated toward the measurement target and reflected at the measurement beam and a reference beam passing through an optical path. A light-receiving unit receives the interference beams. A processor calculates a distance to the measurement target by associating at least one detected peak with at least one of the spots in accordance with a mirror surface mode or a rough surface mode. The optical path length difference is made different among the split light beams. In the mirror surface mode, the processor uses a distance calculated based on a peak corresponding to a spot for which the optical path length difference is shortest.

VEHICLE POSITION ESTIMATION METHOD AND VEHICLE CONTROL SYSTEM
20230081887 · 2023-03-16 · ·

A vehicle position estimation method includes: acquiring time-series data of a parameter related to a vertical motion of a wheel while the vehicle is traveling; acquiring the parameter around the vehicle, as a reference parameter, from a parameter map indicating a correspondence relationship between the parameter and a position; estimating a vehicle position based on a comparison between the time-series data of the parameter and time-series data of the reference parameter. Meanwhile, road surface roughness around the vehicle in a lateral direction and a lateral position of the vehicle in a road are recognized by using a recognition sensor installed on the vehicle. When the road surface roughness is less than a threshold, a lateral position component of the estimated vehicle position is replaced with the lateral position recognized by using the recognition sensor.

DEVICE FOR MEASURING COMPONENTS OF A PIPE PRIOR TO WELDING
20220334067 · 2022-10-20 ·

The invention relates to a device (1) for measuring the surface condition of a component (4, 5, 6). Said device (1) comprises a measurement member (2) comprising at least one sensor (21, 22, 23) capable of measuring at least one datum relating to the surface condition of the component (4, 5, 6) and at least one transmitter (24) capable of transmitting the datum from the sensor (21, 22, 23). The measurement device (1) also comprises a support (3) for the measurement member (2), the support comprising means for connecting same to the component (4, 5, 6).

Method for manufacturing semiconductor structure, inspection method, and semiconductor structure

There is provided a method for manufacturing a semiconductor structure, including: preparing a plate-like semiconductor structure; and inspecting the semiconductor structure, the inspection of the semiconductor further including: performing a measurement of irradiating a surface of the semiconductor structure with a light from a light source in an oblique direction to the surface, and detecting a reflected light reflected or scattered by the surface by a two-dimensional detector, at a plurality of locations within at least a predetermined range of the surface of the semiconductor structure, to acquire a reflected light distribution that is a distribution of an integrated value obtained by integrating intensity of the reflected light measured at the plurality of locations, with respect to a position at the detector; and fitting the reflected light distribution by a multiple Gaussian function obtained by adding at least a first Gaussian function and a second Gaussian function distributed more widely than the first Gaussian function, to acquire a parameter of the second Gaussian function as an index corresponding to a surface roughness of the semiconductor structure.

MEGASONIC CLEAN WITH CAVITY PROPERTY MONITORING
20230127302 · 2023-04-27 ·

Embodiments of megasonic cleaning chambers are provided herein. In some embodiments, a megasonic cleaning chamber includes: a chamber body defining an interior volume therein; a substrate support to support a substrate disposed in the interior volume; a supply tube comprising a transparent material configured to direct a cleaning fluid to the substrate support; a megasonic power generator coupled to the supply tube to provide megasonic power to the cleaning fluid; a megasonic transducer coupled to the megasonic power generator and the supply tube to create megasonic waves in the cleaning fluid and to form cavities in the cleaning fluid, wherein the megasonic transducer is configured to direct the megasonic waves and cavities toward the substrate support; and one or more sensors configured to generate a signal indicative of a property of the cavities in the cleaning fluid.

Feeding device of hole inspection device

According to one implementation, a feeding device of a hole inspection device having a probe includes an attaching jig, a movement mechanism, and a positioning jig. The probe is inserted into a hole to be inspected of an object in a central axis direction of the hole, for inspecting the hole. The attaching jig attaches the hole inspection device to the feeding device. The movement mechanism linearly reciprocates the hole inspection device together with the attaching jig. The positioning jig positions the movement mechanism to the object. A moving direction of the attaching jig and the hole inspection device is made parallel to the central axis direction of the hole by positioning the movement mechanism.

Reflective condensing interferometer

The present invention provides a reflective condensing interferometer for focusing on a preset focus. The reflective condensing interferometer includes a concave mirror set, a convex mirror, a light splitting element, and a reflecting element. The concave mirror set has first and second concave surface portions which are oppositely located on two sides of a central axis passing through the preset focus and are concave on a surface facing the central axis and the preset focus. Light is preset to be incident in parallel to the central axis in use. The convex mirror is disposed between the concave mirror set and the preset focus on the central axis, and is convex away from the preset focus. The light splitting element vertically intersects with the central axis between the convex mirror and the preset focus. The reflecting element is disposed between the light splitting element and the convex mirror.

ADDITIVE MANUFACTURING SYSTEM

An additive manufacturing system includes an additive manufacturing unit configured to shape an object including a plurality of layers, a measurement unit configured to measure a state of each of the plurality of layers, and a control unit. The control unit includes a storage unit configured to store reference information based on internal defect information indicating a defect existing inside a sample object shaped by the additive manufacturing unit and including the plurality of layers, based on an electromagnetic wave which has passed through the sample object, and sample measurement information indicating a measurement result of the plurality of layers of the sample object measured by the measurement unit, and an estimation unit configured to estimate whether a defect occurs inside the object, based on measurement information indicating a measurement result of the plurality of layers of the object measured by the measurement unit and the reference information.

Intraoral scanner with fixed focal position and/or motion tracking
11629954 · 2023-04-18 · ·

An apparatus for measuring a surface topography of a patient's teeth may include an optical probe, a light source configured to generate incident light, and focusing optics configured to focus one or more wavelengths of the incident light to a fixed focal position external to the optical probe, wherein the fixed focal position is fixed relative to the optical probe. The apparatus may further include a light sensor configured to measure a characteristic of returned light generated by illuminating the patient's teeth with the incident light and a processing unit operable to determine the surface topography of the patient's teeth based on the measured characteristic of the returned light.