Patent classifications
G01B11/303
SYSTEM, METHOD AND APPARATUS FOR DRYWALL JOINT DETECTION AND MEASUREMENT
A system for visually enhancing a surface. For example, the system may include an assembly that may be configured to project a laser line across at least a portion of the surface. Versions of the laser line may be projected at an angle of incidence relative to a plane defined by the surface. For example, the angle of incidence may be in a range of about 5 degrees to about 60 degrees. In one version, the laser line may be substantially perpendicular to a central axis of the surface. In addition, the laser line may enable enhanced, qualitative user visualization of the surface and non-planar distortion in the surface.
HIGH SPEED STEREOSCOPIC PAVEMENT SURFACE SCANNING SYSTEM AND METHOD
There is disclosed a mobile pavement surface scanning system and method, In an embodiment, the system comprises one or more stereoscopic image capturing devices synchronised with one or more light sources mounted on the platform for illuminating a pavement surface, mounted on a mobile survey platform that provides a trigger mechanism to capture sequential image pairs of the illuminated pavement surface and a movement sensor that continuously measures the movement of the platform and a synchronization signal for time or distance synchronized image capture with accurate GPS positioning. One or more computers process the synchronized images captured stamps the images with one or more of time and distance data, GPS location and calculated 3D elevation for each point on the pavement surface using stereoscopic principles, and assesses the quality of the pavement surface to determine the level of pavement surface deterioration.
SURFACE DEFECT DETECTION SYSTEM
An inspection system is provided for detecting defects on surfaces. The system uses a pattern with varying color or darkness which faces the surface. A light illuminates the pattern on the surface so that the pattern and any defects on the surface are reflected and captured for image analysis. The processor then separates the pattern from the image in order to identify the locations of any defects on the surface.
ROAD SURFACE PROPERTY ACQUIRING METHOD AND ROAD SURFACE PROPERTY ACQUIRING DEVICE
To rapidly and reliably measure a road surface property using measurement results and determination results of a road surface in the past. A vehicle mounted with a road surface property acquiring device is guided to a specified point on a road and measurement is carried out. The past road surface data on a past road surface property is acquired, a present position of the vehicle is acquired, and a past road surface property image representing a feature amount of the road surface property in a range including the present position created based on the past road surface data is displayed; and the vehicle is guided from the present position to a specified area while measuring a state of the road surface with the road surface property acquiring device.
METHODS AND SYSTEMS TO MEASURE PROPERTIES OF PRODUCTS ON A MOVING BLADE IN ELECTRONIC DEVICE MANUFACTURING MACHINES
Implementations disclosed describe an optical inspection device comprising a source of light to direct a light beam to a location on a surface of a wafer, the wafer being transported from a processing chamber, wherein the light beam is to generate, a reflected light, an optical sensor to collect a first data representative of a direction of the first reflected light, collect a second data representative of a plurality of values characterizing intensity of the reflected light at a corresponding one of a plurality of wavelengths, and a processing device, in communication with the optical sensor, to determine, using the first data, a position of the surface of the wafer; retrieve calibration data, and determine, using the position of the surface of the wafer, the second data, and the calibration data, a characteristic representative of a quality of the wafer.
Electronic gage apparatus
A gage apparatus includes a probe, a processor, and a memory. The probe includes a plurality of transmitters and a plurality of receivers both aligned in an axial direction along the probe. The processor is in electronic communication with the plurality of transmitters and the plurality of receivers. The memory is in electronic communication with the processor. The memory includes programming code for execution by the processor. The programming code is configured to determine a length of a structure disposed adjacent to the probe based on which of the plurality of receivers receive signals transmitted by the plurality of transmitters and reflected off the structure.
Estimating surface properties using a plenoptic camera
A plenoptic camera captures a plenoptic image of an object illuminated by a point source (preferably, collimated illumination). The plenoptic image is a sampling of the four-dimensional light field reflected from the object. The plenoptic image is made up of superpixels, each of which is made up of subpixels. Each superpixel captures light from a certain region of the object (i.e., a range of x,y spatial locations) and the subpixels within a superpixel capture light propagating within a certain range of directions (i.e., a range of u,v spatial directions). Accordingly, optical properties estimation, surface normal reconstruction, depth estimation, and three-dimensional rendering can be provided by processing only a single plenoptic image. In one approach, the plenoptic image is used to estimate the bidirectional reflectance distribution function (BRDF) of the object surface.
DEVICE AND METHOD FOR SURFACE PROFILOMETRY FOR THE CONTROL OF WAFERS DURING PROCESSING
A device or apparatus is provided for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath the first surface including (i) profilometry apparatus arranged in order to carry out measurements of shape on the first surface of the wafer according to at least one measurement field; (ii) imaging apparatus facing the profilometry apparatus and arranged in order to acquire a reference image of the structures on or through a second surface of the wafer opposite to the first surface according to at least one imaging field; the profilometry apparatus and said imaging apparatus being arranged so that the measurement and imaging fields are referenced in position within a common frame of reference.
A method is also provided to be implemented in this device or this apparatus.
Inspection robot having a laser profiler
A system includes an inspection robot having an input sensor comprising a laser profiler and a plurality of wheels structured to engage a curved portion of an inspection surface, wherein the laser profiler is configured to provide laser profiler data of the inspection surface; a controller, comprising: a profiler data circuit structured to interpret the laser profiler data; determine a feature of interest is present at a location of the inspection surface in response to the laser profiler data; and wherein the feature of interest comprises a shape description of the inspection surface at the location of the feature of interest.
Surface measurement apparatus
The invention discloses a technique that estimates micro roughness from a total sum of detection signals from plural detection systems and signal ratios, using a light scattering method. The technique rotates and translates a wafer at high speed to measure the entire surface of the wafer with high throughput. The relationship between the micro roughness and the intensity of scattered light varies according to a material of the wafer and a film thickness thereof. Moreover, calibration of an apparatus is also necessary. Thus, for instance, the invention provides a technique that has a function of correcting an optically acquired detection result using a sample which is substantially the same as a measurement target and makes the optically acquired detection result come close to a result measured by an apparatus, such as an AFM, using a different measurement principle.